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At least 181 records · Page 10

Assessment of Critical Experiment Benchmark Applicability to a Large-Capacity HALEU Transportation Package Concept

This work presents an assessment of the applicability of existing benchmark critical experiments to the criticality safety code validation for a large-capacity high-assay low-enriched uranium (HALEU) transportation package concept. Numerous next-generation nuclear reactor designs require HALEU fuel, which is characterized by an enrichment between 5 and 20 wt% 235 U. The U.S. Department of Energy (DOE) has proposed to recover and downblend highly enriched uranium from DOE-owned used nuclear fuel to accelerate the demonstration of commercially viable microreactor technologies. One element of the infrastructure needed to demonstrate HALEU-fueled reactors is the ability to safely transport enriched product to be used for fuel fabrication. There is uncertainty as to whether existing critical benchmark experiment data are sufficient to support criticality safety code validation for HALEU transportation applications. The anticipated chemical form of the HALEU in the proposed transportation concept is UO 2 with 20 wt% 235 U/U. The concept uses a combination of an existing transportation packaging design and a novel basket design, including borated aluminum flux traps. The basket provides space for 18 reusable, stainless steel canisters that contain the HALEU. In 10 CFR 71, normal conditions of transport (NCTs) and hypothetical accident conditions (HACs) are defined for fissile material transportation packages. NCT and HAC KENO-VI models of the transportation package were developed using the Standardized Computer Analyses for Licensing Evaluation (SCALE) 6.2.3 computer code package, and optimum moderation conditions were determined using the SCALE SAMPLER sequence. The SCALE Tools for Sensitivity and Uncertainty Analysis Methodology Implementation (TSUNAMI) sequences were then used to compare the neutronic characteristics of 1584 International Criticality Safety Benchmark Evaluation Project benchmark critical experiments with the NCT and HAC HALEU transportation models. The TSUNAMI integral correlation coefficient c k was the criterion used to rank neutronic similarity. Thirty-four experiments were identified as similar (c k ≥ 0.9) to the NCT model, and 55 experiments were identified as similar to the HAC model. Hundreds of experiments were also identified as at least marginally similar (c k ≥ 0.8) to both models. The results indicate that additional critical experiments are unlikely to be needed to support HALEU transportation criticality safety analyses for package concepts similar to the concept package analyzed.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

Packaging innovations are needed for medium-voltage wide bandgap power semiconductor modules to enable their adaptation in grid applications. A unique challenge for packaging medium-voltage power modules is managing the trade-off between insulation demand and heat dissipation. The focus of this work was on developing a packaging innovation that improves the module heat dissipation and offers more flexibility to its insulation design. Two strategies were explored for the packaging of an 8-kV SiC diode rectifier module:(1) double-side cooling and (2) sintered-silver bonding. Double-side cooling was realized by using short metal posts rather than long and thin wire bonds for device interconnection, forming a low-profile package with devices sandwiched between two insulated metal substrates. Sintered-silver bonding enabled the devices to function reliably at over 250 °C. Simulations of the packaged module showed a low interconnect inductance of 2.67 nH and a 50% less heat transfer coefficient required to cool the chips. Prototypes of the module were fabricated, and preliminary electrical testing results validated the package design.

27 ARPA - Advanced Research Projects Agency-Energy↗

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The 1.2 kV SiC MOSFET dies used in the half-bridge package are embedded in the PCB using AT&S's patented technique. The dies are cooled and electrically connected to traces in the PCB through copper-filled microvias. The design methodology accounts for both electrical and thermal performance, limiting the power-loop inductance to 2.3 nH and the maximum package temperature to less than the 175 °C limit. The integration of the gate drive circuitry allows for a high power density and 2.2 nH gate-loop inductances. At 0.12 K/W, the measured junction-to-case thermal resistance with double-sided cooling is 57% lower than that of a TO-247 package. Under similar operating conditions, the PCB-embedded half-bridge package also achieves a 5.6 times lower voltage overshoot and a 0.5% higher peak efficiency than a TO-247-based half-bridge. This article reports the first demonstration of PCB-embedded 1.2 kV SiC MOSFET packages in buck, boost, and ac–dc converters. Furthermore, the prototype three-phase ac–dc converter for an electric vehicle on-board charger is composed of six PCB-embedded half-bridge packages and achieves an efficiency of 98.2% and a power density of 182 W/in 3 .

