Search NASA⌕ Search

SEARCH · Search NASA

Results for “Adhesives”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS1977

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

The effects of composites as adherends was studied. Several other variables were studied by fractography: aluminum powder adhesive filler, fiber glass cloth scrim or adhesive carrier, new adhesives PPQ-413 and LARC-13, and strength-test temperature. When the new results were juxtaposed with previous work, it appeared that complex interactions between adhesive, adherend, bonding, and testing conditions govern the observed strength and fracture-surface features. The design parameters likely to have a significant effect upon strength-test results are listed.

Dwight, D. W.↗
NASA NTRS1977

Investigation of package sealing using organic adhesives

A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.

Perkins, K. L.↗
NASA NTRS1978

Acoustic emission analysis: A test method for metal joints bonded by adhesives

Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.

Brockmann, W.↗
NASA NTRS1980

Thermal stability and aging of some new anaerobic adhesives for structural binding

Polyurethane-modified high impact anaerobic adhesives have been chosen for a bonding application where impact cushion is critical. These adhesives meet all the requirements for high rate production and automatic assembly techniques. With aluminum adherends, one selected adhesive cured at room temperature with the recommended activator retained sixty percent of its original impact strength after twenty-six week aging at 100 C. The impact strength aging, the thermogravimetric analysis results, the outgassing data, and other observations made in this work indicate that the adhesives cured by simple heating give a more durable bond than that cured with an activator at room temperature.

Lee, S. Y.↗
NASA NTRS1981

Evaluation of non-specular reflecting silvered Teflon and filled adhesives

A non-specular silver-Teflon tape thermal control coating was tested to provide the data necessary to qualify it for use on the Space Shuttle Orbiter radiators. Effects of cure cycle temperature and pressure on optical and mechanical properties on the silver-Teflon tape were evaluated. The baseline Permacel P-223 adhesive, used with the specular silver-Teflon tape initially qualified for the Orbiter radiators, and four alternate metal-filled and unfilled adhesives were evaluated. Tests showed the cure process has no effect on the silver-Teflon optical properties, and that the baseline adhesive cure cycle gives best results. In addition the P-223 adhesive bond is more reproducible than the alternates, and the non-specular tape meets both the mechanical and the optical requirements of the Orbiter radiator coating specification. Existing Orbiter coating techniques were demonstrated to be effective in aplying the non-specular tape to a curved panel simulating the radiators. Author

Bourland, G.↗
NASA NTRS1981

Time-temperature effect in adhesively bonded joints

The viscoelastic analysis of an adhesively bonded lap joint was reconsidered. The adherends are approximated by essentially Reissner plates and the adhesive is linearly viscoelastic. The hereditary integrals are used to model the adhesive. A linear integral differential equations system for the shear and the tensile stress in the adhesive is applied. The equations have constant coefficients and are solved by using Laplace transforms. It is shown that if the temperature variation in time can be approximated by a piecewise constant function, then the method of Laplace transforms can be used to solve the problem. A numerical example is given for a single lap joint under various loading conditions.

Delale, F.↗
NASA NTRS1981

Addition polyimide adhesives containing ATBN and silicone elastomers

A study was conducted to determine the effects of added elastomers on the thermal stability, adhesive strength, and fracture toughness of LARC-13, a high-temperature addition polyimide adhesive. Various butadiene/acrylonitrile and silicon elastomers were incorporated into the polyimide resin either as physical polyblends, or by chemically reacting the elastomers with the polyimide backbone. Adhesive single lap-shear and T-peel strengths were measured before and after ageing at elevated temperature. A tapered double-cantilever beam specimen was used to determine the fracture toughness of the elastomer-modified polyimide adhesives.

Saint Clair, A. K.↗
NASA NTRS1980

Elastomer-toughened polyimide adhesives

A study has been conducted to determine the effects of added elastomers on the Tg, thermal stability, adhesive strength, and fracture toughness of LARC-13, a high-temperature addition polyimide adhesive. Various butadiene/acrylonitrile and silicone elastomers were incorporated into the polyimide resin (1) as physical polyblends, and (2) by chemically reacting the elastomers with the polyimide backbone. Adhesive single lap-shear and T-peel strengths were measured before and after aging at elevated temperature. A tapered double-cantilever beam specimen was used to determine the fracture toughness of the elastomer-modified polyimide adhesives.

Saint Clair, A. K.↗
NASA NTRS1981

Stresses in adhesively bonded joints - A closed-form solution

The general plane strain problem of adhesively bonded structures consisting of two different, orthotropic adherends is considered, under the assumption that adherend thicknesses are constant and small in relation to the lateral dimensions of the bonded region, so that they may be treated as plates. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form, with a single lap joint and a stiffened plate under various loading conditions being considered as examples. It is found that the plate theory used in the analysis not only predicts the correct trend for adhesive stresses but gives surprisingly accurate results, the solution being obtained by assuming linear stress-strain relations for the adhesive.

