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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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174 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗
NASA NTRS2014

Evaluation of RTM370 Polyimide Composites by Resin Film Infusion (RFI)

RTM370 imide oligomer based on 2,3,3',4'-biphenyl dianhydride (a-BPDA), 3,4'-oxydianiline (3,4'-ODA) and terminated with the 4-phenylethynylphthalic (PEPA) endcap has been shown to exhibit a low melt viscosity (10-30 poise) at 280 C with a pot-life of 1-2 h and a high cured glass-transition temperature (Tg) of 370 C. RTM370 resin has been successfully infused into fiberglass-stitched T650-35 carbon-fabric preforms (ranged from 3- to 6-mm thick) by resin film infusion (RFI). The resulting composite panels were inspected by ultrasonic C-scan and by photomicrographs before and after post-curing as a quality control. Mechanical tests such as unnotched compression (UNC), open-hole compression (OHC), and short-beam shear strength (SBS) at ambient and elevated temperatures were performed before and after isothermal aging at 288 C for 1000 h to assess high-temperature performance. Thermal cycling of RTM370 stitched composites was also conducted from -54 C to 288 C for up to 1600 cycles to evaluate the microcrack resistance of RTM370 polyimide composites fabricated by RFI.

Polyimide↗
NASA NTRS2009

Reliability of recolumned area array packages

This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented.

Ghaffarian, Reza↗
NASA NTRS2010

Reliability of area array packages with 1500-2500 I/Os

This report first provides a literature survey for designing, manufacturing, and reliability test results for area array packages with 1500 to 2500 inputs/outputs (I/Os). It then presents test matrix on design, yield, and workmanship defects on assembly and environmental testing, including thermal cycle and mechanical drop-test evaluation results for FCBGA1704, FPBGA432, and PBGA676 I/Os packages assembled onto printed circuit/wiring boards (PCBs/PWBs). Finally, it summarizes lessons learned from test results for assembly and environmental testing along with optical, scanning electron microscopy (SEM), and x-ray photomicrographs showing damage progress.

Ghaffarian, Reza↗
NASA NTRS2012

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗
NASA NTRS2012

3D X-ray CT for BGA/CGA Workmanship Defect Detection

Commercial-off-the-shelf (COTS) advanced microelectronic technologies in high-reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. One of the key drawbacks of advanced electronic packages with hidden solder joint interconnections, such as the column grid array (CGA), is that inspection can be challenging—whether visually or using X-rays. In general, inspection for solder joint integrity is poor, except for identifying shorts. The new, advanced X-ray systems, especially the 3D computer tomography version, may be able to provide the three-dimensional features that are extremely difficult to resolve under the 2D systems.This report presents both 2D and 3D X-ray images along with their representative optical photomicrographs for a number of advanced electronics package assemblies including 3D stack and CGA assemblies before and after thermal cycling.

Ghaffarian, Reza↗
DOE OSTI2023

Utah FORGE: Well 16A(78)-32 Core Analysis Results

This dataset features petrographic, X-Ray Diffraction (XRD), and Scanning Electron Microscopy Analyses of core samples from well 16A(78)-32, which serves as the injection well for the Utah FORGE Enhanced Geothermal System (EGS) project. In addition to an overview of the analysis, the following items have been included here: images of 21 entire thin sections in plane-polarized and cross-polarized light from 16 depths, scanning electron microscope back scatter electron photomosaic maps of 21 thin sections from 16 depths, bulk XRD data from 16 depths, clay-sized XRD patterns from 16 depths, an optical petrography report, and scanning electron microscopy and energy dispersive spectroscopy analyses of eight selected samples.

15 GEOTHERMAL ENERGY↗