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Bubble formation and layering, which often plague vacuum-evaporated films, are prevented by properly regulating process parameters. Vacuum casting may be applicable to forming thick films of other polymer/solvent solutions.
The influence of the silver content and the oxygen partial pressure on the solidus temperature and the weight loss during melting of Bi2Sr2Ca1Cu2O(x) has been examined by means of DTA and TGA. By decreasing the oxygen partial pressure the solidus is lowered (e.g. del T = 59 C by decreasing pO2 from 1 atm to 0.001 atm) and the weight loss is increased. The addition of silver causes two effects: (1) the solidus is further decreased (e.g. 2 wt% Ag lower T (solidus) by up to 25 C, depending on the oxygen partial pressure); and (2) the weight loss during melting is reduced. Thick films (10-20 micron in thickness) with 0 and 5 wt% silver and bulk samples with) and 2.7 wt% silver were melt processed in flowing oxygen on a silver substrate in the DTA, allowing the observation of the melting process and a good temperature control. The critical current densities are vigorously dependent on the maximum processing temperature. The highest j(sub c) in thick films (8000 A/sq cm at 77 K, O T) was reached by melting 7 C above the solidus temperature. The silver addition shows no significant effect on the processing parameters or the superconducting properties. The highest j(sub c) for bulk samples (1 mm in thickness) was obtained by partial melting at 900 C or 880 C, depending on the silver content of the powder (0 or 2.7 wt%). The j(sub c) of the samples is slightly enhanced from 1800 A/sq cm (at 77 K, O T) to 2000 A/sq cm by the silver addition. To be able to reach at least 80% of the maximum critical current density, the temperature has to be controlled in a window of 5 C for thick films and 17 C for bulk samples.
A general overview of gravity effects in condensing and evaporating films is presented. The topics include: 1) Research Overview; 2) NASA Recognizes Critical Need for Condensation & Evaporation Research to Enable Human Exploration of Space; 3) Condensation and Evaporation Research in Reduced Gravity is Enabling for AHST Technology Needs; 4) Differing Role of Surface Tension on Condensing/Evaporating Film Stability; 5) Fluid Mechanisms in Condensing and Evaporating Films in Reduced Gravity; 6) Research Plan; 7) Experimental Configurations for Condensing Films; 8) Laboratory Condensation Test Cell; 9) Aircraft Experiment; 10) Condensation Study Current Test Conditions; 11) Diagnostics; 12) Shadowgraph Images of Condensing n- pentane Film in Unstable (-1g) Configuration; 13) Condensing n-Pentane Film in Normal Gravity (-1g) at Constant Pressure; 14) Condensing n-Pentane Film in Normal Gravity (-1g) with Cyclic Pressure; 15) Non-condensing Pumped Film in Normal Gravity (-1g); 16) Heat Transfer Coefficient in Developing, Unstable Condensing Film in Normal Gravity; 17) Heat Transfer for Unsteady Condensing Film (-1g); 18) Ultrasound Measurement of Film Thickness N-pentane Film, Stable (+1g) Configuration; and 19) Ultrasound Measurement of Film Thickness N-pentane Film, Unstable (-1g) Configuration.
A procedure for the numerical solution of the complete, isothermal, elastohydrodynamic lubrication problem for point contacts is given. This procedure calls for the simultaneous solution of the elasticity and Reynolds equations. By using this theory the influence of the ellipticity parameter and the dimensionless speed, load, and material parameters on the minimum and central film thicknesses was investigated. Thirty-four different cases were used in obtaining the fully flooded minimum- and central-film-thickness formulas. Lubricant starvation was also studied. From the results it was possible to express the minimum film thickness for a starved condition in terms of the minimum film thickness for a fully flooded condition, the speed parameter, and the inlet distance. Fifteen additional cases plus three fully flooded cases were used in obtaining this formula. Contour plots of pressure and film thickness in and around the contact have been presented for both fully flooded and starved lubrication conditions.
The influence of lubricant starvation on minimum film thickness was investigated by moving the inlet boundary closer to the contact center. The following expression was derived for the dimensionless inlet distance at the boundary between the fully flooded and starved conditions: m* = 1 + 3.06 ((R/b)(R/b)H) to the power 0.58, where R is the effective radius of curvature, b is the semiminor axis of the contact ellipse, and H is the central film thickness for fully flooded conditions. A corresponding expression was also given based on the minimum film thickness for fully flooded conditions. Therefore, for m m*, starvation occurs and, for m m*, a fully flooded condition exists. Two other expressions were also derived for the central and minimum film thicknesses for a starved condition. Contour plots of the pressure and the film thickness in and around the contact are shown for the fully flooded and starved lubricating conditions, from which the film thickness was observed to decrease substantially as starvation increases.
