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NASA NTRS2004

Effect of Random Thermal Spikes on Stirling Convertor Heater Head Reliability

Onboard radioisotope power systems being developed to support future NASA exploration missions require reliable design lifetimes of up to 14 yr and beyond. The structurally critical heater head of the high-efficiency developmental Stirling power convertor has undergone extensive computational analysis of operating temperatures (up to 650 C), stresses, and creep resistance of the thin-walled Inconel 718 bill of material. Additionally, assessment of the effect of uncertainties in the creep behavior of the thin-walled heater head, the variation in the manufactured thickness, variation in control temperature, and variation in pressure on the durability and reliability were performed. However, it is possible for the heater head to experience rare incidences of random temperature spikes (excursions) of short duration. These incidences could occur randomly with random magnitude and duration during the desired mission life. These rare incidences could affect the creep strain rate and therefore the life. The paper accounts for these uncertainties and includes the effect of such rare incidences, random in nature, on the reliability. The sensitivities of variables affecting the reliability are quantified and guidelines developed to improve the reliability are outlined. Furthermore, the quantified reliability is being verified with test data from the accelerated benchmark tests being conducted at the NASA Glenn Research Center.

Shah, Ashwin R.↗
NASA NTRS2004

Reliability Assessment Approach for Stirling Convertors and Generators

Stirling power conversion is being considered for use in a Radioisotope Power System for deep-space science missions because it offers a multifold increase in the conversion efficiency of heat to electric power. Quantifying the reliability of a Radioisotope Power System that utilizes Stirling power conversion technology is important in developing and demonstrating the capability for long-term success. A description of the Stirling power convertor is provided, along with a discussion about some of the key components. Ongoing efforts to understand component life, design variables at the component and system levels, related sources, and the nature of uncertainties is discussed. The requirement for reliability also is discussed, and some of the critical areas of concern are identified. A section on the objectives of the performance model development and a computation of reliability is included to highlight the goals of this effort. Also, a viable physics-based reliability plan to model the design-level variable uncertainties at the component and system levels is outlined, and potential benefits are elucidated. The plan involves the interaction of different disciplines, maintaining the physical and probabilistic correlations at all the levels, and a verification process based on rational short-term tests. In addition, both top-down and bottom-up coherency were maintained to follow the physics-based design process and mission requirements. The outlined reliability assessment approach provides guidelines to improve the design and identifies governing variables to achieve high reliability in the Stirling Radioisotope Generator design.

Shah, Ashwin R.↗
NASA NTRS2004

Reliability-Based Life Assessment of Stirling Convertor Heater Head

Onboard radioisotope power systems being developed and planned for NASA's deep-space missions require reliable design lifetimes of up to 14 yr. The structurally critical heater head of the high-efficiency Stirling power convertor has undergone extensive computational analysis of operating temperatures, stresses, and creep resistance of the thin-walled Inconel 718 bill of material. A preliminary assessment of the effect of uncertainties in the material behavior was also performed. Creep failure resistance of the thin-walled heater head could show variation due to small deviations in the manufactured thickness and in uncertainties in operating temperature and pressure. Durability prediction and reliability of the heater head are affected by these deviations from nominal design conditions. Therefore, it is important to include the effects of these uncertainties in predicting the probability of survival of the heater head under mission loads. Furthermore, it may be possible for the heater head to experience rare incidences of small temperature excursions of short duration. These rare incidences would affect the creep strain rate and, therefore, the life. This paper addresses the effects of such rare incidences on the reliability. In addition, the sensitivities of variables affecting the reliability are quantified, and guidelines developed to improve the reliability are outlined. Heater head reliability is being quantified with data from NASA Glenn Research Center's accelerated benchmark testing program.

Shah, Ashwin R.↗
NASA NTRS2004

Effect of Random Thermal Spikes on Stirling Convertor Heater Head Reliability

Onboard radioisotope power systems being developed to support future NASA exploration missions require reliable design lifetimes of up to 14 yr and beyond. The structurally critical heater head of the high-efficiency developmental Stirling power converter has undergone extensive computational analysis of operating temperatures (up to 650 C), stresses, and creep resistance of the thin-walled Inconel 718 bill of material. Additionally assessment of the effect of uncertainties in the creep behavior of the thin-walled heater head, the variation in the manufactured thickness, variation in control temperature, and variation in pressure on the durability and reliability were performed. However, it is possible for the heater head to experience rare incidences of random temperature spikes (excursions) of short duration. These incidences could occur randomly with random magnitude and duration during the desired mission life. These rare incidences could affect the creep strain rate and therefore the life. The paper accounts for these uncertainties and includes the effect of such rare incidences, random in nature, on the reliability. The sensitivities of variables affecting the reliability are quantified and guidelines developed to improve the reliability are outlined. Furthermore, the quantified reliability is being verified with test data from the accelerated benchmark tests being conducted at the NASA Glenn Research Center.