42 ENGINEERING↗

Large-scale parametric modeling of spent nuclear fuel dynamics in the 30 cm package drop scenario

Packages used to transport spent nuclear fuel (SNF) are required by the U.S. Code of Federal Regulations 10 CFR 71.71 to demonstrate satisfactory performance during a drop scenario. While the CFR is meant to ensure safe package function, it does not evaluate survival of the SNF within. The U.S. Department of Energy Spent Fuel and Waste Science and Technology program is working on closing the knowledge gap related to the response of SNF to external mechanical loads, including the hypothetical 30 cm package drop scenario in the CFR. In support of this effort, LS-DYNA finite element simulations were developed by Pacific Northwest National Laboratory (PNNL) to model generic drop scenarios at both the package and fuel assembly level. The models were validated against one-third scale package and full scale fuel assembly drop test data and were exercised to predict fuel cladding strains in a narrow range of model configurations. This work describes a large-scale parametric study conducted by PNNL using the previously developed and validated PWR finite element model, with the addition of a new generic BWR assembly model. The motivation for the parametric study was to characterize the broad range of SNF responses in the 30 cm package drop scenario. This was accomplished by varying the drop orientation, fuel assembly type (17x17 PWR and 10x10 BWR), burnup, cladding temperature, spacer grid buckling load, package mass, impact limiter stiffness, and mechanical gap conditions within the basket. A MATLAB framework was developed to automate LS-DYNA model generation and execution on PNNL institutional computing resources. In total, over 2000 simulations were performed. For each simulation, the SNF response was quantified in terms of permanent grid deformation, fuel rod contact pressure, and strains within the fuel rods, guide tubes, and water rods. The results provide valuable insight into the range of responses that could be reasonably expected from SNF in the hypothetical drop scenario, as well as the sensitivity to each input parameter. The results of this parametric study are a key component of the testing and modeling strategy the Spent Fuel and Waste Science and Technology program is using to close the external loads knowledge gap.

Kadooka, Kevin↗

Supplemental Structural Analyses Used in Support of Certification of the Defense Programs Package 3

The Defense Programs Package (DPP)-3 is to be certified by the National Nuclear Security Administration (NNSA) Packaging and Transportation Division (PTD). Certification is based on successful physical testing of the package, and six certification test units (CTUs) have been subjected to the normal conditions of transport (NCT) and hypothetical accident conditions (HAC) outlined in Title 10 of the Code of Federal Regulations Part 71 (10 CFR 71). During regulatory testing of one of the CTUs, the drum lid closure bolt closest to the impact surface failed during the HAC 30-ft side drop. One of the testing goals for this CTU was to minimize the thermal pathway from the drum exterior shell to the containment vessel (CV) flange and O-rings, leading to the maximum damage scenario in preparation for thermal testing at 1475 °F. Therefore, the puncture bar impact proceeded as originally planned by striking the side wall of the package exterior closest to the location of the CV flange. This puncture bar impact did not attempt to exploit the region of the failed drum lid closure bolt to potentially cause more damage to the package. After the conclusion of regulatory testing, the DPP-3 package finite element model was used to numerically evaluate the effects of puncture bar impacts to the drum exterior in the vicinity of the failed drum lid closure bolt to further demonstrate the robustness of the DPP-3 design. Three alternate puncture bar impact locations and orientations were evaluated to demonstrate that these puncture bar impacts would not substantially reduce the effectiveness of the DPP-3 packaging. This paper describes the supplemental finite element models performed and structural analysis results that demonstrate the alternate HAC 40-in. puncture bar impact tests would have no deleterious effect on the performance of the DPP-3.

