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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10

Distributed Capacitive Sensor for Sample Mass Measurement

Previous robotic sample return missions lacked in situ sample verification/ quantity measurement instruments. Therefore, the outcome of the mission remained unclear until spacecraft return. In situ sample verification systems such as this Distributed Capacitive (DisC) sensor would enable an unmanned spacecraft system to re-attempt the sample acquisition procedures until the capture of desired sample quantity is positively confirmed, thereby maximizing the prospect for scientific reward. The DisC device contains a 10-cm-diameter pressure-sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in close proximity to an opposing rigid substrate with a narrow gap. The deformation of the membrane makes the gap narrower, resulting in increased capacitance between the two parallel plates (elastic membrane and rigid substrate). C-V conversion circuits on a nearby PCB (printed circuit board) provide capacitance readout via LVDS (low-voltage differential signaling) interface. The capacitance method was chosen over other potential approaches such as the piezoelectric method because of its inherent temperature stability advantage. A reference capacitor and temperature sensor are embedded in the system to compensate for temperature effects. The pressure-sensitive membranes are aluminum 6061, stainless steel (SUS) 403, and metal-coated polyimide plates. The thicknesses of these membranes range from 250 to 500 m. The rigid substrate is made with a 1- to 2-mm-thick wafer of one of the following materials depending on the application requirements glass, silicon, polyimide, PCB substrate. The glass substrate is fabricated by a microelectromechanical systems (MEMS) fabrication approach. Several concentric electrode patterns are printed on the substrate. The initial gap between the two plates, 100 m, is defined by a silicon spacer ring that is anodically bonded to the glass substrate. The fabricated proof-of-concept devices have successfully demonstrated tens to hundreds of picofarads of capacitance change when a simulated sample (100 g to 500 g) is placed on the membrane.

Toda, Risaku↗

All-inorganic spark-chamber frame

Outgassing is reduced by using ceramic and glass materials exclusively. Frames are assembled from four beams with rabbeted ends. Only ceramic or glass adhesives are used, and printed circuit is applied by screen printing directly on beams. Inorganic frames provide stable spark-chamber operation without gas refill, useful in terrestrial gamma-ray studies, in high-energy physics research, and other applications.

Heslin, T. M.↗

Hot-Gas Nozzle for Desoldering Leadless IC's

Simple hand-held tool removes leadless, surface-mounted integrated circuits (IC's) from printed-circuit boards. Nozzle used with hot-air gun of type used to apply heat-shrink tubing or with some other source of hot gas. Rectangular end of nozzle and deflector shape airflow pattern to concentrate heat directly on soldering pads located around edge of IC's to heat them quickly and uniformly.

Hanlon, Mark T.↗

Fault Detection, Isolation and Recovery (FDIR) Portable Liquid Oxygen Hardware Demonstrator

The Fault Detection, Isolation and Recovery (FDIR) hardware demonstration will highlight the effort being conducted by Constellation's Ground Operations (GO) to provide the Launch Control System (LCS) with system-level health management during vehicle processing and countdown activities. A proof-of-concept demonstration of the FDIR prototype established the capability of the software to provide real-time fault detection and isolation using generated Liquid Hydrogen data. The FDIR portable testbed unit (presented here) aims to enhance FDIR by providing a dynamic simulation of Constellation subsystems that feed the FDIR software live data based on Liquid Oxygen system properties. The LO2 cryogenic ground system has key properties that are analogous to the properties of an electronic circuit. The LO2 system is modeled using electrical components and an equivalent circuit is designed on a printed circuit board to simulate the live data. The portable testbed is also be equipped with data acquisition and communication hardware to relay the measurements to the FDIR application running on a PC. This portable testbed is an ideal capability to perform FDIR software testing, troubleshooting, training among others.

Oostdyk, Rebecca L.↗

Radio frequency electrical resistance measurement under destructive pulsed magnetic fields

We developed a resistance measurement using radio frequency reflection to investigate the electrical transport characteristics under destructive pulsed magnetic fields above 100 T. A sample stage consisting of a homemade flexible printed circuit reduced the noise caused by the induced voltage from the pulsed magnetic fields, improving the accuracy of the measurements of the reflected waves. From the obtained reflectance data, the absolute value of the magnetoresistance was successfully determined by analyzing the phase with admittance charts. In conclusion, these developments enable more accurate and comprehensive measurements of electrical resistance in pulsed magnetic fields.