Shah, Ashwin R.↗
NASA NTRS2009

Isokinetic Strength and Endurance Tests used Pre- and Post-Spaceflight: Test-Retest Reliability

To assess changes in muscular strength and endurance after microgravity exposure, NASA measures isokinetic strength and endurance across multiple sessions before and after long-duration space flight. Accurate interpretation of pre- and post-flight measures depends upon the reliability of each measure. The purpose of this study was to evaluate the test-retest reliability of the NASA International Space Station (ISS) isokinetic protocol. Twenty-four healthy subjects (12 M/12 F, 32.0 +/- 5.6 years) volunteered to participate. Isokinetic knee, ankle, and trunk flexion and extension strength as well as endurance of the knee flexors and extensors were measured using a Cybex NORM isokinetic dynamometer. The first weekly session was considered a familiarization session. Data were collected and analyzed for weeks 2-4. Repeated measures analysis of variance (alpha=0.05) was used to identify weekly differences in isokinetic measures. Test-retest reliability was evaluated by intraclass correlation coefficients (ICC) (3,1). No significant differences were found between weeks in any of the strength measures and the reliability of the strength measures were all considered excellent (ICC greater than 0.9), except for concentric ankle dorsi-flexion (ICC=0.67). Although a significant difference was noted in weekly endurance measures of knee extension (p less than 0.01), the reliability of endurance measure by week were considered excellent for knee flexion (ICC=0.97) and knee extension (ICC=0.96). Except for concentric ankle dorsi-flexion, the isokinetic strength and endurance measures are highly reliable when following the NASA ISS protocol. This protocol should allow accurate interpretation isokinetic data even with a small number of crew members.

Laughlin, Mitzi S.↗
NASA NTRS2010

Reliability Quantification of Advanced Stirling Convertor (ASC) Components

The Advanced Stirling Convertor, is intended to provide power for an unmanned planetary spacecraft and has an operational life requirement of 17 years. Over this 17 year mission, the ASC must provide power with desired performance and efficiency and require no corrective maintenance. Reliability demonstration testing for the ASC was found to be very limited due to schedule and resource constraints. Reliability demonstration must involve the application of analysis, system and component level testing, and simulation models, taken collectively. Therefore, computer simulation with limited test data verification is a viable approach to assess the reliability of ASC components. This approach is based on physics-of-failure mechanisms and involves the relationship among the design variables based on physics, mechanics, material behavior models, interaction of different components and their respective disciplines such as structures, materials, fluid, thermal, mechanical, electrical, etc. In addition, these models are based on the available test data, which can be updated, and analysis refined as more data and information becomes available. The failure mechanisms and causes of failure are included in the analysis, especially in light of the new information, in order to develop guidelines to improve design reliability and better operating controls to reduce the probability of failure. Quantified reliability assessment based on fundamental physical behavior of components and their relationship with other components has demonstrated itself to be a superior technique to conventional reliability approaches based on utilizing failure rates derived from similar equipment or simply expert judgment.

Shah, Ashwin R.↗
NASA NTRS2011

Reliability Evaluation of Base-Metal-Electrode Multilayer Ceramic Capacitors for Potential Space Applications

