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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10

Architecture, performance, and implementation of the tandem banyan fast packet switch

The authors propose a space-division fast packet switch architecture based on banyan interconnection networks, called the tandem banyan switching fabric. It consists of placing banyan networks in tandem, offering multiple paths from each input to each output, thus overcoming in a very simple way the effect of conflicts among packets (to which banyan networks are prone) and achieving output buffering. From a hardware implementation perspective, this architecture is simple in that it consists of several instances of only two VLSI chips, one implementing the banyan network and the other implementing the output buffer function. The basic structure and operation of the tandem banyan switching fabric are described, and its performance is discussed. The authors propose a modification to the basic structure which decreases the hardware complexity of the switch while maintaining its performance. An implementation of the banyan network using a high-performance BiCMOS sea-of-gates on 0.8-micron technology is reported.

Tobagi, Fouad A.↗

Micromachined Millimeter- and Submillimeter-wave SIS Heterodyne Receivers for Remote Sensing

This is a progress report for the second year of a NASA-sponsored project. The report discusses the design and fabrication of micromachined Superconductor Insulator Superconductor (SIS) heterodyne receivers with integrated tuning elements. These receivers tune out the functional capacitance at desired frequencies, resulting in less noise, lower temperatures and broader bandwidths. The report also discusses the design and fabrication of the first monolithic 3x3 focal-plane arrays for a frequency range of 170-210 GHz. Also addressed is the construction of a 9-channel bias and read-out system, as well as the redesign of the IF connections to reduce cross talk between SIS junctions, which become significant a frequency of 1.5 GHz IF. Uniformity of the junction arrays were measured and antenna beam patterns of several array elements under operating conditions also were measured. Finally, video and heterodyne responses of our focal-plane arrays were measured as well. Attached is a paper on: 'Development of a 170-210 GHz 3x3 micromachined SIS imaging array'.

Hu, Qing↗

Improved Method of Manufacturing SiC Devices

The phrase, "common-layered architecture for semiconductor silicon carbide" ("CLASSiC") denotes a method of batch fabrication of microelectromechanical and semiconductor devices from bulk silicon carbide. CLASSiC is the latest in a series of related methods developed in recent years in continuing efforts to standardize SiC-fabrication processes. CLASSiC encompasses both institutional and technological innovations that can be exploited separately or in combination to make the manufacture of SiC devices more economical. Examples of such devices are piezoresistive pressure sensors, strain gauges, vibration sensors, and turbulence-intensity sensors for use in harsh environments (e.g., high-temperature, high-pressure, corrosive atmospheres). The institutional innovation is to manufacture devices for different customers (individuals, companies, and/or other entities) simultaneously in the same batch. This innovation is based on utilization of the capability for fabrication, on the same substrate, of multiple SiC devices having different functionalities (see figure). Multiple customers can purchase shares of the area on the same substrate, each customer s share being apportioned according to the customer s production-volume requirement. This makes it possible for multiple customers to share costs in a common foundry, so that the capital equipment cost per customer in the inherently low-volume SiC-product market can be reduced significantly. One of the technological innovations is a five-mask process that is based on an established set of process design rules. The rules provide for standardization of the fabrication process, yet are flexible enough to enable multiple customers to lay out masks for their portions of the SiC substrate to provide for simultaneous batch fabrication of their various devices. In a related prior method, denoted multi-user fabrication in silicon carbide (MUSiC), the fabrication process is based largely on surface micromachining of poly SiC. However, in MUSiC one cannot exploit the superior sensing, thermomechanical, and electrical properties of single-crystal 6H-SiC or 4H-SiC. As a complement to MUSiC, the CLASSiC five-mask process can be utilized to fabricate multiple devices in bulk single-crystal SiC of any polytype. The five-mask process makes fabrication less complex because it eliminates the need for large-area deposition and removal of sacrificial material. Other innovations in CLASSiC pertain to selective etching of indium tin oxide and aluminum in connection with multilayer metallization. One major characteristic of bulk micromachined microelectromechanical devices is the presence of three-dimensional (3D) structures. Any 3D recesses that already exist at a given step in a fabrication process usually make it difficult to apply a planar coat of photoresist for metallization and other subsequent process steps. To overcome this difficulty, the CLASSiC process includes a reversal of part of the conventional flow: Metallization is performed before the recesses are etched.

