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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10

NOR Flash Memory Scrubbing Application for Boot File Preservation of NASA’s Descent and Landing Computer (DLC)

Progress on NASA’s Safe and Precise Landing Integrated Capabilities Evolution (SPLICE) project continues, specifically with this development of the Descent and Landing Computer (DLC). One of the DLC’s primary contributions as a SPLICE technology is its implementation of algorithms and operation of sensors to autonomously guide a spacecraft in performing more precise and safer landings on celestial bodies such as the Moon and Mars [1]. The second iteration of the DLC is known as the Engineering Test Unit (ETU) and one of its desired functionalities is the ability to preserve the fidelity of the system’s boot file through the use of memory scrubbing [2]. The ETU has two primary boards, one for housing a Multi-Processor System on a Chip (MPSoC) and the other for housing a Xilinx Kintex Ultrascale FPGA*. To emulate a memory scrubbing function implemented on the ETU’s FPGA board, the design and testing of a software application was performed on a Xilinx KCU105 FPGA evaluation board. The memory scrubbing application had to meet certain key criteria such as (1) properly utilize with the flash memory’s Serial Peripheral Interface (SPI) to read, write, and erase flash memory properly, (2) be able to detect arbitrarily large or small amounts of bit-errors, (3) be able to correct all detected errors, and (4) perform memory scrubbing indefinitely and autonomously. A prototype implementation was constructed and tested, demonstrating successful detection and correction of bit errors in multiple configurations. In the form of burst errors or singular bit flips, and in amounts of errors ranging from one to fifteen (per 256 Bytes), the application was successful in preserving memory fidelity.

Flash memory↗

SEE Test Results for SAMA5D3

ARM processors power a class of high-performance, lower power system on a chip devices. In the absence of radiation effects, these devices are highly desirable for space use. The processor core architecture for ARM devices is licensed to provide computing on multiple hardware platforms. The A5 processor is in a unique pioneering space for providing detailed radiation response data to explore the baseline performance of these devices. These data can help set options for ARM processors and possibly impact design choices for the next generation of ARM fault tolerance capabilities. The SAMA5D3 was tested to establish general SEE performance for a relatively simple implementation of the ARM A5 core. This testing observed SRAM sensitivity starting at an LET of about 3 MeV-cm2/mg, with a saturated cross section of about 2x10-8cm2/bit, and this was determined by both active write and read of the caches, in addition to the use of a debugger to provide test results. Crash/SEFI data was collected using both Linux and bare metal C-code. The onset LET for crashes was about LET 1.5 MeV-cm2/mg, with saturated cross sections of about 2x10-5 cm2 for bare metal (low utilization), and 2x10-4cm2 for Linux (high utilization) tests.

Daniel, Andrew C.↗

Materials and Device Optimization for High Power SiGe HBT Amplifiers at X-Band Frequencies

The driving force behind SiGe development is the potential for high frequency and high power devices that provide comparable functionality as more expensive semiconductors such as InP and GaAs, but at a much lower cost. Additional advantages are the potential for incorporating SiGe devices onto monolithic Si chips and fabricating entire systems, such as receiver front-ends or RF power amplifiers, on a single chip. The work reported in this paper summarizes the materials and simulation aspects of a much larger project, which will eventually lead to SiGe HBT amplifiers with output powers greater than 1 W and over 35 dB gain at X-band frequencies. To achieve these goals, accurate analysis of the materials properties, especially in the base region, and highly refined amplifier design procedures must be established. In this paper we report the precision that may be obtained using optical ellipsometry to monitor the base and emitter thicknesses and Ge content of the base. We also report the extent of crystalline degradation in state-of-the-art SiGe films with high Ge contents. The objective of this work is to access the materials quality of HBT structures, and then use this data to model how various defects impact device performance, and which defects are most likely to limit high power and/or high frequency performance.

Mueller, C. H.↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

High data rate Reed-Solomon encoding and decoding using VLSI technology

Presented as an implementation of a Reed-Solomon encode and decoder, which is 16-symbol error correcting, each symbol is 8 bits. This Reed-Solomon (RS) code is an efficient error correcting code that the National Aeronautics and Space Administration (NASA) will use in future space communications missions. A Very Large Scale Integration (VLSI) implementation of the encoder and decoder accepts data rates up 80 Mbps. A total of seven chips are needed for the decoder (four of the seven decoding chips are customized using 3-micron Complementary Metal Oxide Semiconduction (CMOS) technology) and one chip is required for the encoder. The decoder operates with the symbol clock being the system clock for the chip set. Approximately 1.65 billion Galois Field (GF) operations per second are achieved with the decoder chip set and 640 MOPS are achieved with the encoder chip.