Sakalaukus Jr., Peter J.↗

RC-SFA Data Management Templates and Guidance for Standardized, Reusable AI-Ready Data Packages

This data package provides templates and supporting documentation developed by the River Corridor Science Focus Area (RC-SFA; https://www.pnnl.gov/projects/river-corridor) to communicate its approach to managing and publishing AI-ready data. The package is intended to help data users and data producers understand the structures, metadata practices, and quality-control approaches that support consistent, reusable, and machine-actionable data products across RC-SFA studies. Rather than focusing on a single experimental dataset, this package documents the data management framework used to make RC-SFA data easier to find, ingest, navigate, and interpret. The materials in this package reflect RC-SFA practices for standardized data package organization, including the use of a human- and machine-readable README, file-level metadata, data dictionaries, descriptive file naming, method identifiers, and automated and review-based quality assurance procedures. Together, these components illustrate how RC-SFA extends FAIR data principles toward AI-readiness by prioritizing deep metadata, consistency across data packages, and support for informed downstream reuse by both humans and computational tools. This dataset is comprised of (1) readme; (2) presentation slides with an overview of RC-SFA approach and guidance; (3) document of RC-SFA best practices; (4) data dictionary (dd); (5) file level metadata (flmd); and a subfolder containing templates for dd and flmd. All files are .csv and .pdf. For details on how to navigate data packages generated by this project, see https://data.ess-dive.lbl.gov/portals/PNNLRiverCorridorSFA/About.

AI-readiness↗

Temperature-package power correlations for open-mode geologic disposal concepts.

Logistical simulation of spent nuclear fuel (SNF) management in the U.S. combines storage, transportation and disposal elements to evaluate schedule, cost and other resources needed for all major operations leading to final geologic disposal. Geologic repository reference options are associated with limits on waste package thermal power output at emplacement, in order to meet limits on peak temperature for certain key engineered and natural barriers. These package power limits are used in logistical simulation software such as CALVIN, as threshold requirements that must be met by means of decay storage or SNF blending in waste packages, before emplacement in a repository. Geologic repository reference options include enclosed modes developed for crystalline rock, clay or shale, and salt. In addition, a further need has been addressed for open modes in which SNF can be emplaced in a repository, then ventilated for decades or longer to remove heat, prior to permanent repository closure. For each open mode disposal concept there are specified durations for surface decay storage (prior to emplacement), repository ventilation, and repository closure operations. This study simulates those steps for several timing cases, and for SNF with three fuel-burnup characteristics, to develop package power limits at which waste packages can be emplaced without exceeding specified temperature limits many years later after permanent closure. The results are presented in the form of correlations that span a range of package power and peak postclosure temperature, for each open-mode disposal concept, and for each timing case. Given a particular temperature limit value, the corresponding package power limit for each case can be selected for use in CALVIN and similar tools.

Hardin, Ernest.↗

Functional Bounding Content Envelope for Gamma and Neutron Emitting Isotopes in the Model 9977 Packaging

The contents approved for shipment in a Type B radioactive material transportation package have historically been descriptions of discrete items, or groupings of well-defined similar items, in the package safety basis documentation. The need for a comprehensive functional content envelope of both gamma and neutron emitting nuclides compliant with regulatory limits has become necessary as the DOE complex requires shipments of unique mixtures of radionuclides and impurities. Recent publications have presented a calculational model and a corresponding content envelope intended to be compliant with federal regulatory external radiation limits as well as design decay heat limits based on the Model 9977 Packaging. The methodology used to develop this content envelope consisted of determining the external radiation dose rates based on one gram of a given isotope combined, in the case of actinides, with various levels of light element impurities and determining the allowable mass to the regulatory limits based on these dose rates. The method of ratioing from these calculations to the masses that meet the regulatory limits fails in the case of some combinations of actinides and light element impurities because of the effect of subcritical multiplication, resulting in non-conservative and non-compliant dose rates in some cases. This is particularly true for many actinides combined with beryllium, boron, fluorine, lithium, and sodium. In this study, the source was modeled as a sphere with the appropriate dimensions based on the actinide or gamma source density and placed at the bottom of the containment vessel for maximum conservatism. The results presented in this report rectify the above-noted deficiencies by adjusting the previously determined mass limits so that the resulting dose rates are compliant with regulatory limits. Some amount of iteration was required in some instances to adjust the masses for dose compliance. In some instances the masses were increased since they were too conservative. In addition, the method of ratioing the masses when applied to several gamma emitting isotopes also resulted in either non-conservative or overly conservative data. The mass imits presented here are for bare sources and are complaint with the design decay heat limit of 19W. The masses are based on package surface dose rates (the limiting dose rate) that fall in the range 185-195 mrem/h, thus giving an additional margin of between 7.5% and 2.5% to the regulatory limit of 200 mrem/h. This report presents a revised set of mass limits (i.e., content envelope) for several neutron emitting actinides with varying levels of light element impurities compliant with both external radiation and design decay heat limits. In addition, revised limits for gamma sources are also presented. The neutron emitter mass limits are in Tables 1 through 9 and the gamma emitter mass limits are in Table 10. The revised content envelope covering a wide range of materials present in the DOE complex, was developed for the Model 9977 Packaging, providing conservative limits for other commonly-used Type B Packagings such as the Models 9975 and 9978. It should be noted that for the Model 9977 package, shipment is also possible with three shielded containers – lead or tungsten for gamma sources and polyethylene for neutron emitters. The design decay heat limits for these are as follows: 19W for tungsten, 6W for lead and 3W for polyethylene. The limits presented in this report would need to be checked against the lower decay heat limits for the lead and polyethylene and adjusted as required for compliance. Criticality safety is not factored into these limits and should be evaluated on a case by case basis.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

