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Fcc metals surface changes following adhesion using low energy electron diffraction /LEED/, relating intersurface metal transfer to applied adhesive force
Venus-Mercury flyby vehicle solar cells, cover glasses, adhesives and Kapton film, investigating space radiation effects on solar absorptance and transmittance
Adhesive materials of aliphatic polyester, linear hydroxyl end-capped polybutadienes, or SBS block copolymers are studied with the objective to replace conventional partially aromatic end-reactive polyester-isocyanate adhesives that have shown embrittlement
Aromatic diamines based on diphenyl sulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m prime-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m prime-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p prime-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m prime-methylene dianiline-cured epoxy appeared to be equivalent to the p,p prime-methylene dianiline-cured epoxy as judged by short beam shear tests.
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Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.
Although it is generally accepted that the use of adhesives in the assembly of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will insure that hybrid microcircuits assembled with them will meet the long use-life, high-reliability requirements of electronic equipment for space applications. This study was directed to the identification of the properties of electrically insulative adhesives that potentially could cause problems in such an application, and to the development of evaluation tests to quantify these properties and thus form the basis for establishing suitable guidelines and, ultimately, specifications. Bond strength, outgassing after cure, and corrosivity were selected for detailed attention since they are considered to be especially critical. Introductory discussion includes enumeration and brief comments on the properties of adhesives considered to be important for the proposed application, a general review of polymeric types of adhesives, and identification of the major types of adhesives commercially available and specifically designed for microelectronic use. The specific tests developed to evaluate bond strength, outgassing after cure, and corrosivity are discussed in detail, and comparative results obtained for selected adhesives representative of the major types are given.
The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.
The adhesion, friction, and micromechanical properties of ion-beam-deposited boron nitride (BN) films are reviewed. The BN films are examined in contact with BN metals and other harder materials. For simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. First, the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces are discussed. The effects of surface films, hardness of metals, and temperature on tribological response with respect to adhesion and friction are considered. The second part deals with the abrasion of the BN films. Elastic, plastic, and fracture behavior of the BN films in solid-state contact are discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of BN films deposited on substrates is also addressed.
Studies were conducted to develop a structural adhesive system possessing useful properties over a 20 to 589 K temperature range. Adhesive systems based on polyimide, polyphenylquinoxaline, polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock, and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.
An adhesive bonding process cycle study was performed for a polyimidesulfone (PISO2) recently developed as a promising structural adhesive. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are detailed. These include the tape preparation, the use of a primer, and press and simulated autoclave processing conditions. The polymer was characterized using Fourier Transform Infrared Spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The adhesive's strength determined by lap shear strength tests was used to evaluate the effects of the bonding process variations. Higher lap shear strengths were obtained at room temperature when a primer (PISO2) was used; however, the results were the same at 232 C (450 F) with or without a primer. The use of a vacuum (simulated autoclave cycle) during titanium bonding produced similar lap shear strengths to those specimens bonded without a vacuum.
Piezoelectric materials convert mechanical energy into electrical energy and electrical energy into mechanical energy. They generate electrical charges in response to mechanical stress and generate mechanical displacement and/or force when subjected to an electric current. Scientists at Langley Research Center have developed a piezoelectric device that is superior in many ways to those that used to be the only ones commercially available. It is tougher, has far greater displacement and greater mechanical load capacity for a comparative voltage operation, can be easily produced at a relatively low cost, and lends itself well to mass production. The NASA-developed piezoelectric device is also unique in that it is more efficient in extracting electrical energy from the mechanical energy that goes in. It works on a simple principle. A thin ceramic piezoelectric wafer is sandwiched between an aluminum sheet and a steel sheet and held together with LaRC-SI, an amorphous thermoplastic adhesive with special properties created by NASA at Langley. The sandwich is heated in an autoclave, and the adhesive melts. When the sandwich cools, the adhesive bonds the parts together into one piezoelectric element. While they cool, the components of the element contract at different rates, since they are made of different materials. This differential shrinkage causes the element to warp in either a convex or concave shape, depending on which way it is oriented. The shrinking of the outside metal layers places the inside piezoelectric ceramic under mechanical stress. If the element is cantilevered by clamping one side and then plucked, it reverberates like a diving board that has just ejected a diver. This way, a small amount of mechanical energy can result in a relatively long period of electrical generation. When the piezoelectric element is used for the creation of electricity, it is called Lightning. This same sandwiched piezoelectric wafer can also convert electrical energy into mechanical energy. Then, it is called Thunder. Electricity goes in, excites the element, and then, mechanical energy in the form of movement is generated.
