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DOE OSTI · 2447368

PHASE 1 FINAL REPORT: Scalable Micron-Sized Flexible Interconnects Analysis

Abbaspour, Reza
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3D microelectronics, interconnection, NP detectors, pixelated silicon strip, electronic packaging, 3D integration, 3D printing, flexible interconnection73 NUCLEAR PHYSICS AND RADIATION PHYSICS

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Abbaspour, Reza. 2024-07-12. PHASE 1 FINAL REPORT: Scalable Micron-Sized Flexible Interconnects Analysis. https://www.osti.gov/biblio/2447368

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