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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Nondestructive evaluation of Shuttle Columbia tiles

The NDE of Orbiter Vehicle-102 tile bonds, performed in August 1991, is described. The evaluation was carried out in order to help NASA develop fast, reliable methods to diagnose problems in tile bonding other than the present 'pull' and 'wiggle' tests. The NDE did not find any indication of bond problems, and all bonds were classified as 'nominal'. The feasibility of using NDE techniques in a dynamic, real-world environment without interfering with Shuttle rework schedules is shown. The data will be useful in verifying analytical models of tile behavior developed at the University of Central Florida. The need for a tile test bed containing known tile misbonds is suggested.

Davis, Richard M.↗
NASA NTRS1972

Investigation of mounting discrete chip components for hybrid microelectronic applications.

In the assembly of hybrid microcircuits, passive and active discrete chip components are attached by epoxy cements and by solders. This study was initiated to determine the integrity of such attachments. Alumina substrates were subjected to a group of thermal and mechanical test environments defined by test methods in MIL-STD-883. Lot samples of substrates with assembly variations were subjected to separately applied testing and to serial testing. These test methods were applied sequentially to the same lot of substrates. Epoxy cements were generally satisfactory with respect to separate tests, although sequential tests severely degraded epoxy bond strengths of all types. Bond strengths to unglazed substrates were slightly superior to those of the same components on glazed types. Solder joints were vulnerable to catastrophic failure in several environments, especially temperature cycling and thermal shock. Vibration and impact shock also produced solder joint failures.

Caruso, S. V.↗
NASA NTRS1994

Analysis of space environment damage to solar cell assemblies from LDEF experiment A0171-GSFC test plate

The results of the postflight analysis of the solar cell assemblies from the LDEF (Long Duration Exposure facility) experiment A0171 is provided in this NASA sponsored research project. The following data on this research are provided as follows: (1) solar cell description, including, substrate composition and thickness, crystal orientation, anti-reflective coating composition and thickness; (2) preflight characteristics of the solar cell assemblies with respect to current and voltage; and (3) post-flight characteristics of the solar cell assemblies with respect to voltage and current. These solar cell assemblies are part of the Goddard Space Flight Center test plate which was designed to test the space environment effects (radiation, atomic oxygen, thermal cycling, meteoroid and debris) on conductively coated solar cell coversheets, various electrical bond materials, solar cell performance, and other material properties where feasible.

Hill, David C.↗
NASA NTRS2001

MIR Solar Array Return Experiment: Power Performance Measurements and Molecular Contamination Analysis Results

A solar array segment was recently removed from the Mir core module and returned for ground-based analysis. The segment, which is similar to the ones the Russians have provided for the FGB and Service Modules, was microscopically examined and disassembled by US and Russian science teams. Laboratory analyses have shown the segment to he heavily contaminated by an organic silicone coating, which was converted to an organic silicate film by reactions with atomic oxygen within the. orbital flight environment. The source of the contaminant was a silicone polymer used by the Russians as an adhesive and bonding agent during segment construction. During its life cycle, the array experienced a reduction in power performance from approx. 12%, when it was new and first deployed, to approx. 5%, when it was taken out of service. However, current-voltage measurements of three contaminated cells and three pristine, Russian standard cells have shown that very little degradation in solar array performance was due to the silicate contaminants on the solar cell surfaces. The primary sources of performance degradation is attributed to "thermal hot-spotting" or electrical arcing; orbital debris and micrometeoroid impacts; and possibly to the degradation of the solar cells and interconnects caused by radiation damage from high energy protons and electrons.

Visentine, James↗
NASA NTRS1997

Single-Tow Minicomposite Test Used to Determine the Stressed-Oxidation Durability of SiC/SiC Composites

SiC-fiber-reinforced SiC-matrix composites are considered future materials for high temperature (less than 1200 C), air-breathing applications. For these materials to be successful, they must be able to maintain desirable mechanical properties at high temperatures while existing in highly corrosive environments. The critical constituent of a ceramic matrix composite is a thin interphase layer between the fiber and matrix which enables matrix cracks to deflect around the fibers, that is, to perform even when damaged. Unfortunately, the only interphase materials (to date) that offer the desired properties are carbon and boron nitride. Both of these materials react with oxidizing environments to form gaseous or liquid oxidation products that can lead to fiber-strength degradation or strong bonding between the fiber and the matrix at temperatures above approx. 600 C.

