DOE OSTI · 2430784
Visualizing and Quantifying Thermal Conductance and Strain at Compression Bonded GaN-Diamond Interfaces via Optical Methods
Abstract
The source did not provide an abstract. Follow the original record for more information.
Keep this discovery
Explore connections, maps & timelines
Yates, Luke, Delmas, William, Jarzembski, Amun, McDonald, Anthony E., Bahr, Matthew, Antiporda, Logan Michael, Rummel, Brian Douglas, Hodges, Wyatt Lea, Piontkowski, Zachary Tyler, Kaplar, Robert. 2023-06-01. Visualizing and Quantifying Thermal Conductance and Strain at Compression Bonded GaN-Diamond Interfaces via Optical Methods. https://doi.org/10.2172/2430784
Cite the original work for its findings. Save a collection to share your selection of sources.