Base-metal-electrode (BME) ceramic capacitors are being investigated for possible use in high-reliability spacelevel applications. This paper focuses on how BME capacitors construction and microstructure affects their lifetime and reliability. Examination of the construction and microstructure of commercial off-the-shelf (COTS) BME capacitors reveals great variance in dielectric layer thickness, even among BME capacitors with the same rated voltage. Compared to PME (precious-metal-electrode) capacitors, BME capacitors exhibit a denser and more uniform microstructure, with an average grain size between 0.3 and 0.5 m, which is much less than that of most PME capacitors. BME capacitors can be fabricated with more internal electrode layers and thinner dielectric layers than PME capacitors because they have a fine-grained microstructure and do not shrink much during ceramic sintering. This makes it possible for BME capacitors to achieve a very high capacitance volumetric efficiency. The reliability of BME and PME capacitors was investigated using highly accelerated life testing (HALT). Most BME capacitors were found to fail with an early avalanche breakdown, followed by a regular dielectric wearout failure during the HALT test. When most of the early failures, characterized with avalanche breakdown, were removed, BME capacitors exhibited a minimum mean time-to-failure (MTTF) of more than 105 years at room temperature and rated voltage. Dielectric thickness was found to be a critical parameter for the reliability of BME capacitors. The number of stacked grains in a dielectric layer appears to play a significant role in determining BME capacitor reliability. Although dielectric layer thickness varies for a given rated voltage in BME capacitors, the number of stacked grains is relatively consistent, typically around 12 for a number of BME capacitors with a rated voltage of 25V. This may suggest that the number of grains per dielectric layer is more critical than the thickness itself for determining the rated voltage and the life expectancy of the BME capacitor. The leakage current characterization and the failure analysis results suggest that most of these early avalanche failures are due to the extrinsic minor construction defects introduced during fabrication of BME capacitors. The concentration of the extrinsic defects must be reduced if the BME capacitors are considered for high reliability applications. There are two approaches that can reduce or prevent the occurrence of early failure in BME capacitors: (1) to reduce the defect concentration with improved processing control; (2) to prevent the use of BME capacitors under harsh external stress levels so that the extrinsic defects will never be triggered for a failure. In order to do so appropriate dielectric layer thickness must be determined for a given rated voltage.

Liu, David (Donhang)↗
NASA NTRS2004

Multisensor Arrays for Greater Reliability and Accuracy

Arrays of multiple, nominally identical sensors with sensor-output-processing electronic hardware and software are being developed in order to obtain accuracy, reliability, and lifetime greater than those of single sensors. The conceptual basis of this development lies in the statistical behavior of multiple sensors and a multisensor-array (MSA) algorithm that exploits that behavior. In addition, advances in microelectromechanical systems (MEMS) and integrated circuits are exploited. A typical sensor unit according to this concept includes multiple MEMS sensors and sensor-readout circuitry fabricated together on a single chip and packaged compactly with a microprocessor that performs several functions, including execution of the MSA algorithm. In the MSA algorithm, the readings from all the sensors in an array at a given instant of time are compared and the reliability of each sensor is quantified. This comparison of readings and quantification of reliabilities involves the calculation of the ratio between every sensor reading and every other sensor reading, plus calculation of the sum of all such ratios. Then one output reading for the given instant of time is computed as a weighted average of the readings of all the sensors. In this computation, the weight for each sensor is the aforementioned value used to quantify its reliability. In an optional variant of the MSA algorithm that can be implemented easily, a running sum of the reliability value for each sensor at previous time steps as well as at the present time step is used as the weight of the sensor in calculating the weighted average at the present time step. In this variant, the weight of a sensor that continually fails gradually decreases, so that eventually, its influence over the output reading becomes minimal: In effect, the sensor system "learns" which sensors to trust and which not to trust. The MSA algorithm incorporates a criterion for deciding whether there remain enough sensor readings that approximate each other sufficiently closely to constitute a majority for the purpose of quantifying reliability. This criterion is, simply, that if there do not exist at least three sensors having weights greater than a prescribed minimum acceptable value, then the array as a whole is deemed to have failed.

Immer, Christopher↗
NASA NTRS2011

Reliability Based Design for a Raked Wing Tip of an Airframe

A reliability-based optimization methodology has been developed to design the raked wing tip of the Boeing 767-400 extended range airliner made of composite and metallic materials. Design is formulated for an accepted level of risk or reliability. The design variables, weight and the constraints became functions of reliability. Uncertainties in the load, strength and the material properties, as well as the design variables, were modeled as random parameters with specified distributions, like normal, Weibull or Gumbel functions. The objective function and constraint, or a failure mode, became derived functions of the risk-level. Solution to the problem produced the optimum design with weight, variables and constraints as a function of the risk-level. Optimum weight versus reliability traced out an inverted-S shaped graph. The center of the graph corresponded to a 50 percent probability of success, or one failure in two samples. Under some assumptions, this design would be quite close to the deterministic optimum solution. The weight increased when reliability exceeded 50 percent, and decreased when the reliability was compromised. A design could be selected depending on the level of risk acceptable to a situation. The optimization process achieved up to a 20-percent reduction in weight over traditional design.