Okojie, Robert S.↗

Fabrication of Phononic Filter Structures for Far-IR/sub-mm Detector Applications

A photon noise limited sub-mm/far-IR cold telescope in space will require detectors with noise equivalent power (NEP) less than 1x10-19W/Hz1/2for imaging applications and at least an order of magnitude lower for spectroscopic studies. The detector NEP can be reduced by lowering the operation temperature and improving the thermal isolation between the bolometer and a heat bath. We report on the fabrication of membrane isolated transition edge sensor bolometers incorporating compact (<50 μm) thermal isolation beams based on phononic filters. Phononic filters are created by etching quasi-periodic nanoscale structures into supporting thermo-mechanical beams. The cross-sectional dimensions of the etched features are less than the thermal wavelength at the operating temperature, enabling coherent phonon transport to take place in one dimension. The phonon stop-band can be tuned by adjusting the scale of the quasi-periodic structures. Cascading multiple filter stages can increase bandwidth and provide improved thermal isolation similar to the function of a multi-stage electrical filter. We describe the fabrication of AlMn based transition edge sensor bolometers on silicon and silicon nitride membranes isolated by one-and two-dimensional phononic filters. The phononic filters are patterned through electron beam lithography and isolated with deep reactive ion etching.

Phononic↗

Properties of superconducting Nb3Ga materials.

The superconducting-to-normal phase boundary was studied experimentally in several Nb-Ga materials as a function of applied field and superconducting transition temperature. When properly fabricated, the stoichiometric material Nb3Ga yields a superconducting transition temperature of 20.3 K, the highest yet reported for a binary alloy. Preliminary work shows that Nb-Ga materials with a superconducting transition temperature of 19 K can be made by chemical vapor deposition, a process commonly used for producing commercial superconducting tape.

Foner, S.↗

Research, development and application of noncombustible Beta fiber structures

Beta fiber was selected as the primary material for flexible fibrous structures used in spacecraft and crew systems applications in the Apollo program because it was noncombustible in a 100 percent oxygen atmosphere up to 16.5 psia. It met NASA criteria for outgassing, toxicity, odor, and crew comfort, and possessed sufficient durability to last through the mission. Topics discussed include: study of spacecraft applications; design of Beta fiber textile structures to meet the requirements; selection of surface treatments (finishes, coatings, and printing systems) to impart the required durability and special functional use to the textile structures; development of sewing and fabrication techniques; and testing and evaluation programs, and development of production sources.

Dillon, J. J.↗

Development, qualification, and delivery of a hydrogen burnoff igniter

The hydrogen burnoff igniter, a pyrotechnic device used to burn off excess hydrogen gas near the Space Shuttle Main Engine (SSME) nozzle, was designed, fabricated, and qualified. Characteristics of the burnoff igniter include a function time of 8 + or - 2 seconds, a minimum three foot flame length at maximum output, and hot particles projected 15 feet when fired directly into or perpendicular to a 34.5 knot wind. The three foot flame length was considered to be of questionable importance, since the hot particles are the media for igniting the hydrogen. Flame temperature is greater than 1500 F.

Ray, D.↗

Electromagnetic levitation coil fabrication technique for MSFC containerless processing facilities

A technique is described for more reproducible fabrication of electromagnetic levitation coils. A split mandrel was developed upon which the coil is wound. After fabrication the mandrel can be disassembled to remove it from the coil. Previously, a full day was required to fabricate a levitation coil and the success rate for a functional coil was only 50 percent. About eight coils may be completed in one day using the technique developed and 95 percent of them are good levitation coils.

Ethridge, E. C.↗

Research in the design of high-performance reconfigurable systems

Computer aided design and computer aided manufacturing have the potential for greatly reducing the cost and lead time in the development of VLSI components. This potential paves the way for the design and fabrication of a wide variety of economically feasible high level functional units. It was observed that current computer systems have only a limited capacity to absorb new VLSI component types other than memory, microprocessors, and a relatively small number of other parts. The first purpose is to explore a system design which is capable of effectively incorporating a considerable number of VLSI part types and will both increase the speed of computation and reduce the attendant programming effort. A second purpose is to explore design techniques for VLSI parts which when incorporated by such a system will result in speeds and costs which are optimal. The proposed work may lay the groundwork for future efforts in the extensive simulation and measurements of the system's cost effectiveness and lead to prototype development.