A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.
A capacitance technique was used to monitor the film thickness separating two steel balls of a unique tribometer while subjecting the ball-ball contact to highly stressed, zero entrainment velocity (ZEV) conditions. All tests were performed under a N2 purge (R.H. < 1.0%) and utilized 52100 steel balls (R(sub a) = 0.02 mm). Tribometer operations and capacitance-to-film-thickness accuracy were verified by comparing the film thickness approximations to established theoretical predictions for test conditions involving pure rolling. Pure rolling experiments were performed under maximum contact stresses and entrainment velocities of 1.0 GPa and 1.0 m/s to 3.0 m/s, respectively. All data from these baseline tests conformed to theory. ZEV tests were initiated after calibration of the tribometer and verification of film thickness approximation accuracy. Maximum contact stresses up to 0.57 GPa were supported at zero entrainment velocity with sliding speeds from 6.0 to 10.0 m/s for sustained amounts of time up to 28.8 minutes. The protective lubricating film separating the specimens at ZEV had a thickness between 0.10 and 0.14 mm (4 to 6 min), which corresponds to an approximate L-value of 4. The film thickness did not have a strong dependence upon variations of load or speed. Decreasing the sliding speed from 10.0 m/s to 1 m/s revealed a rapid loss in load support between 3.0 and 1.0 m/s. The formation of an immobile film formed by lubricant entrapment is discussed as an explanation of the load carrying capacity at these zero entrainment velocity conditions, relevant to the ball-ball contact application in retainerless ball bearings.
Microstrip transmission lines in the form of ring resonators were fabricated from a number of in-situ grown laser ablated films and post-annealed co-sputtered YBa2Cu3O(7-x) films. The properties of these resonators were measured at 35 GHz and the observed performance is examined in light of the critical temperature (Tc) and film thickness and also the film morphology which is different for the two deposition techniques. It is found that Tc is a major indicator of the film performance for each growth type with film thickness becoming important as it decreases towards 100 A. It is also found that the films with a mixed grain orientation (both a axis and c axis oriented grains) have poorer microwave properties as compared with the primarily c axis oriented material. This is probably due to the significant number of grain boundaries between the different crystallites, which may act as superconducting weak links and contribute to the surface resistance.
Microstrip transmission lines in the form of ring resonators were fabricated from a number of in-situ grown laser ablated films and post-annealed co-sputtered YBa2Cu3O(7-x) films. The properties of these resonators were measured at 35 GHz and the observed performance is examined in light of the critical temperature (Tc) and film thickness, and also the film morphology, which is different for the two deposition techniques. It is found that Tc is a major indicator of the film performance for each growth type, with film thickness becoming important as it decreases towards 1000 A. It is also found that the films with a mixed grain orientation (both a-axis and c-axis oriented grains) have poorer microwave properties as compared with the primarily c-axis oriented material. This is probably due to the significant number of grain boundaries between the different crystallites, which may act as superconducting weak links and contribute to the surface resistance.
The influence of the ellipticity parameter k and the dimensionless speed U, load W, and materials G parameters on minimum film thickness for materials of low elastic modulus was investigated. The ellipticity parameter was varied from 1 (a ball-on-plane configuration) to 12 (a configuration approaching a line contact); U and W were each varied by one order of magnitude. Seventeen cases were used to generate the minimum- and central-film-thickness relations. The influence of lubricant starvation on minimum film thickness in starved elliptical, elastohydrodynamic configurations was also investigated for materials of low elastic modulus. Lubricant starvation was studied simply by moving the inlet boundary closer to the center of the conjunction in the numerical solutions. Contour plots of pressure and film thickness in and around the contact were presented for both fully flooded and starved lubrication conditions. It is evident from these figures that the inlet pressure contours become less circular and closer to the edge of the Hertzian contact zone and that the film thickness decreases substantially as the serverity of starvation increases. The results presented reveal the essential features of both fully flooded and starved, elliptical, elastohydrodynamic conjunctions for materials of low elastic modulus.
The spacer layer imaging method (SLIM) is widely used to measure the thickness of additive and lubricant films, in lubricant development and evaluation, and for fundamental research into elastohydrodynamic lubrication and tribofilm formation mechanisms. The film thickness measurement, as implemented on several popular tribometers, provides powerful, non-destructive in-situ mapping of film topography with nanometre-scale height sensitivity. However, the results can be highly sensitive to experimental procedure, machine condition, and image analysis, in some cases reporting unphysical film thickness trends. The prevailing image analysis techniques make it challenging to interrogate these errors, often hiding their multivariate nonlinear behaviour from the user by spatial averaging. Herein, several common ‘silent errors’ in the SLIM measurement, including colour matching to incorrect fringe orders, and colour drift due to the optical properties of the system or film itself, are discussed, with examples. A robust suite of novel a priori and a posteriori methods to address these issues, and to improve the accuracy and reliability of the measurement, are also presented, including a novel, computationally inexpensive circle-finding algorithm for automated image processing. In combination, these methods allow reliable mapping of films up to at least 800 nm in thickness, representing a significant milestone for the utility of SLIM applied to elastohydrodynamic contact.
