Predicting Thermoset Resin Cure Kinetics for Composite Processing

Abstract

Predicting a material’s thermal properties is not only useful for designing parts but also for defining processing parameters. This is especially applicable to wet-filament winding operations and the production of composite parts using thermoset res ins. For these, the formation of cross-linking bonds is affected by time and temperature, but the degree of cross-linking can be modeled using phenomenological methods. In the current study, the Kissinger and Flynn/Wall/Ozawa methods were both used to calculate kinetic parameters and produced values that were in agreement with each other. The kinetic parameters activation energy ( E a ) and pre-exponential factor (𝐴) calculated from exothermic peak data increased between an epoxy and resole phenol resin system, with a cyanate ester having the highest. The successful application of both methods suggests applicability to future studies for developing cure recipes.