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NASA NTRS1998

Composite x-ray image assembly for large-field digital mammography with one- and two-dimensional positioning of a focal plane array

To demonstrate the feasibility of a novel large-field digital mammography technique, a 1024 x 1024 pixel Loral charge-coupled device (CCD) focal plane array (FPA) was positioned in a mammographic field with one- and two-dimensional scan sequences to obtain 950 x 1800 pixel and 3600 x 3600 pixel composite images, respectively. These experiments verify that precise positioning of FPAs produced seamless composites and that the CCD mosaic concept has potential for high-resolution, large-field imaging. The proposed CCD mosaic concept resembles a checkerboard pattern with spacing left between the CCDs for the driver and readout electronics. To obtain a complete x-ray image, the mosaic must be repositioned four times, with an x-ray exposure at each position. To reduce the patient dose, a lead shield with appropriately patterned holes is placed between the x-ray source and the patient. The high-precision motorized translation stages and the fiber-coupled-scintillating-screen-CCD sensor assembly were placed in the position usually occupied by the film cassette. Because of the high mechanical precision, seamless composites were constructed from the subimages. This paper discusses the positioning, image alignment procedure, and composite image results. The paper only addresses the formation of a seamless composite image from subimages and will not consider the effects of the lead shield, multiple CCDs, or the speed of motion.

Mammography/methods/statistics & numerical data↗

NASA NTRS2004

A 90GHz Bolometer Camera Detector System for the Green Bank Telescope

We describe a close-packed, two-dimensional imaging detector system for operation at 90GHz (3.3mm) for the 100 m Green Bank Telescope (GBT) This system will provide high sensitivity (<1mjy in 1s rapid imaging (15'x15' to 250 microJy in 1 hr) at the world's largest steerable aperture. The heart of this camera is an 8x8 close packed, Nyquist-sampled array of superconducting transition edge sensor bolometers. We have designed and are producing a functional superconducting bolometer array system using a monolithic planar architecture and high-speed multiplexed readout electronics. With an NEP of approx. 2.10(exp 17) W/square root Hz, the TES bolometers will provide fast linear sensitive response for high performance imaging. The detectors are read out by and 8x8 time domain SQUID multiplexer. A digital/analog electronics system has been designed to enable read out by SQUID multiplexers. First light for this instrument on the GBT is expected within a year.

Benford, Dominic J.↗

NASA NTRS2004

A 90GHz Bolometer Camera Detector System for the Green

We describe a close-packed, two-dimensional imaging detector system for operation at 90GHz (3.3 mm) for the 100m Green Bank Telescope (GBT). This system will provide high sensitivity (less than 1mJy in 1s) rapid imaging (15'x15' to 150 micron Jy in 1 hr) at the world's largest steerable aperture. The heart of this camera is an 8x8 close-packed, Nyquist-sampled array of superconducting transition edge sensor (TES) bolometers. We have designed and are producing a functional superconducting bolometer array system using a monolithic planar architecture and high-speed multiplexed readout electronics. With an NEP of approximately 2 x 10(exp -17) W/square root of Hz, the TES bolometers will provide fast, linear, sensitive response for high performance imaging. The detectors are read out by an 8x8 time domain SQUID multiplexer. A digital/analog electronics system has been designed to enable read out by SQUID multiplexers. First light for this instrument on the GBT is expected within a year.

Benford, Dominic J.↗

NASA NTRS2006

Reducing Stray Light To Characterize Nirspec Subsystems: The Focal Plane Array And Micro-Shutter Array

The James Webb Space Telescope (JWST) is an infrared, space-based telescope scheduled for launch in 2013. JWST includes four scientific instruments, including the Near Infrared Spectrometer (NIRSpec), which operates in the wavelength range from 0.6 to 5 microns. NASA/Goddard Space Flight Center (GSFC) is responsible for two NIRSpec subsystems: the detector subsystem, with its focal plane array (FPA), and the micro-shutter subsystem, with its micro-shutter array (MSA). The FPA is comprised of two side-by-side Rockwell Scientific HgCdTe 2kx2k detectors, with detectors and readout electronics optimized for low noise. The MSA is a GSFC developed micro-electro-mechanical system (MEMS) that serves as a programmable slit mask, allowing NIRSpec to obtain simultaneous spectra of >100 objects in a single field of view. We present the optical characterization test plan of the FPA. The test plan is driven by many requirements: cryogenic operating temperature, a flight-like beam shape, and multi-wavelength photon flux from 1 to 60,000 per second, thus low stray light is critical. We use commercial optical modeling software to predict stray light effects at the FPA. We also present the optical contrast test plan of the MSA. Since each individual shutter element operates in on/off fashion, the most important optical metric is contrast. The MSA structure is designed to minimize stray and scattered light, and the test setup reduces stray light such that the optical contrast requirement is met.