Morscher, Gregory N.↗
NASA NTRS2006

Testing of a 10-meter Quadrant Solar Sail

The purpose of this paper is to address the technical challenges and requirements of modal testing a solar sail system (Fig. 1). Specific objectives of this work are to investigate the effectiveness (i.e. accuracy, precision, repeatability, etc.) of laser vibrometer measurements obtained on solar sail components (i.e. sail membrane quadrant and masts) actuated with various excitation methods in vacuum conditions. Results from this work will be used to determine the appropriate test technique for testing large scale full quadrant flight-like solar sail system hardware in vacuum conditions. This paper will focus on the dynamic tests conducted in-vacuum on a 10-meter solar sail quadrant development by AEC-ABLE as part of a ground demonstrator system development program funded by NASA's In-Space Propulsion program. One triangular shaped quadrant of a solar sail membrane (Fig. 2) was modal tested in a 1 Torr vacuum environment using various excitation techniques including, shaker excitation through the masts, magnetic excitation (Ref. 3), and surface-bonded piezoelectric patch actuators (Ref. 4 & 5). The excitation methods are evaluated for their applicability to in-vacuum ground testing and their traceability to the development of on-orbit flight test techniques. The solar sail masts (Fig. 3) were also tested in ambient atmospheric conditions and vacuum using various excitation techniques and these methods will also be assessed for their ground test capabilities and traceability to on-orbit flight testing.

Gaspar, James L.↗
NASA NTRSDate not supplied

High-Temperature Slurry Environmental Barrier Coating With Graded HfO 2 -HfSiO 4 Topcoat

Environmental barrier coatings (EBCs) have enabled the use of silicon carbide (SiC)-based ceramic matrix composites (CMCs) in gas turbine engines by protecting the underlying CMC from corrosive combustion species. Current-generation EBCs consist of a rare earth silicate topcoat and a silicon bond coat. The relatively low melting point of the silicon bond coat (1414°C) limits the upper use temperature of these coatings. To protect SiC-based CMCs at temperatures beyond that achievable by the current state-of-the-art, an oxide-based bond coat capable of withstanding temperatures of up to 1482°C has been developed at NASA Glenn Research Center. Hafnia (HfO2) is a promising EBC topcoat material due to its stability in high-temperature steam; however, its coefficient of thermal expansion (CTE) is highly anisotropic and much larger than that of SiC. In this study, a graded HfO2-HfSiO4 topcoat was deposited via a slurry process on the NASA-developed oxide-based bond coat. The oxidation resistance of this EBC system was evaluated at 1482°C in a steam cycling environment. The durability and stability of this slurry-deposited HfO2-HfSiO4 topcoat was compared to that of HfO2 deposited by plasma spray physical vapor deposition (PS-PVD).

EBC↗
NASA NTRS1999

Paramagnetic Liquid Bridge in a Gravity-Compensating Magnetic Field

Magnetic levitation was used to stabilize cylindrical columns of a paramagnetic liquid in air between two solid supports. The maximum achievable length to diameter ratio R(sub max) was approx. (3.10 +/- 0.07), very close to the Rayleigh-Plateau limit of pi. For smaller R, the stability of the column was measured as a function of the Bond number, which could be continuously varied by adjusting the strength of the magnetic field. Liquid bridges supported by two solid surfaces have been attracting scientific attention since the time of Rayleigh and Plateau. For a cylindrical bridge of length L and diameter d, it was shown theoretically that in zero gravity the maximum slenderness ratio R (identically = L/d) is pi. The stability and ultimate collapse of such bridges is of interest because of their importance in a number of industrial processes and their potential for low gravity applications. In the presence of gravity, however, the cylindrical shape of an axisymmetric bridge tends to deform, limiting its stability and decreasing the maximum achievable value of R. Theoretical studies have discussed the stability and possible shapes of axisymmetric bridges. Experiments typically are performed in either a Plateau tank, in which the bridge is surrounded by a density-matched immiscible fluid, or in a space-borne microgravity environment. It has been shown, for example, that the stability limit R can be pushed beyond pi by using flow stabilization, by acoustic radiation pressure, or by forming columns in the presence of an axial electric field. In this work, magnetic levitation was used to simulate a low gravity environment and create quasi-cylindrical liquid columns in air. Use of a magnetic field permits us to continuously vary the Bond number B identically equal to (g)(rho)d(exp 2)/4(sigma), where g is the gravitational acceleration, rho is the density of the liquid, and sigma is the surface tension of the liquid in air. The dimensionless Bond number represents the relative importance of external forces acting on the liquid column to those due to surface tension. Our central result is that in a large magnetic field gradient we could create and stabilize columns of mixtures of water and paramagnetic manganese chloride tetrahydrate (MnCl2.4H2O), achieving a length to diameter ratio very close to pi.