Mcewan, S. D.↗

Submicron gate InP power MISFET's with improved output power density at 18 and 20 GHz

The microwave characteristics are presented at 18 and 20 GHz of submicron gate indium phosphide (InP) metal-insulator-semiconductor field-effect transistors (MISFET's) for high output power density applications. InP power MISFET's were fabricated and the output power density was investigated as a function of drain-source spacing. The best output power density and gain were obtained for drain-source spacing of 3 microns. The output power density is 2.7 times greater than was previously measured for InP MISFET's at 18 and 20 GHz, and the power-added efficiency also increased.

Biedenbender, M. D.↗

Submicron gate InP power MISFET's with improved output power density at 18 and 20 GHz

The microwave characteristics are presented at 18 and 20 GHz of submicron gate indium phosphide (InP) metal-insulator-semiconductor field-effect transistors (MISFETs) for high output power density applications. InP power MISFET's were fabricated and the output power density was investigated as a function of drain-source spacing. The best output power density and gain were obtained for drain-source spacing of 3 micron. The output power density is 2.7 times greater than was previously measured for InP MISFET's at 18 and 20 GHz, and the power-added efficiency also increased.

Biedenbender, Michael D.↗

Design and qualification of the SEU/TD Radiation Monitor chip

This report describes the design, fabrication, and testing of the Single-Event Upset/Total Dose (SEU/TD) Radiation Monitor chip. The Radiation Monitor is scheduled to fly on the Mid-Course Space Experiment Satellite (MSX). The Radiation Monitor chip consists of a custom-designed 4-bit SRAM for heavy ion detection and three MOSFET's for monitoring total dose. In addition the Radiation Monitor chip was tested along with three diagnostic chips: the processor monitor and the reliability and fault chips. These chips revealed the quality of the CMOS fabrication process. The SEU/TD Radiation Monitor chip had an initial functional yield of 94.6 percent. Forty-three (43) SEU SRAM's and 14 Total Dose MOSFET's passed the hermeticity and final electrical tests and were delivered to LL.

Buehler, Martin G.↗

Reliability, Risk and Cost Trade-Offs for Composite Designs

Risk and cost trade-offs have been simulated using a probabilistic method. The probabilistic method accounts for all naturally-occurring uncertainties including those in constituent material properties, fabrication variables, structure geometry and loading conditions. The probability density function of first buckling load for a set of uncertain variables is computed. The probabilistic sensitivity factors of uncertain variables to the first buckling load is calculated. The reliability-based cost for a composite fuselage panel is defined and minimized with respect to requisite design parameters. The optimization is achieved by solving a system of nonlinear algebraic equations whose coefficients are functions of probabilistic sensitivity factors. With optimum design parameters such as the mean and coefficient of variation (representing range of scatter) of uncertain variables, the most efficient and economical manufacturing procedure can be selected. In this paper, optimum values of the requisite design parameters for a predetermined cost due to failure occurrence are computationally determined. The results for the fuselage panel analysis show that the higher the cost due to failure occurrence, the smaller the optimum coefficient of variation of fiber modulus (design parameter) in longitudinal direction.

Shiao, Michael C.↗

Oxidation Resitant HfC-TaC Rocket Thruster for High Performance Propellants

The purpose of this reasearch effort was to develop high temperature, oxidation resistant thrusters which would lessen the thruster cooling requirements, resulting in increased performance and longer life for onboard propulsion systems for spacecraft. This research effort focussed on developing ceramic matrix composites (CMCs) for this application, and specifically investigated the use of HfC stabilized with TaC. This material composition can potentially operate in a stoichiometric oxygen to hydrogen ratio at a temperature of 5000 deg F (2760 deg C) in a radiatively cooled mode. Various compositions of Hafnium Carbide (HfC) and Tantalum Carbide (TaC) were deposited by chemical vapor deposition (CVD) and tested, in an attempt to identify the composition which offered the best oxidation resistance. Although it was identified that small amounts of TaC appeared to offer improved oxidation resistance over HfC alone, an optimal composition was not identified. A 251bf thruster was fabricated from a novel CMC sandwich construction with a HfC-TaC matrix, and survived two test firings, each of 5 seconds before a failure in the injector caused the run to be aborted. It was not possible to control the relative stoichiometry of the HfC and TaC composition throughout the reactor due to the large difference in the thermodynamics of the HfC and TaC formation from their respective chlorides. This also resulted in an inability to infiltrate TaC into the preform under the experimental conditions investigated. Other material compositions were fabricated and tested and two material systems; HfC-SiC functionally graded to C(sub f)/C and Re functionally graded to C(sub f)/C were selected for further testing. These functionally graded composites have use in a number of propulsion applications presently of interest to NASA and the defense industry. Their ability to withstand extremely hostile thermal environments and the light-weight and high-strength exhibited from the C(sub f)/C composite make these materials particularly suited for these applications. In the Phase III which is presently underway, Re functionally graded to C(sub f)/C is being further developed and tested for application in the thrust cells for the Linear Aerospike Engine for the X33 and RLV.

