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Plasma spray of Nichrome matrix composite contains dispersed glass for oxidation protection and calcium fluoride for lubrication. Coatings can be applied to bearing journals and bearing bores. Coating was easily machinable and had excellent bond strength on substrate metal.
The initial results of a study directed to the task of selecting suitable evaluation tests which can form the basis for guidelines for electrically insulated adhesives are given. The properties of adhesives considered to be of major importance for the proposed application are enumerated, with brief comments. Specific tests to determine the chemical and electrolytic corrosivity of adhesives to commonly used metallization systems, their long-term outgassing after cure, and their bond strengths under a variety of conditions are defined and discussed in detail.
Review of a development program for nondestructive tests applicable to hardware with electroformed nickel bonds. The four steps of the program include the selection of some most promising nondestructive evaluation methods out of existing methods, the fabrication of test panels for simulation of cooled thrust chamber walls with bonds of various integrities, the evaluation of the test panels by personnel without previous knowledge of the planned bond integrity, and the verification of actual bond strength in the test panels by destructive tests. Ultrasonics, acoustic emission and holography are evaluated in nondestructive testing applications.
High bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no significant loss in thermo-oxidative stability of the adhesive resin.
Techniques and materials were developed and evaluated for the fabrication and coating of advanced, long life, regeneratively cooled thrust chambers. Materials were analyzed as fillers for sputter application of OFHC copper as a closeout layer to channeled inner structures; of the materials evaluated, aluminum was found to provide the highest bond strength and to be the most desirable for chamber fabrication. The structures and properties were investigated of thick sputtered OFHC copper, 0.15 Zr-Cu, Al2O3,-Cu, and SiC-Cu. Layered structures of OFHC copper and 0.15 Zr-Cu were investigated as means of improving chamber inner wall fatigue life. The evaluation of sputtered Ti-5Al-2.5Sn, NASA IIb-11, aluminum and Al2O3-Al alloys as high strength chamber outer jackets was performed. Techniques for refurbishing degraded thrust chambers with OFHC copper and coating thrust chambers with protective ZrO2 and graded ZrO2-copper thermal barrier coatings were developed.
The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail.
An analytical model of a blister type specimen for evaluating adhesive bond strength was developed. Plate theory with shear deformation was used to model the deformation of the plate, and elastic deformation of the adhesive layer is taken into account. It is shown that the inclusion of the elastic deformation of the adhesive layer can have a significant influence in the energy balance calculations of fracture mechanics.
An experimental program was conducted to evaluate various thermal insulation concepts for use in the Outer Planets Probe (OPP) during entry and descent into the atmospheres of Jupiter, Saturn, and Uranus. Phenolic fiberglass honeycomb specimens representative of the OPP structure were packed and tested with various fillers: Thermal conductivity measurements were made over a temperature range of 300 K to 483 K and pressures from vacuum up to 10 atmospheres in helium and nitrogen gas environments. The conductivity results could not be fully explained so new test specimens were designed with improved venting characteristics, and tested to determine the validity of the original data. All of the conductivity data showed results that were substantially higher than expected. The original test data in helium were lower than the data from the redesigned specimens, probably due to inadequate venting of nitrogen gas from the original specimens. The thermal conductivity test results show only a marginal improvement in probe thermal protection performance for a filled honeycomb core compared to an unfilled core. In addition, flatwise tension tests showed a severe bond strength degradation due to the inclusion of either the powder or foam fillers. In view of these results, it is recommended that the baseline OPP design utilize an unfilled core.
Procedures for closing out coolant passages in regeneratively cooled thrust chambers by triode sputtering, using post and hollow Cu-0.15 percent Zr cathodes are described. The effects of aluminum composite filler materials, substrate preparation, sputter cleaning, substrate bias current density and system geometry on closeout layer bond strength and structure are evaluated. High strength closeout layers were sputtered over aluminum fillers. The tensile strength and microstructure of continuously sputtered Cu-0.15 percent Zr deposits were determined. These continuous sputtered deposits were as thick as 0.75 cm. Tensile strengths were consistently twice as great as the strength of the material in wrought form.
The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed.
A polyurethane resin with paste activator, capable of providing useful bond strengths over the temperature range of -184 C to 149 C, is described. The adhesive system has a pot life of over one hour. Tensile shear strength ratings are given for various adhesive formulations.