EXAMINATION OF SHIPPING PACKAGE 9975-05050

Shipping package 9975-05050 was examined in K-Area following its identification as a high wattage package. Elevated temperature and fiberboard moisture content are key parameters that impact the degradation rate of fiberboard within 9975 packages in a storage environment. The high wattage of this package contributes significantly to component temperatures. After examination in K-Area, the package was provided to SRNL for further examination of the fiberboard assembly. The moisture content of the fiberboard was relatively low (compared to packages examined previously), but the moisture gradient (between fiberboard ID and OD surfaces) was relatively high, as would be expected for the high heat load. The cane fiberboard appeared intact and displayed no apparent change in integrity relative to a new package.

42 ENGINEERING↗

Examination of shipping package 9975-02403

SRNL examined shipping package 9975-02403 following storage of nuclear material in K-Area Complex (KAC). As a result of field surveillance activities in KAC, this package was identified to contain several non-conforming and other conditions. Further examination of this package in SRNL confirmed significant moisture and mold in the bottom layers of the lower fiberboard assembly, and identified additional corrosion along the seam weld and on the bottom of the drum. It was recently recommended that checking for corrosion along the bottom edge of the drum be implemented for packages that are removed from storage, as well as high wattage packages remaining in storage. The appearance of such corrosion on 9975-02403 further indicates that such corrosion may provide an indication of significant moisture concentration and related degradation within the package. This condition is more likely to develop in packages with higher internal heat loads.

99 GENERAL AND MISCELLANEOUS↗

Fiberboard Properties and Degradation Rates for Storage of 9975 Shipping Package in KAC (2020 Status Report)

Savannah River Site (SRS) stores plutonium materials within model 9975 shipping packages in the K-Area Complex (KAC). The 9975 shipping package consists of a 35 gallon stainless steel drum, Celotex fiberboard insulation, lead shield, and primary and secondary containment vessels. The 9975 shipping package design, performance, and analysis for safe transport of radioactive material are described in the Safety Analysis Report for Packaging (SARP). Celotex fiberboard provides three safety functions: thermal insulation to limit internal temperature during a fire, criticality control, and resistance to package crushing. The fiberboard material must retain its dimensions and density within certain ranges to provide the required impact resistance, criticality control, and fire resistance. The SRS Surveillance Program monitors material performance to establish a basis for service life and ensures the continued integrity of 9975 packages. Fiberboard samples, taken from multiple fiberboard assemblies fabricated from cane and softwood fiberboard, have been conditioning in elevated temperature environments since 2005. The samples are periodically examined to monitor thermal, mechanical, and physical properties, and assess degradation trends. Fiberboard properties of interest that are evaluated to demonstrate acceptable long-term performance include dimensional stability, density, compressive strength, thermal conductivity, and specific heat capacity. Duplicate samples from multiple package sources have been tested to identify the range of variability in fiberboard properties and degradation rates. Baseline and long-term testing of fiberboard material properties have been reported previously; reference 6 summarized experimental results of cane and softwood fiberboard through May 2019 and presented degradation models for the measured properties. This report presents the cumulative data collected through June 2020 and the corresponding updated aging models.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Fiberboard Properties and Degradation Rates for Storage of 9975 Shipping Packages in KAC (2021 Status Report)

