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At least 181 records · Page 10

Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits

Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 produced by a laser-interference setup that would theoretically yield a periodicity of 1.7 μm, which is near the 1.6–2 μm structuring limit that was estimated based on thermal diffusion length scale for an 8 ns laser pulse. The results show that although the expected periodic interference structuring was not attained, the melt-induced texturing was affected by the laser-interference profile. Single-lap shear tests were performed with specimen surfaces prepared by traditional abrasion and laser-interference structuring methods. Several laser processing parameters, such as the laser spot size, density, number of pulses, and raster speed, were studied. Scanning electron microscope and profilometry measurements were used to characterize the processed surface microstructures. Web-like structures, which indicate widespread melting, were shown to be formed at different processing conditions. Based on the surface topologies investigated, two laser raster speeds were selected to make single-lap-joint specimens. Baseline joints were prepared by abrading joining specimens. The shear-lap strength and displacement at maximum load were shown to be higher by 16.8% and 43.8% for the laser-structured specimens than those of the baseline specimens, respectively. Moreover, the load-displacement curves indicated that the laser-structured joints were more ductile than those without laser-structuring. The increased ductility for the laser-structured joints was found to yield an increase in the energy absorbed during shear-lap testing of approximately of 80–90% over those measured for baseline joints. It is another indicator that laser-interference structuring enhanced the bonding performance of single-lap shear joints.

36 MATERIALS SCIENCE↗

Effect of Surface Preparation and Gas Flow on Nitrogen Atom Surface Recombination

The effects of surface preparation and gas flow on the recombination of nitrogen atoms at copper and platinum surfaces were determined. Atoms were generated by an electrodeless 2450-megacycle-per-second discharge, and their concentration was measured by gas-phase titration with nitric oxide. Test surfaces were either vacuum-evaporated films or spheres machined from bulk metal and cemented around small glass-bead thermistors. Heat released by recombination was measured as the difference in electrical energy required to maintain a given thermistor temperature with and without a catalytic surface exposed. Recombination coefficients measured at flow velocities of 1120, 1790, 2250, and 3460 centimeters per second and at pressures of 0.42 and 0.59 millimeter of mercury showed that flow conditions had no effect. The results were also independent of atom concentration. A rough indication of the temperature dependence was obtained; it was greater for copper than for platinum. Platinum films deposited on platinum or on glass had the same activity - about 3 percent of the atoms impinging recombined. With copper, however, the glass substrate greatly reduced the percent of atoms recombining over that of a bulk copper substrate where 4 percent of the impinging atoms recombined. This effect could be overcome by depositing a second film on top of the first. Bulk metal samples were subjected to various surface treatments including polishing, degreasing with a chlorinated hydrocarbon, washing with nitric acid, and rinsing with water. Polished, degreased platinum had low activity compared to an evaporated film, but nitric acid treatment made it equivalent. Polished, degreased copper was only slightly less active than a copper film; nitric acid etching decreased the activity still further, probably by preferentially exposing facets of low catalytic efficiency.

Prok, George M.↗

Effect of barrier height on friction behavior of the semiconductors silicon and gallium arsenide in contact with pure metals

Friction experiments were conducted for the semiconductors silicon and gallium arsenide in contact with pure metals. Polycrystalline titanium, tantalum, nickel, palladium, and platinum were made to contact a single crystal silicon (111) surface. Indium, nickel, copper, and silver were made to contact a single crystal gallium arsenide (100) surface. Sliding was conducted both in room air and in a vacuum of 10 to the minus 9th power torr. The friction of semiconductors in contact with metals depended on a Schottky barrier height formed at the metal semiconductor interface. Metals with a higher barrier height on semiconductors gave lower friction. The effect of the barrier height on friction behavior for argon sputtered cleaned surfaces in vacuum was more specific than that for the surfaces containing films in room air. With a silicon surface sliding on titanium, many silicon particles back transferred. In contrast, a large quantity of indium transferred to the gallium arsenide surface.