Miller, Warner↗

Self-Healing RF/Microwave Communications Circuits/Systems for NASA Missions—A Review

The success of current and future NASA missions relies in great part on the performance reliability and robustness of the communication circuits and systems of said missions. Some of the manifestations of reliability and robustness are comprised by properties such as graceful degradation, which provide redundancy and potentially longer life to the mission, and the ability to perform efficiently in harsh environments destinations such as Venus and the Jovian and Saturnian moons Europa and Enceladus, respectively. While several approaches have been considered or are currently underway to develop communications circuitry capable of performing in harsh environments, they lack the flexibility to enable reconfigurability to preserve functionality under adverse or contingency scenarios. This paper discusses some examples of self-healing RF/Microwave communications circuits and systems that could provide advantageous options in support of NASA missions.

self-healing↗

LOCAD-PTS: Operation of a New System for Microbial Monitoring Aboard the International Space Station (ISS)

Microorganisms within the space stations Salyut, Mir and the International Space Station (ISS), have traditionally been monitored with culture-based techniques. These techniques involve growing environmental samples (cabin water, air or surfaces) on agar-type media for several days, followed by visualization of resulting colonies; and return of samples to Earth for ground-based analysis. This approach has provided a wealth of useful data and enhanced our understanding of the microbial ecology within space stations. However, the approach is also limited by the following: i) More than 95% microorganisms in the environment cannot grow on conventional growth media; ii) Significant time lags occur between onboard sampling and colony visualization (3-5 days) and ground-based analysis (as long as several months); iii) Colonies are often difficult to visualize due to condensation within contact slide media plates; and iv) Techniques involve growth of potentially harmful microorganisms, which must then be disposed of safely. This report describes the operation of a new culture-independent technique onboard the ISS for rapid analysis (within minutes) of endotoxin and -1, 3-glucan, found in the cell walls of gram-negative bacteria and fungi, respectively. This technique involves analysis of environmental samples with the Limulus Amebocyte Lysate (LAL) assay in a handheld device. This handheld device and sampling system is known as the Lab-On-a-Chip Application Development Portable Test System (LOCAD-PTS). A poster will be presented that describes a comparative study between LOCAD-PTS analysis and existing culture-based methods onboard the ISS; together with an exploratory survey of surface endotoxin throughout the ISS. It is concluded that while a general correlation between LOCAD-PTS and traditional culture-based methods should not necessarily be expected, a combinatorial approach can be adopted where both sets of data are used together to generate a more complete story of the microbial ecology on the ISS.

Maule, J.↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

Microfabricated capillary electrophoresis amino acid chirality analyzer for extraterrestrial exploration

Chiral separations of fluorescein isothiocyanate-labeled amino acids have been performed on a microfabricated capillary electrophoresis chip to explore the feasibility of using such devices to analyze for extinct or extant life signs in extraterrestrial environments. The test system consists of a folded electrophoresis channel (19.0 cm long x 150 microns wide x 20 microns deep) that was photolithographically fabricated in a 10-cm-diameter glass wafer sandwich, coupled to a laser-excited confocal fluorescence detection apparatus providing subattomole sensitivity. Using a sodium dodecyl sulfate/gamma-cyclodextrin pH 10.0 carbonate electrophoresis buffer and a separation voltage of 550 V/cm at 10 degrees C, baseline resolution was observed for Val, Ala, Glu, and Asp enantiomers and Gly in only 4 min. Enantiomeric ratios were determined for amino acids extracted from the Murchison meteorite, and these values closely matched values determined by HPLC. These results demonstrate the feasibility of using microfabricated lab-on-a-chip systems to analyze extraterrestrial samples for amino acids.

NASA Discipline Life Sciences Technologies↗

A Hardware Platform for Tuning of MEMS Devices Using Closed-Loop Frequency Response

We report on the development of a hardware platform for integrated tuning and closed-loop operation of MEMS gyroscopes. The platform was developed and tested for the second generation JPL/Boeing Post-Resonator MEMS gyroscope. The control of this device is implemented through a digital design on a Field Programmable Gate Array (FPGA). A software interface allows the user to configure, calibrate, and tune the bias voltages on the micro-gyro. The interface easily transitions to an embedded solution that allows for the miniaturization of the system to a single chip.

gyroscope controls↗

Flight data systems using LSI P-channel MOSFETS

Continuing development and expansion of a series of P-channel MOSFET circuits in flight data systems is reported. Using hybrid thick film techniques, these circuits evolved into bugs with more than 1000 transistors on a chip. A proposed data system for Helios satellite will have approximately 130 bugs and a semiconductor count of more than 100,000, will weigh less than 1 N and use less than 1.2 W.

