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At least 181 records · Page 10

Monitoring Polymer Curing Via Electromagnetic Impedance

New nondestructive in-situ electromagnetic-impedance measurement technique senses cure-processing properties of high-temperature, high-performance thermostat and thermoplastic resins. Continuous frequency-dependent measurement and analysis performed during curing cycle. Monitors and measures molecular properties of polymeric resin in liquid and solid states. Applications include nondestructive means for evaluation of materials, determination of "window" boundaries of curing cycles of thermoplastics and thermoset resins, and for online, closed-loop control of curing cycles.

Freeman, William T.↗

Investigation of test methods, material properties and processes for solar cell encapsulants

The potentially useful encapsulating materials for Task 3 of the Low-Cost Silicon Solar Array project were studied to identify, evaluate, and recommend encapsulant materials and processes for the production of cost-effective, long-life solar cell modules. Materials for study were chosen on the basis of existing knowledge of generic chemical types having high resistance to environmental weathering. The materials varied from rubbers to thermoplastics and presented a broad range of mechanical properties and processing requirements. Basic physical and optical properties were measured on the polymers and were redetermined after exposure to indoor artificial accelerated aging conditions covering four time periods. Strengths and weaknesses of the various materials were revealed and data was accumulated for the development of predictive methodologies. To date, silicone rubbers, fluorocarbons, and acrylic polymers appear to have the most promising combination of characteristics. The fluorocarbons may be used only as films, however, because of their high cost.

Willis, P. B.↗

Copolyimide with a combination of flexibilizing groups

Copolyimides are prepared by reacting one or more aromatic dianhydrides with a meta-substituted phenylene diamine and an aromatic bridged diamine. The incorporation of meta-substituted phenylene diamine derived units and bridged aromatice diamine derived units into the linear aromatic polymer backbone results in a copolyimide of improved flexibility, processability, and melt-flow characteristics. The copolyimides are especially useful as thermoplastic hot-melt adhesives.

Stclair, Terry L.↗

Thermoplastic coating of carbon fibers

A continuous powder coating system was developed for coating carbon fiber with LaRC-TPI (Langley Research Center-Thermoplastic Polyimide), a high-temperature thermoplastic polymide invented by NASA-Langley. The coating line developed used a pneumatic fiber spreader to separate the individual fibers. The polymer was applied within a recirculating powder coating chamber then melted using a combination of direct electrical resistance and convective heating to make it adhere to the fiber tow. The tension and speed of the line were controlled with a dancer arm and an electrically driven fiber wind-up and wind-off. The effects of heating during the coating process on the flexibility of the prepreg produced were investigated. The uniformity with which the fiber tow could be coated with polymer also was examined. Composite specimens were fabricated from the prepreg and tested to determine optimum process conditions. The study showed that a very uniform and flexible prepeg with up to 50 percent by volume polymer could be produced with this powder coating system. The coating line minimized powder loss and produced prepeg in lengths of up to 300 m. The fiber spreading was found to have a major effect on the coating uniformity and flexibility. Though test results showed low composite tensile strengths, analysis of fracture surfaces under scanning electron microscope indicated that fiber/matrix adhesion was adequate.

Edie, D. D.↗

Poly(arylene ether imidazole) surfacing films for flat and parabolic structures

Films of thermoplastic poly(arylene ether imidazole)s (PAEIs) are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to approximately -196 C.

Connell, John W.↗

Large-Strain Transparent Magnetoactive Polymer Nanocomposites

A document discusses polymer nano - composite superparamagnetic actuators that were prepared by the addition of organically modified superparamagnetic nanoparticles to the polymer matrix. The nanocomposite films exhibited large deformations under a magnetostatic field with a low loading level of 0.1 wt% in a thermoplastic polyurethane elastomer (TPU) matrix. The maximum actuation deformation of the nanocomposite films increased exponentially with increasing nanoparticle concentration. The cyclic deformation actuation of a high-loading magnetic nanocomposite film was examined in a low magnetic field, and it exhibited excellent reproducibility and controllability. Low-loading TPU nanocomposite films (0.1-2 wt%) were transparent to semitransparent in the visible wavelength range, owing to good dispersion of the magnetic nanoparticles. Magnetoactuation phenomena were also demonstrated in a high-modulus, high-temperature polyimide resin with less mechanical deformation.

Meador, Michael A.↗

Tough, processable simultaneous semi-interpenetrating polyimides

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance, and mechanical performance when compared to the commercial Thermid materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR150B2) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.

Pater, Ruth H.↗

Tough, processable simultaneous semi-interpenetrating polyimides

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.

Pater, Ruth H.↗

LaRC(TM)-IA Copolyimides

Copolyimides modified versions of LaRC(TM)-IA thermoplastic polyimide formulated by incorporating moieties of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and, alternatively, isophthaloyldiphthalic anhydride (IDPA) into LaRC(TM)-IA polymer backbones. Exhibit higher glass-transition temperatures and retain greater fractions of lower-temperature shear moduli at higher temperatures. Copolyimides spun into fibers or used as adhesives, molding powders, or matrix resins in many applications, especially in fabrication of strong, lightweight structural components of aircraft.