Mishina, H.↗

Indirect electrochemical method for high accuracy quantification of protein adsorption on gold surfaces

We demonstrate the use of copper underpotential deposition (UPD) for measurement of the electrochemically active surface area of a protein-modified gold electrode. The kinetics of adsorption and the subsequent structural rearrangement of β-casein, as a model protein, on the surface of a gold electrode have been followed over time. The protein-free surface area was determined by measuring the charge derived from UPD copper deposition on the non-blocked surface area at different stages of adsorption. The behaviour of β-casein adsorption as a function of surface roughness and the microstructure of the gold electrode, as well as the concentration of the protein solution, are studied using this method.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Angular Distribution of Elastically Scattered Electrons Determined and Its Effect on Collector Performance Computed

It has been demonstrated that the suppression of secondary electron emission significantly improves the performance of electron beam collectors (ref. 1). However, a complete analysis of the effects of secondary electron emission with respect to collector performance has not been possible because of the lack of quantitative data on angular distributions of secondary electrons. Secondary electrons are emitted with energies ranging from near zero to the energy of the incident primary. For our purposes, we define elastically scattered electrons as secondary electrons within 20 percent of the incident energy. Elastically scattered electrons are of great concern because their energy allows them to follow trajectories that can carry them almost anywhere within the vacuum envelope. If these secondaries leave the collector and reenter the slow wave circuit, they can produce undesired signal distortion and oscillation.This apparatus, which was built by Krainsky (ref. 2), was used at the NASA Lewis Research Center to obtain detailed measurements of the angular distributions of elastically scattered secondaries. Data were obtained for three surfaces of significant interest to collector applications: highly polished copper, copper roughened by ion sputtering, and isotropic graphite. Lewis researchers discovered that elastically scattered electrons have a complex angular distribution that is strongly dependent on the atomic number and surface morphology of the target material, as well as the energy and angle of incidence of the primary beam. At low energies, secondary emission from polished copper in the chosen energy range is primarily directed back to the source of primary electrons (backscattering). Forward scattering increases with primary energy until, at high energies, forward scattering dominates the angular distribution. Although back-scattered secondaries dominate the distributions of the textured copper surface, the yield is substantially lower. From the standpoint of secondary emission, isotropic graphite is the most attractive material because it exhibits low yield and little back scattering.

Krainsky, Isay L.↗

A dynamic technique for measuring surface tension at high temperatures in microgravity environment

The feasibility of a dynamic technique for measuring surface tension of liquid metals at high temperatures in a microgravity environment was demonstrated. The basic method involves heating a tubular specimen resistively from ambient temperature through its melting point in about 1 sec by passing an electrical current pulse through it, while simultaneously recording the pertinent experimental quantities. Static equilibrium for the molten specimen is achieved in a microgravity environment by splitting the current after it passes through the specimen tube and returning a fraction along the tube axis, and the remaining fraction outside the specimen. Adjustments to the current split enable a balance between the magnetic and surface tension forces acting on the specimen. Values for surface tension are determined from measurements of the equilibrium dimensions of the molten specimen tube, and the magnitudes of the currents. Rapid melting experiments, performed during microgravity simulations with the NASA KC-135 aircraft, yield a value for the surface tension of copper at its melting point which is in agreement with literature data. Measurements of surface tension of a refractory metal (tantalum) are underway.

Miiller, A. P.↗

Removal of radon progeny from delicate surfaces

210 Po α-decay-driven neutron background is a concern for many rare event search experiments. It is a difficult to control background because its radiogenic component depends on the air exposure history of parts. In this study, we demonstrate that about half of the radon progeny 210 Po can be removed from copper and silicon surfaces relatively easily by wiping a copper sample with acetone-wetted tissue and a silicon detector with acetone soaked cotton balls. For a copper sample, we demonstrate that long-lived 210 Pb is removed with similar effectiveness. For copper, allocated the longest counting time, additional wiping was found to be largely ineffective. For silicon, the removal effectiveness has large uncertainties. Additional cleaning showed a small but statistically significant effect. Here, capitalizing on this trivial cleaning step will allow experiments to relax their requirements on the allowable air exposure time during construction, leading to cost and time savings.

Radioactivity↗

Preventing Fires in Cryogenic Oxidizer Lines

Friction and compression induced ignition prevented by heat-dissipation layer. Thin layer of copper placed inside surfaces of pipes and other parts in contact with flowing liquid oxygen, fluorine, or other oxidizers. Copper layer of only 0.001 to 0.005 inch (0.0254 to 0.127 mm) ensures heat away from hotspots thereby discouraging ignition. Copper layer increases oxygen ignition threshold of pipe by 5 to 20 times.