Patnaik, Surya N.↗
NASA NTRS2011

Reliability and Maintainability Engineering - A Major Driver for Safety and Affordability

The United States National Aeronautics and Space Administration (NASA) is in the midst of an effort to design and build a safe and affordable heavy lift vehicle to go to the moon and beyond. To achieve that, NASA is seeking more innovative and efficient approaches to reduce cost while maintaining an acceptable level of safety and mission success. One area that has the potential to contribute significantly to achieving NASA safety and affordability goals is Reliability and Maintainability (R&M) engineering. Inadequate reliability or failure of critical safety items may directly jeopardize the safety of the user(s) and result in a loss of life. Inadequate reliability of equipment may directly jeopardize mission success. Systems designed to be more reliable (fewer failures) and maintainable (fewer resources needed) can lower the total life cycle cost. The Department of Defense (DOD) and industry experience has shown that optimized and adequate levels of R&M are critical for achieving a high level of safety and mission success, and low sustainment cost. Also, lessons learned from the Space Shuttle program clearly demonstrated the importance of R&M engineering in designing and operating safe and affordable launch systems. The Challenger and Columbia accidents are examples of the severe impact of design unreliability and process induced failures on system safety and mission success. These accidents demonstrated the criticality of reliability engineering in understanding component failure mechanisms and integrated system failures across the system elements interfaces. Experience from the shuttle program also shows that insufficient Reliability, Maintainability, and Supportability (RMS) engineering analyses upfront in the design phase can significantly increase the sustainment cost and, thereby, the total life cycle cost. Emphasis on RMS during the design phase is critical for identifying the design features and characteristics needed for time efficient processing, improved operational availability, and optimized maintenance and logistic support infrastructure. This paper discusses the role of R&M in a program acquisition phase and the potential impact of R&M on safety, mission success, operational availability, and affordability. This includes discussion of the R&M elements that need to be addressed and the R&M analyses that need to be performed in order to support a safe and affordable system design. The paper also provides some lessons learned from the Space Shuttle program on the impact of R&M on safety and affordability.

Safie, Fayssal M.↗
NASA NTRS2012

Composite Stress Rupture: A New Reliability Model Based on Strength Decay

A model is proposed to estimate reliability for stress rupture of composite overwrap pressure vessels (COPVs) and similar composite structures. This new reliability model is generated by assuming a strength degradation (or decay) over time. The model suggests that most of the strength decay occurs late in life. The strength decay model will be shown to predict a response similar to that predicted by a traditional reliability model for stress rupture based on tests at a single stress level. In addition, the model predicts that even though there is strength decay due to proof loading, a significant overall increase in reliability is gained by eliminating any weak vessels, which would fail early. The model predicts that there should be significant periods of safe life following proof loading, because time is required for the strength to decay from the proof stress level to the subsequent loading level. Suggestions for testing the strength decay reliability model have been made. If the strength decay reliability model predictions are shown through testing to be accurate, COPVs may be designed to carry a higher level of stress than is currently allowed, which will enable the production of lighter structures

Reeder, James R.↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2013

PV Reliability Development Lessons from JPL's Flat Plate Solar Array Project

Key reliability and engineering lessons learned from the 20-year history of the Jet Propulsion Laboratory's Flat-Plate Solar Array Project and thin film module reliability research activities are presented and analyzed. Particular emphasis is placed on lessons applicable to evolving new module technologies and the organizations involved with these technologies. The user-specific demand for reliability is a strong function of the application, its location, and its expected duration. Lessons relative to effective means of specifying reliability are described, and commonly used test requirements are assessed from the standpoint of which are the most troublesome to pass, and which correlate best with field experience. Module design lessons are also summarized, including the significance of the most frequently encountered failure mechanisms and the role of encapsulate and cell reliability in determining module reliability. Lessons pertaining to research, design, and test approaches include the historical role and usefulness of qualification tests and field tests.

photovoltaics↗
NASA NTRS2016

Limitations of Reliability for Long-Endurance Human Spaceflight

Long-endurance human spaceflight - such as missions to Mars or its moons - will present a never-before-seen maintenance logistics challenge. Crews will be in space for longer and be farther way from Earth than ever before. Resupply and abort options will be heavily constrained, and will have timescales much longer than current and past experience. Spare parts and/or redundant systems will have to be included to reduce risk. However, the high cost of transportation means that this risk reduction must be achieved while also minimizing mass. The concept of increasing system and component reliability is commonly discussed as a means to reduce risk and mass by reducing the probability that components will fail during a mission. While increased reliability can reduce maintenance logistics mass requirements, the rate of mass reduction decreases over time. In addition, reliability growth requires increased test time and cost. This paper assesses trends in test time requirements, cost, and maintenance logistics mass savings as a function of increase in Mean Time Between Failures (MTBF) for some or all of the components in a system. In general, reliability growth results in superlinear growth in test time requirements, exponential growth in cost, and sublinear benefits (in terms of logistics mass saved). These trends indicate that it is unlikely that reliability growth alone will be a cost-effective approach to maintenance logistics mass reduction and risk mitigation for long-endurance missions. This paper discusses these trends as well as other options to reduce logistics mass such as direct reduction of part mass, commonality, or In-Space Manufacturing (ISM). Overall, it is likely that some combination of all available options - including reliability growth - will be required to reduce mass and mitigate risk for future deep space missions.