The decomposition and corrosion of two-phase heat transfer liquids and metal envelopes have been investigated on the basis of molecular, bond strengths and chemical thermodynamics. Potentially stable heat transfer fluids for the temperature range 100 to 350 C have been identified, and reflux heat pipe tests initiated with 10 fluids and carbon steel and aluminum envelopes to experimentally establish corrosion behavior and noncondensable gas generation rates.
The decomposition and corrosion of two-phase heat transfer liquids and metal envelopes have been investigated on the basis of molecular bond strengths and chemical thermodynamics. Potentially stable heat transfer fluids for the temperature range 100 C to 350 C have been identified, and reflux heat pipes tests initiated with 10 fluids and carbon steel and aluminum envelopes to experimentally establish corrosion behavior and noncondensable gas generation rates.
The feasibility of producing stainless steel clad carbon steel tubing by a gas pressure bonding process was evaluated. Such a tube product could provide substantial chromium savings over monolithic stainless tubing in the event of a serious chromium shortage. The process consists of the initial assembly of three component tubesets from conventionally produced tubing, the formation of a strong metallurgical bond between the three components by gas pressure bonding, and conventional cold draw and anneal processing to final size. The quality of the tubes produced was excellent from the standpoint of bond strength, mechanical, and forming properties. The only significant quality problem encountered was carburization of the stainless clad by the carbon steel core which can be overcome by further refinement through at least three different approaches. The estimated cost of clad tubing produced by this process is greater than that for monolithic stainless tubing, but not so high as to make the process impractical as a chromium conservation method.
A polyimide precursor adhesive solution, code-named NR-056X, was developed. It reproducibly gives low void, high strength bond lines at both room temperature and 589K (600 F) using either titanium or graphite/polyimide composite adherends having 12.7 mm (1/2 in.) overlaps. Lap shear samples prepared using this adhesive and composite adherends based on graphite/NR-150B2 were shown to have a high degree of resistance to such adverse environments as air at 589K (600 F), high humidity, methyl ethyl ketone and jet fuel. Bond line toughness was illustrated by the complete resistance to cracking in the wedge-crack propagation test. The available evidence indicates that wide area composite to composite or composite to metal bonding should be feasible.
Three encapsulation designs for silicon photovoltaic arrays based on cells with silk-screened Ag metallization have been evaluated: transparent polymeric coatings over cells laminated between two films or sheets of polymeric materials; cells adhesively bonded to a glass cover with a polymer pottant and a glass or other substrate component. Silicone and acrylic coatings were assessed, together with acrylic sheet, 0.635 mm fiberglass-reinforced polyester sheet, 0.102 mm polycarbonate/acrylic dual-layer film, 0.127 mm fluorocarbon film, soda-lime glass, borosilicate glass, low-iron glass, and several adhesives. The encapsulation materials were characterized by light transmittance measurements, determination of moisture barrier properties and bond strengths, and by the performance of cells before and after encapsulation. Silicon and acrylic coatings provided inadequate protection. Acrylic and fluorocarbon films displayed good weatherability and acceptable optical transmittance. Borosilicate, low-iron and soda-lime-float glasses were found to be acceptable candidate encapsulants for most environments.
Application of colloidal silica more than doubles bond strength of ceramic tile/substrate attachments. "Densification" process strengthens surface where tile attaches to felt strain-isolator pad, redistributing stresses and preventing failures at that point. First, isopropyl alcohol is applied to bottom tile surface. Second, aqueous mixture of cementing colloidal silica and reinforcing ball-milled silica particles is painted on tile. Finally, after drying, tile is rewaterproofed by exposure to vapors or methyltrimethoxysilane and acetic acid.
T300/5209 and T300/5208 graphite epoxy laminates were studied experimentally and analytically in order to: (1) determine the coupling between applied stress, internal residual stress, and moisture sorption kinetics; (2) examine the microscopic damage mechanisms due to hygrothermal cycling; (3) evaluate the effect of absorbed moisture and hygrothermal cycling on inplane shear response; (4) determine the permanent loss of interfacial bond strength after moisture absorption and drying; and (5) evaluate the three dimensional stress state in laminates under a combination of hygroscopic, thermal, and mechanical loads. Specimens were conditioned to equilibrium moisture content under steady exposure to 55% or 95% RH at 70 C or 93 C. Some specimens were tested subsequent to moisture conditioning and 100 cycles between -54 C and either 70 C or 93 C.