Wagner, W. R.↗

Enhanced Water Interaction at Dual Cu Sites Within the Defects on a Copper Sulfide Layer

Electrochemical transformations of stable molecules and water into fuels and value-added chemicals require efficient catalyst surfaces. Introducing controlled defects at atomic scales can offer promising routes to enhance catalyst performance. In this study, we found novel dual copper site (-Cu-Cu-) defects within a copper sulfide (Cu-S) layer supported on Cu(111). Using scanning tunneling microscopy (STM) and density functional theory (DFT), we found these dual copper sites enhance molecular adsorption strength, specifically for water molecules, compared to intact Cu-S layer or pristine copper surfaces. This discovery highlights the potential of engineered dual-site copper defects to advance electrochemical catalytic materials, particularly for reactions involving water activation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Numerical benchmark of transient pressure-driven metallic melt flows

Fluid dynamics simulations of melting and crater formation at the surface of a copper cathode exposed to high plasma heat fluxes and pressure gradients are presented. The predicted deformations of the free surface and the temperature evolution inside the metal are benchmarked against previously published simulations. Despite the physical model being entirely hydrodynamic and ignoring a variety of plasma–surface interaction processes, the results are also shown to be remarkably consistent with the predictions of more advanced models, as well as experimental data. This provides a sound basis for future applications of similar models to studies of transient surface melting and droplet ejection from metallic plasma-facing components after disruptions.

36 MATERIALS SCIENCE↗

Elucidation of Ce/Zr ratio effects on the physical properties and catalytic performance of CuO x /Ce y Zr 1− y O 2 catalysts

Although cerium oxide (CeO 2 ) is widely used as a catalyst support, its limited defect sites and surface oxygen vacancy/mobility should be improved. The incorporation of zirconium (Zr) in the cerium (Ce) lattice is shown to increase the number of oxygen vacancies and improve catalytic activity. Using a fixed surface density (SD) of copper (∼2.3 Cu atoms per nm 2 ) as a surface species, the role of the support (Ce y Zr 1−y O 2 (y = 1.0, 0.9, 0.6, 0.5, and 0.0)) and defect site effects in the CO oxidation reaction was investigated. Spectroscopic (e.g., Raman, XRD, XPS) and microscopic (e.g., SEM-EDX, HR-TEM) characterization techniques were applied to evaluate the defect sites, crystallite size, lattice parameters, chemical composition, oxidation states of elements and microstructure of the catalysts. Here, the CO oxidation reaction with varied CO : O 2 ratios (1 : 5, 1 : 1, and 1 : 0.5 (stoichiometric)) was used as a model reaction to describe the relationship between the structure and the catalytic performance of each catalyst. Based on the characterization results of Ce y Zr 1−y O 2 materials, the addition of Zr causes physical and chemical changes to the overall material. The inclusion of Zr into the structure of CeO 2 decreased the overall lattice parameter of the catalyst and increased the number of defect sites. The prepared catalysts were able to reach complete CO conversion (∼100%) at low temperature conditions (<200 °C), each showing varied reaction activity. The difference in CO oxidation activity was then analyzed and related to the structure, wherein Cu loading, surface oxygen vacancies, reduction–oxidation ability, CuO x –support interaction and oxygen mobility in the catalyst were the crucial descriptors.

36 MATERIALS SCIENCE↗

Single pass rub phenomena - Analysis and experiment

An experimental and analytical investigation is presented of contact phenomena for the case of a fully-dense copper gas path seal segment which is rubbed by a single steel blade tip at room temperature. The experiments were executed on a pendulum-type test device, with forces, rub energy, surface temperature and residual deformation being determined for each single-path rub test. The thermal and mechanical factors influencing single-pass rub surface temperatures were modeled analytically. It is found that large plastic strains occurred on or near the contact surface of the copper rub specimens. A study of the influence of various material properties on surface temperature showed that increased thermal conductivity of the stationary component played a role in lowering contact temperatures. Increased thermal conductivity of the moving blade tip component and increased thermal diffusivity of the stationary material also had a beneficial effect.