The isothermal, elastohydrodynamic (EHD) solutions in the inlet region of line contacts are extended to cover the full range of pressure-viscosity parameter, G, and the region of extremely heavy loads. The effect of a composite exponential model for the pressure-viscosity dependence on the film thickness is also studied. Results of the film thickness are compared with those based on work by Grubin, Dowson-Higginson, Bell and Kannel, and Herrebrugh. Comparison is also made between the theoretical results with the recently obtained X-ray film thickness measurements.
Thickness dependence of anisotropy, magnetization, and longitudinal coercive force in very thin permalloy films
The analysis is concerned with the piezoviscous-rigid regime of lubrication for the general case of elliptical contacts. In this regime several formulas of the lubricant film thickness have been proposed by Hamrock and Dowson, by Dowson et al., and more recently by Houpert. However, either they do not include the load parameter W, which has a strong effect on film thickness, or they overestimate the film thickness by using the Barus formula for pressure-viscosity characteristics. The Roelands formula was used for the pressure-viscosity relationship. The effects of the dimensionless load, speed, and materials parameters, the radius ratio, and the lubricant entrainment direction were investigated. The dimensionless load parameter was varied over a range of one order of magnitude. The dimensionless speed parameter was varied by 5.6 times the lowest value. Conditions corresponding to the use of solid materials of steel, bronze, and silicon nitride and lubricants of paraffinic and naphthenic mineral oil were considered in obtaining the exponent in the dimensionless materials parameter. The radius ratio was varied from 0.2 to 64 (a configuration approaching a line contact). Forty-one cases were used in obtaining a minimum film thickness formula. Contour plots indicate in detail the pressure developed between the contacting solids.
The analysis is concerned with the piezoviscous-rigid regime of lubrication for the general case of elliptical contacts. In this regime several formulas of the lubricant film thickness have been proposed by Hamrock and Dowson, by Dowson et al., and more recently by Houpert. However, either they do not include the load parameter W, which has a strong effect on film thickness, or they overestimate the film thickness by using the Barus formula for pressure-viscosity characteristics. The Roelands formula was used for the pressure-viscosity relationship. The effects of the dimensionless load, speed, and materials parameters, the radius ratio, and the lubricant entrainment direction were investigated. The dimensionless load parameter was varied over a range of one order of magnitude. The dimensionless speed parameter was varied by 5.6 times the lowest value. Conditions corresponding to the use of solid materials of steel, bronze, and silicon nitride and lubricants of paraffinic and naphthenic mineral oil were considered in obtaining the exponent in the dimensionless materials parameter. The radius ratio was varied from 0.2 to 64 (a configuration approaching a line contact). Forty-one cases were used in obtaining a minimum film thickness formula. Contour plots indicate in detail the pressure developed between the contacting solids.
Chiral 2D metal halide perovskites (MHPs) are promising for spin-optoelectronic applications, yet their absorption dissymmetry factor (g abs ) exhibits significant variability due to complex, co-dependent structural and experimental factors. Here, we established a data-driven framework using Pearson’s correlation, ANOVA, and Gaussian process regression to identify and model key synthesis “knobs” governing these properties. The analysis revealed that solvent choice is the primary factor driving variability. For acetonitrile-based films, g abs was maximized by optimizing annealing temperature and film thickness. Conversely, films from higher boiling point solvents showed complex dependencies on annealing temperature, excitonic integral intensity, and film texture. These statistical correlations provide a roadmap for the rational design of high-performance chiral MHPs and establish a foundation for future machine learning-driven material exploration.
Manufacturing quality controls for line certification of thin film and thick film hybrid microcircuits for NASA use
The selection, test, and evaluation of organic coating materials for contamination control in hybrid circuits is reported. The coatings were evaluated to determine their suitability for use as a conformal coating over the hybrid microcircuit (including chips and wire bonds) inside a hermetically sealed package. Evaluations included ease of coating application and repair and effect on thin film and thick film resistors, beam leads, wire bonds, transistor chips, and capacitor chips. The coatings were also tested for such properties as insulation resistance, voltage breakdown strength, and capability of immobilizing loose particles inside the packages. The selected coatings were found to be electrically, mechanically, and chemically compatible with all components and materials normally used in hybrid microcircuits.