Patterson, Mark↗

Properties of silicon carbide fiber-reinforced silicon nitride matrix composites

The mechanical properties of NASA Lewis developed SiC/RBSN composites and their thermal and environmental stability havd been studied. The composites consist of nearly 30 vol pct of aligned 142 micron diameter chemically vapor-deposited SiC fibers in a relatively porous silicon nitride matrix. In the as-fabricated condition, the unidirectional and 2-D composites exhibited metal-like stress-strain behavior, graceful failure, and showed improved properties when compared with unreinforced matrix of comparable density. Furthermore, the measured room temperature tensile properties were relativley independent of tested volume and were unaffected by artifical notches normal to the loading direction or by thermal shocking from temperatures up to 800 C. The four-point bend strength data measured as a function of temperature to 1400 C in air showed that as-fabricated strength was maintained to 1200 C. At 1400 C, however, nearly 15 pct loss in strength was observed. Measurement of room temperature tensile strength after 100 hr exposure at temperatures to 1400 C in a nitrogen environment indicated no loss from the as-fabricated composite strength. On the other hand, after 100 hr exposure in flowing oxygen at 1200 and 1400 C, the composites showed approximately 40 pct loss from their as-fabricated ultimate tensile strength. Those exposed between 400 to 1200 C showed nearly 60 pct strength loss. Oxidation of the fiber/matrix interface as well as internal oxidation of the porous Si3N4 matrix are likely mechanisms for strength degradation. The excellent strength reproducibility, notch insensitivity, and high temperature strength of the composite makes it an ideal candidate for advanced heat engine applications provided coating or densification methods are developed to avoid internal oxidation attack.

Bhatt, Ramakrishna T.↗

3D Printing Multi-Functionality: Embedded RF Antennas and Components

Significant research and press has recently focused on the fabrication freedom of Additive Manufacturing (AM) to create both conceptual models and final end-use products. This flexibility allows design modifications to be immediately reflected in 3D printed structures, creating new paradigms within the manufacturing process. 3D printed products will inevitably be fabricated locally, with unit-level customization, optimized to unique mission requirements. However, for the technology to be universally adopted, the processes must be enhanced to incorporate additional technologies; such as electronics, actuation, and electromagnetics. Recently, a novel 3D printing platform, Multi3D manufacturing, was funded by the presidential initiative for revitalizing manufacturing in the USA using 3D printing (America Makes - also known as the National Additive Manufacturing Innovation Institute). The Multi3D system specifically targets 3D printed electronics in arbitrary form; and building upon the potential of this system, this paper describes RF antennas and components fabricated through the integration of material extrusion 3D printing with embedded wire, mesh, and RF elements.

antennas↗

High Temperature Materials for Chemical Propulsion Applications

Radiation or passively cooled thrust chambers are used for a variety of chemical propulsion functions including apogee insertion, reaction control for launch vehicles, and primary propulsion for planetary spacecraft. The performance of these thrust chambers is limited by the operating temperature of available materials. Improved oxidation resistance and increased operating temperatures can be achieved with the use of thermal barrier coatings such as zirconium oxide (ZrO2) and hafnium oxide (HfO2). However, previous attempts to include these materials showed cracking and spalling of the oxide layer due to poor bonding. Current research at NASA's Marshall Space Flight Center (MSFC) has generated unique, high temperature material options for in-space thruster designs that are capable of up to 2500 C operating temperatures. The research is focused on fabrication technologies to form low cost Iridium,qF_.henium (Ir/Re) components with a ceramic hot wall created as an integral, functionally graded material (FGM). The goal of this effort is to further de?celop proven technologies for embedding a protective ceramic coating within the Ir/Re liner to form a robust functional gradient material. Current work includes the fabrication and testing of subscale samples to evaluate tensile, creep, thermal cyclic/oxidation, and thermophysical material properties. Larger test articles have also being fabricated and hot-fire tested to demonstrate the materials in prototype thrusters at 1O0 lbf thrust levels.

Elam, Sandra↗

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