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At least 199 records · Page 11

Bio-inspired Surface Structures to Mitigate Interfacial Particle Adhesion and Erosion - A Review

Lunar dust known as regolith is a huge challenge for lunar exploration missions. Formed over millennia by a complex process involving impacts of meteoroids and micrometeoroids on the lunar surface, lunar dust is porous, highly abrasive with sharp jagged edges, chemically reactive, electrostatically charged and sometimes magnetic. The chemical composition and thickness of the dust layer also varies in different regions of the lunar surface. From samples obtained by previous lunar missions, the average particle size is below 100 microns. This dust has the tendency to strongly adhere to any exposed surfaces, and often degrades the material functionality to eventually cause failure. Any material on the lunar surface is also subject to harsh temperature cycles ranging from -178 ̊C to + 123 ̊C and extreme ultraviolet radiation. While on the lunar surface, different classes of materials would be required for different applications. Advanced materials have been and will be used throughout the lunar lander, habitat, and mission equipment. Examples include: polymeric materials for astronaut protective clothing; metals and ceramics for the lunar lander legs and habitats, and excavating equipment; and semiconductors for solar panels and on-board electronics. In all these applications, the surfaces of the materials are expected or understood to be exposed to the extreme lunar environment condition that includes the regolith dust. During the Apollo missions, the dust clung to and abraded the astronaut’s suits, degraded seals, optics, clogged sensors and reduced performance of thermal radiators. The lunar dust adheres to the surface by various mechanisms, which include electrostatic and Coulombic interactions, Van-der-Waals forces, magnetic forces, mechanical interlocking, chemical bonding and donor-acceptor interactions. There are three primary strategies for developing technologies to minimize the lunar dust adhesion: active, passive and a combination of active and passive. In the active approach, an external energy is needed to prevent or remove particles from collecting on the surface. Mechanically powered brushes and electrodynamic dust screens are two examples. In the passive approach, no external power is needed, and the material surface properties are able to mitigate dust adhesion. A well-known example of this strategy is the low work function coatings for non-stick surfaces. In most cases a combination of active and passive methods might be needed to optimally manage the lunar regolith. The passive method is significantly more attractive as it does not require any external power or an additional control subsystem. These approaches optimize the mission payload and reduce risk. Surface modification to minimize the dust adhesion is thus very important to lunar missions. Here, naturally evolved surface structures might provide guidance for solutions. There are several factors that have to be considered for minimizing particle adhesion to a surface. These include the substrate material properties, surface topography, chemistry, and the characteristics of the adhering particles. When engineering a surface, the substrate material chosen would be dependent on the needs of the application. Tailoring the surface microstructure or chemistry opens up more possibilities for its optimal utilization

Lunar Dust

Designed Adhesion - Exploring the Unknown

The ability to design materials and substrates for adhesive properties is highly desirable for the aeronautics industry. This includes the ability to design substrates that have low ice adhesion to increase efficiency of the fleet, as well as the ability to design structural adhesives to improve manufacturing rate. The Designed Adhesion group was chosen during the 2023 Wicked Wild Pitch Event sponsored by CAS and is currently in the discovery phase.

Design

Tuning Surface Adhesion Using Grayscale Electron-beam Lithography

Surface texturing of manufactured products tailors their properties, such as friction, adhesion, biocompatibility, or fluid interactions. However, advancements in this area are largely the result of trial-and-effort testing and generally lack a science-guided framework for determining the surface topography that will optimize performance. The present investigation explores grayscale electron-beam lithography as a means to create multiscale surface patterns to control surface performance. Here, we created and characterized a set of surface textures on a silicon wafer; the textures were superpositions of sine waves of varying wavelengths and amplitudes. First, the multiscale topography of the patterned surface was characterized, using profilometry and atomic force microscopy, to understand its fidelity to the designed-in pattern. The results of this analysis demonstrated how grayscale lithography accurately controlled the lateral size of features but was less precise on the vertical height of the surface, and also introduced inherent roughness below the scale of patterning. Second, a micromechanical tester was used to characterize the adhesion of the surfaces with large-scale polished silicon spheres. The results showed that adhesion could be tailored, with significant contribution from all of the designed-in length scales of topography. The strength of adhesion did not correlate with conventional roughness parameters but could be accurately modeled using simple numerical integration. Taken together, this investigation demonstrates the promise and challenges of grayscale e-beam lithography with multiscale patterns as a method for the tailoring of surface performance.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC

Equivalent Properties of Interfacial Void Defects at the CFRTP-adhesive Interface and Their Detrimental Effects on the Bonding Performance of Metal-CFRTP Dissimilar Joints

This paper revealed the detrimental effects of micro-scale air interfacial voids on the debonding at the interface of carbon-fiber-reinforced polyphthalamide (CFRPPA) and thermoset adhesive, representing a weak adherend-adhesive interface, within a dissimilar joint made of an aluminum alloy and a CFRPPA. The reduced lap shear strength of the joint, due to different void area fractions at the CFRPPA-adhesive interface, can be computationally described by using equivalent interfacial properties in the modeling to avoid the explicit modeling of the micro-scale interfacial voids. Such equivalent interfacial properties (e.g., interfacial normal strength, etc.) was found to have a non-linear relationship with respect to interfacial void area fraction as well as lap shear strength. This work has practical applications by utilizing equivalent interfacial properties for the analytical and/or computational design(s) of adhesively bonded joints.

Qiao, Yao

Final Report on Characterization of Irradiated Sensors and Coupling Adhesive Bonds

This report summarizes characterization via scanning/transmission electron microscopy of the microstructures of the unirradiated and irradiated piezoelectric ultrasonic sensor/aluminum substrate assemblies using four commercially available inorganic coupling adhesives to bond two types of piezoelectric crystals to the substrates. The sample assemblies were irradiated in the PULSTAR reactor at NC State University and ultrasonic data was collected in-situ. ORNL LAMDA Laboratory capabilities were utilized to perform pre- and post-irradiation examination of the sensor assemblies. This document summarizes the PIE performed at the ORNL LAMDA laboratory. The results of the PIE described in this report are consistent with the ultrasonic data collected during irradiation – in particular, high temperature epoxy adhesive seemed to provide the best coupling as compared to the refractory ceramic adhesives. It was determined that the quality of the sensor-adhesive-substrates governed the ultrasonic performance of the sensors. It was also apparent that irradiation did not significantly affect bond quality, which is also supported by the ultrasonic data collected during irradiation. A more comprehensive DOE NSUF Final Report including details of materials selection, sample fabrication, initial ultrasonic testing, irradiation and in-situ ultrasonic testing, positron annihilation lifetime spectroscopy and doppler broadening spectroscopy performed at EPRI and NC State University will be published at the conclusion of the project.

36 MATERIALS SCIENCE

A Study of the Effects of Relative Humidity on Small Particle Adhesion to Surfaces

Ambient dust ranging in size from less than one micron up to 140 microns was used as test particles. Relative humidities of 33% to 100% were used to condition test surfaces after loading with the test particles. A 20 psi nitrogen blowoff was used as the removal mechanism to test for particle adhesion. Particles were counted before and after blowoff to determine retention characteristics. Particle adhesion increased drastically as relative humidity increased above 50%. The greatest adhesion changes occurred within the first hour of conditioning time. Data are presented for total particle adhesion, for particles 10 microns and larger, and 50 microns and larger.

Whitfield, W. J.

Adhesion, friction, and wear of a copper bicrystal with (111) and (210) grains

Sliding friction experiments were conducted in air with polycrystalline copper and ruby riders sliding against a copper bicrystal. Friction coefficient was measured across the bicrystal surface, and the initiation of adhesive wear was examined with scanning electron microscopy. Results indicate a marked increase in friction coefficient as the copper rider crossed the grain boundary from the (111) plane to the (210) plane of the bicrystal. Adhesion, friction, and initiation of adhesive wear was notably different in the adjacent grains of differing orientation. A slip-band adhesion-generated fracture mechanism for wear particle formation is proposed.

Brainard, W. A.