St. Clair, Terry L.↗

Poly(arylene ether imidazole) surfacing films for flat and parabolic structures

Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.

Connell, John W.↗

Freeze-drying for morphological control of high performance semi-interpenetrating polymer networks. III

The feasibility of using a freeze-drying (solvent removal by sublimation) approach for controlling the morphology of a high-performance semi-IPN is assessed. A high-performance thermoplastic polyimide and commercially available 4,4'-bismaleimide diphenylenemethane were dissolved in a solvent, 1,3,5-trioxane. The solvent was removed from the constituents by freeze-drying. For purposes of comparison, the constituents were dissolved in a high-boiling-point solvent, N,N-dimethylformamide. The solvent was removed from the solution by evaporation. The physical and mechanical properties and phase morphology of the neat resins and composites prepared by freeze-drying and traditional solution methods are presented and compared. It is concluded that the TG is higher and that the magnitude of minor constituent separation is less in the freeze-dry processed materials than for the processed solution.

Hsiung, H. J.↗

Semi-interpenetrating polymer network for tougher and more microcracking resistant high temperature polymers

This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide. An improved high temperature matrix resin is provided which is capable of performing at 316 C in air for several hundreds of hours. This resin has significantly improved toughness and microcracking resistance, excellent processability and mechanical performance, and cost effectiveness.

Pater, Ruth H.↗

A tough high performance composite matrix

This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide. An improved high temperature matrix resin is provided which is capable of performing in the 200 to 300 C range. This resin has significantly improved toughness and microcracking resistance, excellent processability, mechanical performance and moisture and solvent resistances.

Pater, Ruth H.↗

Tough high performance composite matrix

This invention is a semi-interpentrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide. Provided is an improved high temperature matrix resin which is capable of performing in the 200 to 300 C range. This resin has significantly improved toughness and microcracking resistance, excellent processability, mechanical performance, and moisture and solvent resistances.

Pater, Ruth H.↗

Tough, processable semi-interpenetrating polymer networks from monomer reactants

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance, and mechanical performance, when compared to the commercial Thermid materials. This simultaneous semi-IPN was prepared by mixing the monomer precursors of Thermid AL-600 (a thermoset) and NR-150B2 (a thermoplastic) and allowing the monomers to react randomly upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene end-capped polyimides which were previously inherently brittle and difficult to process.

Pater, Ruth H.↗

Loading rate sensitivity of open hole composites in compression

The results are reported of an experimental study on the compressive, time-dependent behavior of graphite fiber reinforced polymer composite laminates with open holes. The effect of loading rate on compressive strength was determined for six material systems ranging from brittle epoxies to thermoplastics at both 75 F and 220 F. Specimens were loaded to failure using different loading rates. The slope of the strength versus elapsed time-to-failure curve was used to rank the materials' loading rate sensitivity. All of the materials had greater strength at 75 F than at 220 F. All the materials showed loading rate effects in the form of reduced failure strength for longer elapsed-time-to-failure. Loading rate sensitivity was less at 220 F than the same material at 70 F. However, C12000/ULTEM and IM7/8551-7 were more sensitive to loading rate than the other materials at 220 F. AS4/APC2 laminates with 24, 32, and 48 plies and 1/16 and 1/4 inch diameter holes were tested. The sensitivity to loading rate was less for either increasing number of plies or larger hole size. The failure of the specimens made from brittle resins was accompanied by extensive delaminations while the failure of the roughened systems was predominantly by shear crippling. Fewer delamination failures were observed at the higher temperature.

Lubowinski, Steve J.↗

Loading rate sensitivity of open-hole composite specimens in compression

The results are reported of an experimental study on the compressive, time-dependent behavior of graphite fiber reinforced polymer composite laminates with open holes. The effect of loading rate on compressive strength was determined for six material systems ranging from brittle epoxies to thermoplastics at both 75 F and 220 F. Specimens were loaded to failure using different loading rates. The slope of the strength versus elapsed time-to-failure curve was used to rank the materials' loading rate sensitivity. All of the materials had greater strength at 75 F than at 220 F. All the materials showed loading rate effects in the form of reduced failure strength for longer elapsed-time-to-failure. Loading rate sensitivity was less at 220 F than the same material at 70 F. However, C12000/ULTEM and IM7/8551-7 were more sensitive to loading rate than the other materials at 220 F. AS4/APC2 laminates with 24, 32, and 48 plies and 1/16 and 1/4 inch diameter holes were tested. The sensitivity to loading rate was less for either increasing number of plies or larger hole size. The failure of the specimens made from brittle resins was accompanied by extensive delaminations while the failure of the roughened systems was predominantly by shear crippling. Fewer delamination failures were observed at the higher temperature.

Lubowinski, S. J.↗