Connelly, Joseph A.↗

NASA NTRS1993

Cosmic-ray Detector with Interdigitated-Finger Pixels for two-dimensional Position Information from a Singel Wafer Side

This paper describes a type of cosmic ray detector for isotopic and energy detection of energetic nuclei which derives both dimensions of position information from one side of the detector. This simplifies the required readout electronics, since only one precision amplifier connected to the other side is required for an accurate detection of the energy loss.

Cosmic-Ray Detector↗

NASA NTRS2006

Enhancing the ATIC Charge Resolution

The Advanced Thin Ionization Calorimeter (ATIC) experiment measures the energy spectra of elements, from H to Fe, in the energy region from about 100 GeV to tens of TeV. The ATIC instrument was flown twice in long-duration balloon flights around the South Pole; the ATIC-1 test flight during Dec. 2000 - Jan. 2001 and the ATIC-2 science flight during Dec. 2002 - Jan. 2003. Analyses of both datasets have, to date, relied upon the highly segmented Silicon Matrix (SiM) detector to separate the incident cosmic ray from the calorimeter backscatter and to identify the charge. This method has worked well, enabling ATIC to separate protons from helium and to resolve all the major species up through iron. This charge resolution can be significantly improved by restricting the analysis to particle trajectories that pass through two SiM pixels at the cost of using only a fraction of the potential instrument geometry. However, immediately below the SiM is the two layer SI hodoscope (x, y) consisting of Bicron BC-408 plastic scintillator 2 cm wide, 1 cm thick, 88.2 cm long strips viewed by Hamamatsu R5611 photomultiplier tubes on each end of each strip. The primary purpose of the ATIC hodoscopes is to provide a fast trigger, and each hodoscope includes two crossed layers of strips (42 per layer in the case of Sl) providing supplemental particle trajectory information. The hodoscope readout electronics were designed to provide reasonable charge resolution over the dynamic range from protons through iron. This presentation discusses the S 1 hodoscope energy deposit calibrations, examines the charge resolution possible with this detector and investigates combining the S1 and SiM charge measurements to improve the overall ATIC charge resolution while minimizing degradation of the instrument geometry.

Guzik, T. G.↗

NASA NTRS2007

Fabrication of a Thermally Isolated and Pre-amplified Transistor Module with Polyimide Micro-wires for Cryogenic Detectors

For use in cryogenic applications such as bolometer and x-ray microcalorimeter arrays, pre-amplifying Junction Field Effect Transistors (JFETs) are often required for the readout electronics. The optimum operating temperature of the JFETs is 130 Kelvin while the cryogenic detectors operate in the milli-Kelvin range. Thus, the JFETs must be heated up but thermally isolated from the surrounding cryogenic instruments. In the past, the thermal isolation was accomplished by suspending the JFETs with low conductance wires such as manganium or stainless steel on a Kevlar support platform [I]. This also achieved electrical connections. However, this assembly required manual soldering work, which could raise a reliability issue for the cryogenic applications. In order to eliminate the manual work, polyimide micro-wires were developed [2]. The wires must be of sufficient length to decrease the heat load and in tension to prevent microphonic noise from vibration of the wires: the polyimide wires were patterned into llS"shaped curves over a thin metal wires such as aluminum, titanium, or niobium. The bilayer of the films were then suspended by etching silicon substrate thus to make freestanding air bridges (enough explanation?). In this paper, we present a method to fabricate micromachined JFET mechanical modules suspended by polyimide Pyraline micro-wires and heated up with built-in aluminum micro-heaters.

Oh, L. H.↗

NASA NTRS2008

Hard-X-Ray/Soft-Gamma-Ray Imaging Sensor Assembly for Astronomy

An improved sensor assembly has been developed for astronomical imaging at photon energies ranging from 1 to 100 keV. The assembly includes a thallium-doped cesium iodide scintillator divided into pixels and coupled to an array of high-gain avalanche photodiodes (APDs). Optionally, the array of APDs can be operated without the scintillator to detect photons at energies below 15 keV. The array of APDs is connected to compact electronic readout circuitry that includes, among other things, 64 independent channels for detection of photons in various energy ranges, up to a maximum energy of 100 keV, at a count rate up to 3 kHz. The readout signals are digitized and processed by imaging software that performs "on-the-fly" analysis. The sensor assembly has been integrated into an imaging spectrometer, along with a pair of coded apertures (Fresnel zone plates) that are used in conjunction with the pixel layout to implement a shadow-masking technique to obtain relatively high spatial resolution without having to use extremely small pixels. Angular resolutions of about 20 arc-seconds have been measured. Thus, for example, the imaging spectrometer can be used to (1) determine both the energy spectrum of a distant x-ray source and the angular deviation of the source from the nominal line of sight of an x-ray telescope in which the spectrometer is mounted or (2) study the spatial and temporal development of solar flares, repeating - ray bursters, and other phenomena that emit transient radiation in the hard-x-ray/soft- -ray region of the electromagnetic spectrum.