An investigation of the effects of material and geometric variables on the response of U-shaped band-reinforced metallic lugs was performed. Variables studied were reinforcement, adhesive and metallic lug mechanical properties, hole diameter, reinforcement and adhesive thickness, and the distance from the hole s center to the end of the lug. Generally, U-shaped band reinforced lugs exhibited superior performance than non-reinforced lugs, that is higher load at the conventional lug design criteria of four percent hole elongation. Depending upon the reinforcement configuration the increase in load may be negligible to 15 or 20 percent. U-shaped band reinforcement increases lug load carrying capability primarily through two mechanisms; increasing the slope of the response curve after the initial knee and restraining overall deformation of the metallic portion of the lug facilitating increased yielding of metallic material between the hole and the edge of the metallic portion of the lug.
The synthesis of epoxy prepolymers containing phosphorus was carried out in such a manner as to provide adhesives containing at least 5 percent of this element. The purpose of this was to impart fire retardant properties to the adhesive. The two epoxy derivatives, bis(4-glycidyl-oxyphenyl)phenylphosphine oxide and bis(4-glycidyl-2-methoxyphenyl)phenylphosphonate, and a curing agent, bis(3-aminophenyl)methylphosphine oxide, were used in conjunction with one another and along with conventional epoxy resins and curing agents to bond Tedlar and Polyphenylethersulfone films to Kerimid-glass syntactic foam-filled honeycomb structures. Elevated temperatures are required to cure the epoxy resins with the phosphorus-contaning diamine; however, when Tedlar is being bonded, lower curing temperatures must be used to avoid shrinkage and the concomitant formation of surface defects. Thus, the phosphorus-containing aromatic amine curing agent cannot be used alone, although it is possible to use it in conjunction with an aliphatic amine which would allow lower cure temperatures to be used. The experimental epoxy resins have not provided adhesive bonds quite as strong as those provided by Epon 828 when compared in peel tests, but the differences are not very significant. It should be noted, if optimum properties are to be realized. In any case the fire retardant characteristics of the neat resin systems obtained are quite pronounced, since in most cases the self-extinguishing properties are evident almost instantly when specimens are removed from a flame.
Results are reported of an experimental study tracing the influence of externally applied shear stresses on the acoustic properties in the bondline region. The changes in the acoustic properties with a change in the temperature of the test samples are measured. The results of these tests are employed to evaluate the quality of the adhesive bonds. The dependence of time-of-flight on the temperature of plain steel and of steel adhesively bonded to rubber is illustrated in graphic form.
The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.
The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.
A LARC-13 type adhesive system was developed and property data obtained that demonstrated improved thermomechanical properties superior to base LARC-13 adhesive. An improved adhesive for 589 K (600 F) use was developed by physical or chemical modification of LARC-13. The adhesive was optimized for titanium and composite bonding, and a compatible surface preparation for titanium and composite substrates was identified. The data obtained with the improved adhesive system indicated it would meet the 589 K (600 F) properties desired for application on space shuttle components. Average titanium lap shear data were: (1) 21.1 MPa (3355 psi) at RT, (2) 13.0 MPa (1881 psi) at 600 F, and (3) 16.4 MPa (2335) after aging 125 hours at 600 F and tested at 600 F.