47 OTHER INSTRUMENTATION↗

Exploring the Use of Flexible Circuit Boards to the Increase Power Density of a Rotary Triboelectric Nanogenerator

EExpansion on previous triboelectric nanogenerator (TENG) research that investigated a freestanding rotary TENG. The previous prototype used a single printed circuit board (PCB) stator with exposed copper electrodes and an arcylic rotor with vinyl-cut fluorinated ethylene propylene (FEP) wedges. The second generation prototype again used a PCB stator but used a flexible PCB rotor consisting of alternating polyamide and copper wedges. This prototype was assembled in a stacked configuration, with the intent of increasing current output. Results indicated that the internal resistance of the prototype was decreased, allowing for higher current output. However, degradation of the power output was observed, which led to decay testing of the prototypes. To overcome charge decay, a self-exciting design is suggested as further work.

42 ENGINEERING↗

Epoxy / Silicone Potting Material Removal for Greater Recovery of Circuit Boards

This report documents an exploratory research project, “Epoxy/Silicone Potting Material Removal for Greater Recovery of Circuit Boards,” that investigated micro abrasion and laser ablation as potential cost effective methods for removal of epoxy and silicone potting material from printed circuit boards (PCBs) to expose components for testing and repair. The ability to cost effectively remove such PCB potting materials will improve PCB repair, remanufacture, and reuse opportunities with potential for sizable reductions in material use, E-waste, and energy. Laser ablation was identified as a method potentially warranting further investigation, in particular for epoxy based potting materials.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗

Packaging Of Control Circuits In A Robot Arm

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

Kast, William↗

Radio frequency mixing modules for superconducting qubit room temperature control systems

As the number of qubits in nascent quantum processing units increases, the connectorized RF (radio frequency) analog circuits used in first generation experiments become exceedingly complex. The physical size, cost, and electrical failure rate all become limiting factors in the extensibility of control systems. We have developed a series of compact RF mixing boards to address this challenge by integrating I/Q quadrature mixing, intermediate frequency/LO (local oscillator)/RF power level adjustments, and direct current bias fine tuning on a 40 × 80 mm 2 four-layer printed circuit board with electromagnetic interference shielding. The RF mixing module is designed to work with RF and LO frequencies between 2.5 and 8.5 GHz. The typical image rejection and adjacent channel isolation are measured to be ~27 dBc and ~50 dB. By scanning the drive phase in a loopback test, the module short-term amplitude and phase linearity are typically measured to be 5 ×10 -4 (V pp /V mean ) and 1 ×10 -3 radian (pk-pk). The operation of the RF mixing board was validated by integrating it into the room temperature control system of a superconducting quantum processor and executing randomized benchmarking characterization of single and two qubit gates. We measured a single-qubit process infidelity of 9.3(3) × 10 -4 and a two-qubit process infidelity of 2.7(1) × 10 -2 .

47 OTHER INSTRUMENTATION↗

Investigation of a Multi-Rotor Triboelectric Nanogenerator Using a Modular Flexible Circuit Board Stack

Triboelectric nanogenerators (TENGs) are a nascent class of energy harvester that are being explored for scavenging energy from small ocean waves. To date, they have been integrated in wave energy converters (WECs) designed to capture random motion caused by the perturbations of the ocean surface. Blue economy applications such as ocean observation can benefit greatly from more substantial wave-derived power, as such, the power output of existing TENG WECs must be increased several-fold to become viable. This study describes the conceptualization of a rotary TENG, and the subsequent efforts to increase its power output by stacking multiple stator and rotor pairs. In the latter part of this study, we introduce a novel means of incorporating a friction element into the design of the TENG by employing flexible printed circuit board (PCB) rotors. At rest, these flexible rotors will contact the stator, building static charges due to friction, at speed, these flexible rotors will be decoupled from the stator, reducing friction and allowing faster rotation. Initial results indicate that the power output of the flexible PCB rotor does not produce more power than a rigid, acrylic disk rotor, however the current output of the prototype is boosted, and the prototype is far more compact, allowing for a higher energy density than the rigid rotor prototype.