Cyclic debonding of adhesive joints

Bonded lap joints were manufactured and tested under static and fatigue loading. Specimens were designed to fail in the bondline, and all fatigue tests included monitoring the crack growth to failure. Test specimens included aluminum details joined by two different adhesives. Specimens also included titanium and boron-epoxy details joined by an epoxy laminating resin. Additonal program variables included bondline thickness, adherend and spice plate thickness, specimen width, and specimen fabrication procedure. Adhesive aging was found to be generally detrimental to the lives of most of the specimens bonded with one adhesive system. Adhesive material was found to have a major influence on debond rate. Co-cured titanium/boron-epoxy specimens were found to resist debonding better than specimens fabricated with a sequential cure. Splice plate thickness and test section width were found to have little effect on debond rate. The data also suggested the existence of an optimum bondline thickness.

Hoffman, D. J.

Non-classical adhesive-bonded joints in practical aerospace construction

Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

Hart-Smith, L. J.

Adhesive-bonded double-lap joints

Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

Hart-Smith, L. J.

Adhesive fracture mechanics

In studies of fracture mechanics the adhesive fracture energy is regarded as a fundamental property of the adhesive system. It is pointed out that the value of the adhesive fracture energy depends on surface preparation, curing conditions, and absorbed monolayers. A test method reported makes use of a disk whose peripheral part is bonded to a substrate material. Pressure is injected into the unbonded central part of the disk. At a certain critical pressure value adhesive failure can be observed. A numerical stress analysis involving arbitrary geometries is conducted.

Bennett, S. J.

Design guidelines for use of adhesives and organic coatings in hybrid microcircuits

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits.

Caruso, S. V.

Stress analysis of adhesive bonded stiffener plates and double joints

The general problem of adhesive bonded stiffener plates and double joints of dissimilar orthotropic adherends with transverse shear deformations are analyzed. Adhesive layers are assumed to be of an isotropic, elastic and relatively flexible material. It is shown that the stress distributions in the adhesive layers are very much dependent on the bending deformations in adherends. Also, it is found that, in the adhesive layer, maximum transverse normal stress is, in many cases, larger than the longitudinal shear stress and that both occur at the edge of the joint. The general method of solution developed is applied to several practical examples.

Yuceoglu, U.

A fundamental approach to adhesion: Synthesis, surface analysis, thermodynamics and mechanics

The effects of composites as adherends was studied. Several other variables were studied by fractography: aluminum powder adhesive filler, fiber glass cloth scrim or adhesive carrier, new adhesives PPQ-413 and LARC-13, and strength-test temperature. When the new results were juxtaposed with previous work, it appeared that complex interactions between adhesive, adherend, bonding, and testing conditions govern the observed strength and fracture-surface features. The design parameters likely to have a significant effect upon strength-test results are listed.

Dwight, D. W.

Investigation of package sealing using organic adhesives

A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.

Perkins, K. L.

Acoustic emission analysis: A test method for metal joints bonded by adhesives

Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.

Brockmann, W.

Thermal stability and aging of some new anaerobic adhesives for structural binding

Polyurethane-modified high impact anaerobic adhesives have been chosen for a bonding application where impact cushion is critical. These adhesives meet all the requirements for high rate production and automatic assembly techniques. With aluminum adherends, one selected adhesive cured at room temperature with the recommended activator retained sixty percent of its original impact strength after twenty-six week aging at 100 C. The impact strength aging, the thermogravimetric analysis results, the outgassing data, and other observations made in this work indicate that the adhesives cured by simple heating give a more durable bond than that cured with an activator at room temperature.

Lee, S. Y.

Evaluation of non-specular reflecting silvered Teflon and filled adhesives

A non-specular silver-Teflon tape thermal control coating was tested to provide the data necessary to qualify it for use on the Space Shuttle Orbiter radiators. Effects of cure cycle temperature and pressure on optical and mechanical properties on the silver-Teflon tape were evaluated. The baseline Permacel P-223 adhesive, used with the specular silver-Teflon tape initially qualified for the Orbiter radiators, and four alternate metal-filled and unfilled adhesives were evaluated. Tests showed the cure process has no effect on the silver-Teflon optical properties, and that the baseline adhesive cure cycle gives best results. In addition the P-223 adhesive bond is more reproducible than the alternates, and the non-specular tape meets both the mechanical and the optical requirements of the Orbiter radiator coating specification. Existing Orbiter coating techniques were demonstrated to be effective in aplying the non-specular tape to a curved panel simulating the radiators. Author

Bourland, G.