Mahajan, Milind P.↗
NASA NTRS1991

Apparatus For Chemically Treating Graphite Fibers

New apparatus for chemical treatment of graphite-fiber tow developed. Applies chemical solutions to commercially purchased unsized fibers or in-house-made fibers, to improve following: handling of fibers, interface bonding of fiber to resin matrix during prepreg fabrication, and interface bonding in laminates during molding process. Designed for research and development, with predrying and post-drying in inert environments. Easily adaptable to different chemical solutions and well suited for small-scale, prototype, tailor-made fiber systems. Used to develop fiber/resin composites for aerospace, automotive, marine, and other applications.

Stanfield, Clarence E.↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS1999

Thermal/environmental barrier coating system for silicon-based materials

A coating system for a substrate containing a silicon-based material, such as silicon carbide-containing ceramic matrix materials containing silicon carbide and used to form articles exposed to high temperatures, including the hostile thermal environment of a gas turbine engine. The coating system includes a layer of barium strontium aluminosilicate (BSAS) as a bond coat for a thermal-insulating top coat. As a bond coat, the BSAS layer serves to adhere the top coat to a SiC-containing substrate. The BSAS bond coat exhibits sufficient environmental resistance such that, if the top coat should spall, the BSAS bond coat continues to provide a level of environmental protection to the underlying SiC-containing substrate.

Spitsberg, Irene T.↗
NASA NTRSDate not supplied

Macro-scale Testing and Micromechanics Modeling of Fracture Behaviors for Boron Carbide Composites with Hierarchical Microstructures

With a unique combination of properties including high hardness, low density, wear and corrosion resistance, thermal stability, high neutron absorption, and semi-conductivity, boron carbide (B4C) is a candidate material for various engineering applications that involve extreme environment. The current applications of boron carbide, however, are limited by its intrinsic brittleness due to its strong covalent bonding. To toughen boron carbide, in this work hierarchical microstructure designs was used to provide multiple toughening mechanisms including crack deflection/bridging, micro-crack toughening, etc. Using field assisted sintering, B4C composites with hierarchical microstructure features including graphite platelets, micron and sub-micron sized TiB2 reinforcements were fabricated. The fracture toughness of fabricated B4C composites were previously measured at micro-scale using micro-indentation followed by post-testing microstructure inspection. However, questions including whether the fracture toughness enhancement measured at micro-scale can translate to macro-scale mechanical properties, and what are the fundamental mechanisms behind observed fracture toughness enhancement, remain to be answered. In this study, the fabricated B4C composites were tested using standardized four-point bending method to obtain fracture toughness at macro-scale. In addition, micromechanics modeling was conducted using MAC/GMC code and crack-band model to study the effect of residual stress and weak interphases on fracture behaviors of B4C composites reinforced with TiB2 particles. Through standardized four-point bending tests, fracture toughness enhancements up to 2.85, 3.32, and 3.65 MPa∙m(exp 1/2) (from 2.38 MPa∙m(exp 1/2)) were achieved for B4C composites with graphite platelets addition (micro/nano B4C), with TiB2 formation (micro B4C-TiB2), and with both graphite and TiB2 addition (micro/nano B4C-TiB2) respectively. Micromechanics modeling indicated that introduction of thermal residual stress and weak interphases caused enhanced micro-cracking behavior and resulted in the observed fracture toughness enhancement. These results furthered understanding about the mechanical behaviors at macro-scale and the mechanisms behind observed fracture toughness enhancement for B4C composites with hierarchical microstructures and can provide reference data for the future design of B4C composites with optimized microstructures for further fracture toughness enhancement.

Boron Carbide↗
NASA NTRS1968

Predicted vibration responses of Apollo structure and effects of pressure correlation lengths on response