bench testing↗

Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils

Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal interfacial resistance (TIR) across ~1 µm to 100 µm junctions. Previously reported TIR of metal–polymer junctions utilize ASTM E1530-based two-block systems that measure the TIR by applying pressure across the interface through external heating and cooling blocks. Here, we report a novel modification of the ASTM-E1530 technique that employs integrated heaters and sensors to provide an intrinsic TIR measurement of an adhesively bonded metal–polymer junction. We design the measurement technique using finite element simulations to either passively suppress or actively compensate the lateral heat diffusion through the polymer, which can minimize the systematic error to ≲5%. Through proof-of-concept experiments, we report the TIR of metal–polymer interfaces made from DuPont’s Pyralux double-side copper-clad laminates, commonly used in flexible printed circuit boards. Our TIR measurement errors are <10%. We highlight additional sources of errors due to non-idealities in the experiment and discuss possible ways to overcome them. Our measurement technique is also applicable to interfaces that are electrically insulating such as adhesively joined metal–metal junctions and sputter-coated or welded metal–polymer junctions. Altogether, the technique is capable of measuring TIR ≳10 –5 m 2 KW –1 in bonded metal–polymer foils and can be tailored for in situ measurements in flexible electronics, circuit packaging, and other hybrid metal–polymer systems.

47 OTHER INSTRUMENTATION↗

Economic analysis of precious metal recovery from electronic waste through gas-assisted microflow extraction

The recycling of end-of-life (EoL) electronic products is motivated by the enormous investment of resources in their creation and the environmental concerns associated with electronic waste (e-waste). Hydrometallurgical methods that utilize conventional leaching and solvent extraction are often applied to extract target materials from e-waste; however, these techniques have significant technical and economic limitations when extracting high-value, low concentration metals from complex waste streams. This study proposes and evaluates a novel process based on gas-assisted microflow extraction (GAME) that efficiently recovers precious metals from waste printed circuit boards (WPCBs). Further, an economic analysis is conducted to verify the economic feasibility of the GAME-based process at an industrial scale. The economic outputs are further investigated to identify the most cost-effective production strategies, particularly with respect to the plant feedstock rate. It is envisioned that this study may establish a paradigm for making economically-informed decisions for sustainable technologies.

42 ENGINEERING↗

Optimization and Techno-Economic Comparison of Regenerators and Recuperators in sCO2 Recompression Brayton Cycles for Concentrating Solar Power Applications

Supercritical CO2 power cycles might be capable of providing the cost reductions and efficiency improvements necessary to reach concentrating solar power (CSP) cost targets, but require large, highly effective recuperators. Fixed-bed regenerators are a periodic heat exchanger that could be an effective yet low-cost alternative to these recuperators. This study presents a techno-economic comparison of regenerators and recuperators for a 100 MWe supercritical CO2 power cycle for CSP applications. We quantify the levelized cost of energy (LCOE) for the power plant with both types of heat exchangers, and explore sensitivity of LCOE to parameters such as CSP-specific capital costs, power cycle component capital costs, and regenerator valve replacements costs. Results indicate that the incumbent printed circuit heat exchangers achieve the lowest LCOE, unless the upper extreme of PCHE capital cost and lower extremes of regenerator and valve capital and O&M costs are realized. Sensitivity analysis also illustrates that the primary heat exchanger cost is the most influential of power cycle components, and that CSP component capital cost is more influential than power cycle capital costs. This illustrates the importance of reducing the cost of heliostats, receivers, and thermal energy storage for achieving CSP LCOE targets.

OTHER INSTRUMENTATION,SOLAR ENERGY↗

Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU↗

Flexible PCB Windings Size Optimization for Winding AC Resistance Minimization Under the Sinusoidal Voltage Regime

In this paper, optimization of the winding AC resistance of the flexible printed circuit board (FPCB) wire windings is performed. A one-dimensional model of the FPCB winding is introduced and an equation for the FPCB winding AC resistance and its low and medium frequency approximation are derived. The approximate FPCB winding AC resistance equation is used to derive optimum thickness of the FPCB winding conductor thickness at which minimum of winding AC resistance (global optimum) is achieved. The Finite Element Method analysis and experimental verification of derived equations (winding resistance, impedance, power loss, and temperature measurements) is performed in order validate derived model and winding resistance equation.

42 ENGINEERING↗