Delale, F.↗
NASA NTRS1982

Evaluation of high temperature structural adhesives for extended service

The evaluation, selection, and demonstration of structural adhesive systems for supersonic cruise research applications, and establishment of environmental durability of selected systems for up to 20,000 hours is described. Ten candidate adhesives were initially evaluated. During screening and evaluation, these candidates were narrowed to three of the most promising for environmental durability testing. The three adhesives were LARC-13, PPQ, and NR056X. The LARC-13 was eliminated because of a lack of stability at 505 K. The NRO56X was removed from the market. The LARC-TPI was added after preliminary evaluation and an abbreviated screening test. Only PPQ and LARC-TPI remained as the reasonable candidates late into the durability testing. Large area bond panels were fabricated to demonstrate the processibility of the selected systems. Specifications were prepared to assure control over critical material and process parameters. Surface characterization concentrated primarily upon titanium surface treatments of 10 volt chronic acid anodize, 5 volt chromic acid anodize and PASA-JELL. Failure analysis was conducted on lap shear adhesive bond failures which occurred in PPQ and LARC-13 test specimens after 10,000 hours at 505 K.

Hill, S. G.↗
NASA NTRS1981

Further developments in the design and analysis of adhesive-bonded structural joints

Previously developed computer programs for analyzing stepped-lap adhesive-bonded joints and doublers have been modified to permit the inclusion of variable adhesives as well as nonuniform adherends. The new version of the analysis program is described with reference to examples illustrating the effects of load redistribution around flaws and porosity. The loss of strength associated with pinched-off edges is illustrated, and the benefits of deliberately thickening the adhesive layer in the immediate vicinity of the ends of the overlap are demonstrated. The changes in shear load transfer due to softening of some of the adhesive by moisture absorption while the remainder either has never been soaked or has dried out locally are discussed.

Hart-Smith, L. J.↗
NASA NTRS1983

The development of aerospace polyimide adhesives

Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.

St.clair, A. K.↗
NASA NTRS1983

Viscoelastic study of an adhesively bonded joint

The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

Joseph, P. F.↗
NASA NTRS1984

Processing study of a polyimidesulfone adhesive

An adhesive bonding process cycle study was performed for a polyimidesulfone (PISO2) recently developed as a promising structural adhesive. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are detailed. These include the tape preparation, the use of a primer, and press and simulated autoclave processing conditions. The polymer was characterized using Fourier Transform Infrared Spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The adhesive's strength determined by lap shear strength tests was used to evaluate the effects of the bonding process variations. Higher lap shear strengths were obtained at room temperature when a primer (PISO2) was used; however, the results were the same at 232 C (450 F) with or without a primer. The use of a vacuum (simulated autoclave cycle) during titanium bonding produced similar lap shear strengths to those specimens bonded without a vacuum.

Progar, D. J.↗
NASA NTRS1981

Development of a qualification standard for adhesives used in hybrid microcircuits

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared.

Licari, J. J.↗
NASA NTRS1984

Rapid adhesive bonding concepts

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process is often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid adhesive bonding concepts were developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens are cut by a factor of 10 to 100 compared to standard press bonding. The development of rapid adhesive bonding for lap shear specimens (per ASTM D1003 and D3163), for aerospace panel bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric matrix composite structures are reviewed.

Stein, B. A.↗
NASA NTRS1984

The role of material properties in adhesion

When two solid surfaces are brought into contact strong adhesive bond forces can develop between the materials. The magnitude of the forces will depend upon the state of the surfaces, cleanliness and the fundamental properties of the two solids, both surface and bulk. Adhesion between solids is addressed from a theoretical consideration of the electronic nature of the surfaces and experimentally relating bond forces to the nature of the interface resulting from solid state contact. Surface properties correlated with adhesion include, atomic or molecular orientation, reconstruction and segregation as well as the chemistry of the surface specie. Where dissimilar solids are in contact the contribution of each is considered as is the role of their interactive chemistry on bond strength. Bulk properties examined include elastic and plastic behavior in the surficial regions, cohesive binding energies, crystal structure, crystallographic orientation and state. Materials examined with respect to interfacial adhesive interactions include metals, alloys, ceramics, polymers and diamond. They are reviewed both in single and polycrystalline form. The surfaces of the contacting solids are studied both in the atomic or molecularly clean state and in the presence of selected surface contaminants.

Buckley, D. H.↗
NASA NTRS1984

Hot melt adhesive attachment pad

A hot melt adhesive attachment pad for releasably securing distinct elements together is described which is particularly useful in the construction industry or a spatial vacuum environment. The attachment pad consists primarily of a cloth selectively impregnated with a charge of hot melt adhesive, a thermo-foil heater, and a thermo-cooler. These components are securely mounted in a mounting assembly. In operation, the operator activates the heating cycle transforming the hot melt adhesive to a substantially liquid state, positions the pad against the attachment surface, and activates the cooling cycle solidifying the adhesive and forming a strong, releasable bond.

Fox, R. L.↗