DOE OSTI · 2573342
An impermeable copper surface monolayer with high-temperature oxidation resistance
Abstract
Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and Fe at temperatures exceeding 200 °C. Inspired by the concept that oxygen (O) itself can effectively obstruct the pathway of O infiltration, this study proposes the immobilization of O on the metal surface. Through extensive calculations considering various elements (C, Al, Si, Ge, Ga, In, and Sn) to anchor O on Cu surfaces, Si emerges as the optimal element. The theoretical findings are validated through systematic sputtering deposition experiments. The introduction of anchoring elements to reinforce Cu–O bonds enables the formation of an atomically thin barrier on the Cu surface, rendering it impermeable to O even at high temperatures (400 °C) while preserving its intrinsic conductivity. This oxidation resistance, facilitated by the impermeable atomic monolayer, opens promising opportunities for researchers and industries to overcome limitations associated with the use of oxidizable metal films.
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Kim, Su Jae [Pusan National Univ., Busan (Korea, Republic of)] (ORCID:0000000260338551), Kim, Young-Hoon [Sungkyunkwan Univ., Suwon (Republic of Korea); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)] (ORCID:0000000173431512), Lamichhane, Bipin [Mississippi State Univ., Mississippi State, MS (United States)] (ORCID:000000029503083X), Regmi, Binod [Mississippi State Univ., Mississippi State, MS (United States)], Lee, Yousil [Copper Innovative Technology (CIT) Co., Busan (Korea, Republic of)], Yang, Sang-Hyeok [Sungkyunkwan Univ., Suwon (Republic of Korea)] (ORCID:0000000262877612), Kim, Seon Je [Sungkyunkwan Univ., Suwon (Republic of Korea)], Jung, Min-Hyoung [Sungkyunkwan Univ., Suwon (Republic of Korea)], Jang, Jae Hyuck [Korea Basic Science Institute (KBSI), Daejeon (Korea, Republic of)] (ORCID:0000000291333286), Jeong, Hu Young [Ulsan National Institute of Science and Technology (UNIST), Ulsan (Korea, Republic of)] (ORCID:0000000255505298), Chi, Miaofang [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)] (ORCID:0000000307641567), Seong, Maeng-Je [Chung-Ang Univ., Seoul (Korea, Republic of)] (ORCID:0000000251675919), Choi, Hak Soo [Massachusetts General Hospital, Boston, MA (United States); Harvard Medical School, Boston, MA (United States)] (ORCID:0000000279826483), Kim, Seong-Gon [Mississippi State Univ., Mississippi State, MS (United States)] (ORCID:0000000216290319), Kim, Young-Min [Sungkyunkwan Univ., Suwon (Republic of Korea); Institute for Basic Science (IBS), Suwon (Korea, Republic of)] (ORCID:0000000332209004), Jeong, Se-Young [Massachusetts General Hospital, Boston, MA (United States); Harvard Medical School, Boston, MA (United States); Korea Advanced Inst. Science and Technology (KAIST), Daejeon (Korea, Republic of); Pusan National Univ., Busan (Korea, Republic of)] (ORCID:0000000310194403). 2025-02-08. An impermeable copper surface monolayer with high-temperature oxidation resistance. https://doi.org/10.1038/s41467-025-56709-w
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