Myers, Richard A.↗

NASA NTRS2009

JWST Near-Infrared Detectors: Latest Test Results

The James Webb Space Telescope, an infrared-optimized space telescope being developed by NASA for launch in 2013, will utilize cutting-edge detector technology in its investigation of fundamental questions in astrophysics. JWST's near infrared spectrograph, NIRSpec utilizes two 2048 x 2048 HdCdTe arrays with Sidecar ASIC readout electronics developed by Teledyne to provide spectral coverage from 0.6 microns to 5 microns. We present recent test and calibration results for the NIRSpec flight arrays as well as data processing routines for noise reduction and cosmic ray rejection.

Smith, Erin C.↗

NASA NTRS2007

Array of Bolometers for Submillimeter- Wavelength Operation

A feed-horn-coupled monolithic array of micromesh bolometers is undergoing development for use in a photometric camera. The array is designed for conducting astrophysical observations in a wavelength band centered at 350 m. The bolometers are improved versions of previously developed bolometers comprising metalized Si3N4 micromesh radiation absorbers coupled with neutron- transmutation-doped Ge thermistors. Incident radiation heats the absorbers above a base temperature, changing the electrical resistance of each thermistor. In the present array of improved bolometers (see figure), the thermistors are attached to the micromesh absorbers by indium bump bonds and are addressed by use of lithographed, vapor-deposited electrical leads. This architecture reduces the heat capacity and minimizes the thermal conductivity to 1/20 and 1/300, respectively, of earlier versions of these detectors, with consequent improvement in sensitivity and speed of response. The micromesh bolometers, intended to operate under an optical background set by thermal emission from an ambient-temperature space-borne telescope, are designed such that the random arrival of photons ("photon noise") dominates the noise sources arising from the detector and readout electronics. The micromesh is designed to be a highly thermally and optically efficient absorber with a limiting response time of about 100 s. The absorber and thermistor heat capacity are minimized in order to give rapid speed of response. Due to the minimization of the absorber volume, the dominant source of heat capacity arises from the thermistor.

Bock, James↗

NASA NTRS2010

Inexpensive Implementation of Many Strain Gauges

It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.

Berkun, Andrew C.↗

NASA NTRS2006

Miniature Housings for Electronics With Standard Interfaces

A family of general-purpose miniature housings has been designed to contain diverse sensors, actuators, and drive circuits plus associated digital electronic readout and control circuits. The circuits contained in the housings communicate with the external world via standard RS-485 interfaces.

Howard, David E.↗

NASA NTRS2011

Process-Hardened, Multi-Analyte Sensor for Characterizing Rocket Plume Constituents

A multi-analyte sensor was developed that enables simultaneous detection of rocket engine combustion-product molecules in a launch-vehicle ground test stand. The sensor was developed using a pin-printing method by incorporating multiple sensor elements on a single chip. It demonstrated accurate and sensitive detection of analytes such as carbon dioxide, carbon monoxide, kerosene, isopropanol, and ethylene from a single measurement. The use of pin-printing technology enables high-volume fabrication of the sensor chip, which will ultimately eliminate the need for individual sensor calibration since many identical sensors are made in one batch. Tests were performed using a single-sensor chip attached to a fiber-optic bundle. The use of a fiber bundle allows placement of the opto-electronic readout device at a place remote from the test stand. The sensors are rugged for operation in harsh environments.

Goswami, Kisholoy↗

NASA NTRS2004

Method of Calibration for a Large Cathetometer System

A method of calibration has been devised for a pair of mutually orthogonal two-axis cathetometers that, when used together, yield measurements of three-dimensional positions of objects mounted on an optical bench. Each cathetometer has a horizontal travel of 1.8 m and a vertical travel of 1.2 m. The cathetometers are required to measure X, Y, and Z coordinates (see figure) to within plus or minus 0.005 in. (plus or minus 0.127 mm). Each cathetometer consists of an alignment telescope on a platform mounted on a two-dimensional translation stage. The knowledge required for calibration of each cathetometer is (1) the two-dimensional position of the cathetometer platform as a function of the electronic readouts of position encoders on the translation stage and (2) the amount of any angular misalignment (roll, pitch, and/or yaw) of the cathetometer platform as a function of the two-dimensional coordinates or the position-encoder readouts. By use of three equations derived from the applicable trigonometric relationships, the calibrated X, Y, and Z coordinates can be computed from the raw encoder readouts.

Toland, Ronald↗

NASA NTRS2012

Enabling Large Focal Plane Arrays through Mosaic Hybridization

We have demonstrated the hybridization of large mosaics of far-infrared detectors, joining separately fabricated sub-units into a single unit on a single, large substrate. We produced a single detector mockup on a 100mm diameter wafer and four mockup readout quadrant chips from a separate 100mm wafer. The individually fabricated parts were hybridized using a Suss FC150 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion (CTE) match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the mockup mosaic-hybridized detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently demonstrated.

Miller, Timothy M.↗

NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, TImothy M.↗

NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

Miller, Timothy M.↗

NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit patbs by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabric.ted parts were hybridized using a Suss FCI50 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, Timothy M.↗