Trainor, J. H.↗

A CLIPS based personal computer hardware diagnostic system

Often the person designated to repair personal computers has little or no knowledge of how to repair a computer. Described here is a simple expert system to aid these inexperienced repair people. The first component of the system leads the repair person through a number of simple system checks such as making sure that all cables are tight and that the dip switches are set correctly. The second component of the system assists the repair person in evaluating error codes generated by the computer. The final component of the system applies a large knowledge base to attempt to identify the component of the personal computer that is malfunctioning. We have implemented and tested our design with a full system to diagnose problems for an IBM compatible system based on the 8088 chip. In our tests, the inexperienced repair people found the system very useful in diagnosing hardware problems.

Whitson, George M.↗

A Low Cost Single Chip VDL Compatible Transceiver ASIC

Recent trends in commercial communications system components have focussed almost exclusively on cellular telephone technology. As many of the traditional sources of receiver components have discontinued non-cellular telephone products, the designers of avionics and other low volume radio applications find themselves increasingly unable to find highly integrated components. This is particularly true for low power, low cost applications which cannot afford the lavish current consumption of the software defined radio approach increasingly taken by certified device manufacturers. In this paper, we describe a low power transceiver chip targeting applications from low VHF to low UHF frequencies typical of avionics systems. The chip encompasses a selectable single or double conversion design for the receiver and a low power IF upconversion transmitter. All local oscillators are synthesized and integrated into the chip. An on-chip I-Q modulator and demodulator provide baseband modulation and demodulation capability allowing the use of low power, fixed point signal processing components for signal demodulation. The goal of this program is to demonstrate a low cost VDL mode-3 transceiver using this chip to receive text weather information sent using 4-slot TDMA with no support for voice. The data will be sent from an experimental ground station. This work is funded by NASA Glenn Research Center.

Becker, Robert↗

An investigation of error correcting techniques for OMV and AXAF

The original objectives of this project were to build a test system for the NASA 255/223 Reed/Solomon encoding/decoding chip set and circuit board. This test system was then to be interfaced with a convolutional system at MSFC to examine the performance of the concantinated codes. After considerable work, it was discovered that the convolutional system could not function as needed. This report documents the design, construction, and testing of the test apparatus for the R/S chip set. The approach taken was to verify the error correcting behavior of the chip set by injecting known error patterns onto data and observing the results. Error sequences were generated using pseudo-random number generator programs, with Poisson time distribution between errors and Gaussian burst lengths. Sample means, variances, and number of un-correctable errors were calculated for each data set before testing.

Ingels, Frank↗

Monolithic Microwave Switching Matrix

Gallium arsenide integrated-circuit chip switches any of three microwave input signals to any of three output ports. Measuring 4.9 mm on side, chip contains nine field-effect transistor (FET) crosspoint switches. Housed in custom-designed package with standard connectors for easy integration into system. FET's on chip operated as passive switches and consume no static power and insignificant amounts of switching power. Chip module cascades with similar modules into large arrays handling as many as 100 inputs and 100 outputs. Applications include switching and routing vast amounts of data between computers at extremely high speed. On communications satellite, chip switches microwave signals to and from Earth stations and other satellites.

Fujikawa, Gene↗

Bio-Nanobattery Development and Characterization

A bio-nanobattery is an electrical energy storage device that utilizes organic materials and processes on an atomic, or nanometer-scale. The bio-nanobattery under development at NASA s Langley Research Center provides new capabilities for electrical power generation, storage, and distribution as compared to conventional power storage systems. Most currently available electronic systems and devices rely on a single, centralized power source to supply electrical power to a specified location in the circuit. As electronic devices and associated components continue to shrink in size towards the nanometer-scale, a single centralized power source becomes impractical. Small systems, such as these, will require distributed power elements to reduce Joule heating, to minimize wiring quantities, and to allow autonomous operation of the various functions performed by the circuit. Our research involves the development and characterization of a bio-nanobattery using ferritins reconstituted with both an iron core (Fe-ferritin) and a cobalt core (Co-ferritin). Synthesis and characterization of the Co-ferritin and Fe-ferritin electrodes were performed, including reducing capability and the half-cell electrical potentials. Electrical output of nearly 0.5 V for the battery cell was measured. Ferritin utilizing other metallic cores were also considered to increase the overall electrical output. Two dimensional ferritin arrays were produced on various substrates to demonstrate the feasibility of a thin-film nano-scaled power storage system for distributed power storage applications. The bio-nanobattery will be ideal for nanometerscaled electronic applications, due to the small size, high energy density, and flexible thin-film structure. A five-cell demonstration article was produced for concept verification and bio-nanobattery characterization. Challenges to be addressed include the development of a multi-layered thin-film, increasing the energy density, dry-cell bionanobattery development, and selection of ferritin core materials to allow the broadest range of applications. The potential applications for the distributed power system include autonomously-operating intelligent chips, flexible thin-film electronic circuits, nanoelectromechanical systems (NEMS), ultra-high density data storage devices, nanoelectromagnetics, quantum electronic devices, biochips, nanorobots for medical applications and mechanical nano-fabrication, etc.

King, Glen C.↗