Progressive wove and reverberant acoustic fields ore often used in the laboratory for qualification testing of aerospace structures that are subjected to unsteady aerodynamic environments which occur during flight through the atmosphere. Acoustic simulation of these in-flight environments i s achieved i f the structural vibration response to acoustic excitation is equivalent, over the frequency range of interest, to the response caused by aerodynamic turbulence. To determine the degree of response simulation that could be expected for such qualification testing of the Apollo Spacecraft, responses of a segment of the Apollo structure were estimated theoretically for both acoustic and flight environments. The vibration analysis presented in this report was performed for the Spacecraft Lunar Module Adaptor; and the three environments treated are turbulence at Mach 1 and Mach 2, a reverberant acoustic field, and a modified acoustic progressive wave field. The progressive wave field is assumed to be generated within a specially designed shroud of sixteen axially oriented ducts which is constructed around and contoured to the external skin of the vehicle. Each duct is open on the side adjacent to the skin and is driven acoustically at one end by an independent noise source, thus allowing for different pressure correlation patterns around the circumference of the vehicle. The purpose of the analysis was to determine the effects of surface pressure correlation lengths on the response characteristics of representative Apollo structure, and to select on this basis, the optimum acoustic environment for structural vibration qualification tests of the Apollo in the Spacecraft Acoustic Laboratory at MSC. The method of analysis employed consists of determining, independently, the space average, mean-square acceleration spectral density for each of the significant modes of vibration of an equivalent cylindrical shell, and then expressing the total structural response as a linear summation of these modal responses. Approximately 570 classical modes of a pinned-end cylinder were used in order to find the spectral response characteristics of the structure throughout the frequency range of 10 - 1,000 Hz. The effective forcing functions or joint acceptances of the various modes of vibration were computed and are presented graphically for each of the pressure excitation environments. A brief development of the response equations used is presented in the report. Space average acceleration response spectra were computed for twelve different cases including aerodynamic turbulence at Mach 1 and Mach 2, reverberant acoustic field, five duct correlation patterns, two cases of an axially damped progressive wave field, and two cases in which the structural damping constant was varied from the expected value. The response spectra were computed and plotted by a high speed digital computer far a flat excitation pressure spectrum; and the response spectra were numerically integrated to give one-third octave bond average responses. A complete set of digital computer programs has been developed for both flat plate and cylindrical shell structures for the above environments, and each requires run times of three minutes or less. Thus, the work presented herein, along with the results, constitutes a practical advancement to the existing state-of-the-art of vibration prediction.

R W White↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗
NASA NTRS2003

Development of Displacement Gages Exposed to Solid Rocket Motor Internal Environments

The Space Shuttle Reusable Solid Rocket Motor (RSRM) has three non-vented segment-to-segment case field joints. These joints use an interference fit J-joint that is bonded at assembly with a Pressure Sensitive Adhesive (PSA) inboard of redundant O-ring seals. Full-scale motor and sub-scale test article experience has shown that the ability to preclude gas leakage past the J-joint is a function of PSA type, joint moisture from pre-assembly humidity exposure, and the magnitude of joint displacement during motor operation. To more accurately determine the axial displacements at the J-joints, two thermally durable displacement gages (one mechanical and one electrical) were designed and developed. The mechanical displacement gage concept was generated first as a non-electrical, self-contained gage to capture the maximum magnitude of the J-joint motion. When it became feasible, the electrical displacement gage concept was generated second as a real-time linear displacement gage. Both of these gages were refined in development testing that included hot internal solid rocket motor environments and simulated vibration environments. As a result of this gage development effort, joint motions have been measured in static fired RSRM J-joints where intentional venting was produced (Flight Support Motor #8, FSM-8) and nominal non-vented behavior occurred (FSM-9 and FSM-10). This data gives new insight into the nominal characteristics of the three case J-joint positions (forward, center and aft) and characteristics of some case J-joints that became vented during motor operation. The data supports previous structural model predictions. These gages will also be useful in evaluating J-joint motion differences in a five-segment Space Shuttle solid rocket motor.

Bolton, D. E.↗
NASA NTRS1979

Development and demonstration of manufacturing processes for fabricating graphite/PMR-15 polyimide structural elements

The processing requirements for graphite/PMR-15 polyimide composites developed to demonstrate the structural integrity of polyimide composite structural elements at temperatures up to 589K (600 F) are described. Major tasks included: quality assurance development; materials and process development; specification verification; flat panel fabrication; stiffened panel fabrication; honeycomb panel fabrication; chopped fiber moldings; and demonstration component fabrication. Materials, processing, and quality assurance documents were prepared from experimentally derived data. Structural elements consisting of flat panels, corrugated stiffeners, I-beams, hat stiffeners, honeycomb panels, and chopped fiber moldings were made and tested. Property data from 219K (-65 F) to 589K (600 F) were obtained. All elements were made in a production environment. The size of each element was sufficient to insure production capability and structural component applicability. Problems associated with adhesive bonding, laminate and structural element analysis, material variability, and test methods were addressed.

Sheppard, C. H.↗