Owens, Andrew C.↗
NASA NTRS2011

Reliability Evaluation of Base-Metal-Electrode (BME) Multilayer Ceramic Capacitors for Space Applications

This paper reports reliability evaluation of BME ceramic capacitors for possible high reliability space-level applications. The study is focused on the construction and microstructure of BME capacitors and their impacts on the capacitor life reliability. First, the examinations of the construction and microstructure of commercial-off-the-shelf (COTS) BME capacitors show great variance in dielectric layer thickness, even among BME capacitors with the same rated voltage. Compared to PME (precious-metal-electrode) capacitors, BME capacitors exhibit a denser and more uniform microstructure, with an average grain size between 0.3 and approximately 0.5 micrometers, which is much less than that of most PME capacitors. The primary reasons that a BME capacitor can be fabricated with more internal electrode layers and less dielectric layer thickness is that it has a fine-grained microstructure and does not shrink much during ceramic sintering. This results in the BME capacitors a very high volumetric efficiency. The reliability of BME and PME capacitors was investigated using highly accelerated life testing (HALT) and regular life testing as per MIL-PRF-123. Most BME capacitors were found to fail· with an early dielectric wearout, followed by a rapid wearout failure mode during the HALT test. When most of the early wearout failures were removed, BME capacitors exhibited a minimum mean time-to-failure of more than 10(exp 5) years. Dielectric thickness was found to be a critical parameter for the reliability of BME capacitors. The number of stacked grains in a dielectric layer appears to play a significant role in determining BME capacitor reliability. Although dielectric layer thickness varies for a given rated voltage in BME capacitors, the number of stacked grains is relatively consistent, typically between 10 and 20. This may suggest that the number of grains per dielectric layer is more critical than the thickness itself for determining the rated voltage and the life expectancy of the BME capacitor. Since BME capacitors have a much smaller grain size than PME capacitors, it is reasonable to predict that BME capacitors with thinner dielectric layers may have an equivalent life expectancy to that of PME capacitors with thicker dielectric layers.

Liu, David (Donghang)↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
NASA NTRS2019

Cost-Effective High Reliability for Space Life Support Requires Using Storage

Cost-effective high reliability can be achieved in future space life support systems through careful systems analysis and design. This paper outlines a comprehensive approach. Potential future human space missions are described. The mission parameter impacts on life support system design and reliability requirements are discussed. Not all human space missions require high reliability life support. The potential reliability and cost of storage and of recycling life support systems are investigated. Simple storage systems can provide cost-effective high reliability life support where it is needed. More complex recycling systems with lower reliability and higher cost can be used when suitable.

Jones, Harry W.↗
NASA NTRSDate not supplied

Going Beyond Reliability to Robustness and Resilience in Space Life Support Systems

The words reliability, robustness, and resilience are often used interchangeably to describe tough and dependable systems but the distinctions between them suggest how to design more serviceable space systems. Reliability is simply the quality of consistently performing well. A system that dependably meets its design requirements in the specified environment is reliable. The designers may not consider themselves responsible for failures under unanticipated conditions. Robustness is the capability of performing without failure under a wide range of conditions, which can go beyond the expected range to include possible off-nominal conditions. Resilience is the ability to recover from or adapt to unanticipated damaging events, such as failures, accidents, external disruptions, and repurposing. Such changes can invalidate the usual operating assumptions and cause system failure. Reliability, robustness, and resilience describe dependable performance under increasingly difficult conditions, first the specified environment, then a wider possible environment, and finally unanticipated damaging conditions. These three qualities are increasingly desirable and increasingly difficult to achieve. Engineering for resilience would design systems that can ignore or repair failures, survive accidents, and recover from unanticipated disruptions. Increasing the resilience of space systems would greatly increase space crew safety. Improving reliability and robustness requires dealing with known problems, but improving resilience requires implementing a general approach to reducing the impact of unknown future events. The need for robustness and resilience has been stated for decades but little has been done. Systems designers often assume that they understand everything they need to know. The potential failures caused by changes, failures, accidents, unknown environments, and unknown unknowns can be ignored. Such overconfidence can lead to neglect of reliability, robustness, and resilience.

Harry W. Jones↗