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DOE OSTI · 2585507

Optimizing Adhesion: Evaluating B-Stage Epoxy for Bonding [Poster]

Perez, Joseph Evan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000137855470)·Nash, Jordan Paige [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000947421017)·Hill, Preston J. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]·Hagen, Deborah Ann [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000168663327)·Ha, Quang (Alvin) Xuan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]
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Abstract

The application of increased pressure during the curing process of B-stage epoxy has been hypothesized to enhance the adhesive properties and bond strength in printed wiring board (PWB) assembly. This study aimed to investigate the correlation between pressure application and the performance of B-stage epoxy.

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Perez, Joseph Evan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000137855470), Nash, Jordan Paige [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000947421017), Hill, Preston J. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)], Hagen, Deborah Ann [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0000000168663327), Ha, Quang (Alvin) Xuan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)]. 2025-07-01. Optimizing Adhesion: Evaluating B-Stage Epoxy for Bonding [Poster]. https://doi.org/10.2172/2585507

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