Kennedy, F. E.↗

Generalized Analysis of Dynamic Flow Fouling on Heat Transfer Surfaces

Several energy applications involve flow of untreated heat transfer fluids that contain trace amounts of mineral salts, such as calcium carbonate and calcium sulfate, which show reverse solubility with temperature. The gradual accretion of these salts onto the heat transfer surfaces causes fouling that degrades thermal performance over time. While fouling of bare surfaces has been extensively studied, fouling of nonwetting superhydrophobic or liquid-infused surfaces is less understood, especially under dynamic flow conditions. This study presents a systematic experimental analysis to elucidate dynamic flow fouling of calcium carbonate and calcium sulfate on smooth, superhydrophobic and liquid-infused surfaces in a generalized manner. Here, copper tubes with modified inner surface wettability are fabricated and subjected to forced convection at different flow rates and fouling salt concentrations. Fouling characteristics of the two salts on the different surfaces are examined through microstructural analysis, and quantified in terms of asymptotic fouling resistance that measures the total extent of fouling, and a threshold time, which correlates to the onset of significant fouling. Using Taguchi design of experiments, the study reports, for the first time, closed-form analytical relationships for the asymptotic fouling thermal resistance and threshold time on the Reynolds number, dimensionless concentration of fouling agent and dimensionless infused liquid viscosity that represents the different surface types in a unified manner. It is shown that the analytical model accurately predicts the fouling characteristics in up to about 97% of the data, based on which contour maps of optimum surface designs for minimizing fouling resistance are presented. The results provide information on designing surfaces for reduced fouling or for estimating the fouling characteristics for a given surface in applications.

36 MATERIALS SCIENCE↗

Identification of Auger mechanisms responsible for low energy electron emission from graphene on copper using Auger-gamma coincidence spectroscopy

We have applied positron annihilation induced Auger-gamma coincidence spectroscopy to identify important mechanisms responsible for the emission of low energy electrons following the sudden creation of holes in bilayer graphene on copper substrate. The novel surface spectroscopic method measures the energy of the Doppler shifted annihilation gamma photon in coincidence with the Auger electron emitted following the relaxation of the hole created by the annihilation of a surface electron with a surface trapped positron. By extracting and theoretically modelling the annihilation gamma spectra coincident with low energy electrons, we associate majority of the intensity in the low energy (7 eV–25 eV) region of the Auger spectrum to electron emission following Auger decays of 2s holes in adsorbed oxygen and deep valence holes in graphene. We provide additional support to this conclusion by showing that most of the Auger electrons with energy less than ~ 25 eV are coincident with gamma photons with small Doppler shift (511 keV–512 keV) indicating that the primary electron whose annihilation resulted in low energy Auger electron emission had small momentum parallel to the gamma emission direction. On the other hand, majority of the Auger electrons measured in coincidence with the photons having maximum Doppler shift (515 keV–521 keV) were emitted following the decay of core holes (C 1s and O 1s). Furthermore, by selecting annihilation gamma photons coincident only with the O KVV (from surface adsorbed oxygen), C KVV (graphene), and Cu MVV (copper substrate) Auger electrons, we have also experimentally derived the energy spectrum of Doppler shifted gamma photons resulting from the annihilation of positrons with 1s electrons of O, 1s electrons of C and 3p electrons of Cu respectively. Model Doppler broadened gamma spectra produced using ab-initio calculations agree well with the experimentally derived line shapes. This demonstrates the ability of Auger-gamma coincidence method to experimentally resolve the Doppler broadened annihilation gamma spectrum from surfaces into its veiled electronic level constituents which has, heretofore, relied solely on theoretical analysis. Our results also demonstrate that the line shape of the Doppler broadened annihilation gamma peak reflect the chemical composition of the topmost atomic layer and can thus be used to characterize both external and inaccessible surfaces of porous materials.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Role of plastic deformation in wear of copper and copper - 10-percent-aluminum alloy in cryogenic fuels

High-purity copper specimens and a copper-aluminum (10%) alloy specimen were subjected to sliding against Type 440 C in cryogenic fuel environments. It was found that virtually all wear occurred by the plastic deformation of a recrystallized layer extending to about 10 micrometers below the wear scar surface of the copper or copper alloy. The wear debris was in the form of a layered structure adhering to the exit region of the wear scar. Measurements on the high purity copper specimens indicated that the wear rate was proportional to the applied load and to the sliding velocity squared. A physical model of the wear process is proposed to account for these observations.

Bill, R. C.↗

Carbon and carbon-coated electrodes for multistage depressed collectors for electron-beam devices - A technology review

Various aspects of carbon and carbon-coated multistaged depressed collector (MDC) electrode technology are reviewed. The physical properties of untreated graphite electrodes, ion-textured graphite electrodes, and textured, carbon-coated copper electrodes, and surface treatment procedures for these electrodes are described. The secondary electron emissions of the three electrode types are analyzed. MDC fabrication methods are discussed. The performances of MDCs fabricated with untreated graphite electrodes, ion-textured graphite electrodes, and textured, carbon-coated copper electrodes are evaluated. MDC and TWT efficiency levels for tubes fabricated with the three materials are measured.

Curren, Arthur N.↗