Thermal, mechanical, and physical properties have been measured on fiberboard samples following accelerated aging for up to 16 years. The aging environments include elevated temperature up to 250 ºF (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. Accelerated aging results have been analyzed and used to build aging models. Correlations relating several properties (thermal conductivity, energy absorption, weight, dimensions, and density) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in K-Area Complex (KAC), these models allow development of service life predictions. KAC completed calculations that supported extending the service life of 9975 packages with 3013 and non3013 containers in storage from 15 years to 20 years. These calculations addressed the potential for degraded fiberboard properties following 20 years in storage using degradation models developed previously. The updated degradation models developed in this report have been compared to the assumptions in these calculations, and the current results for fiberboard dimensions, density, radial thermal conductivity, and energy absorption remain consistent with those calculations. The axial thermal conductivity degradation rate slightly exceeds calculations estimate of 0.5% per year between 130 and 160 °F. Additional data will continue to be collected to permit future refinements to the models and assumptions. Some of the predicted degradation rates presented in this report are extreme. However, these relate to environments that do not exist within KAC or would be postulated only as upset conditions that would not likely persist for an extended period. For a typical package stored in KAC with approximately 10-12 watts internal heat load or less, and ambient temperatures below 90 ºF, the fiberboard assemblies experience storage conditions less severe than any of the aging environments. Fiberboard in conforming packages with lower internal heat loads should experience little or no degradation and is expected to provide a service life beyond the currently approved 20 year storage period. Packages with higher internal heat loads may not continue to perform their required safety functions beyond 20 years. Ultimately, service life will be determined by the cumulative effect of degradation from all the conditions these packages might encounter. The results and model predictions presented in this report are applicable to 9975 packages with cane or softwood fiberboard overpack assemblies. These degradation models do not address the effects of nonconforming conditions such as the presence of excess moisture and mold or beetle infestations.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Food packages for Space Shuttle

The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

Fohey, M. F.↗

ASpect: A new spectrum and line analysis package for IRAF

We examined several publicly available spectral analysis software packages looking for one with enough functionality and versatility to meet the analysis needs of astronomers during the next decade. None of those examined can satisfactorily support the wide variety of panchromatic science programs that are now becoming possible. Furthermore, we concluded that none of these packages can be simply modified to include critical functions because of their original (limited) designs. During the next two years we will write a new spectral analysis package, ASpect, that will incorporate the latest analysis techniques for astronomical spectra in all wavelength domains. The ASpect package has several functional requirements. It must operate on spectra from a wide variety of ground-based and space-based instruments spanning wavelengths from radio to gamma rays. It must accommodate non-linear dispersion relations. It must provide a variety of functions, individually or in combination, with which to fit spectral features and the continuum. It is vitally important that known bad data be masked and that, uncertainties be propagated throughout the calculations in order for astronomers to evaluate the reliability of results. Finally, this new package must provide a powerful, intuitive graphical user interface to handle the burden of data input/output (I/O), on-line 'help,' selection of relevant features for analysis, plotting and graphical interaction, and data base management--all in a comprehensible environment. We anticipate that ASpect will take the form of an external package in IRAF (such as the NOAO and STSDAS packages) and will be layered upon the IRAF virtual Operating System to make it available on as many platforms as possible, while making it resistant to changes in operating systems and compilers. Our choice of IRAF is motivated by its portability, its wide use within the astronomical community, and its rich set of existing user applications.

Hulbert, S. J.↗

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗

Laser Welding in Electronic Packaging

The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

Source record↗

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗

Advanced Space Suit Portable Life Support Subsystem Packaging Design

This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

Howe, Robert↗