Results for “Adhesives” — Page 11

NASA NTRS1984

The development of aerospace polyimide adhesives

Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.

St. Clair, A. K.↗

NASA NTRS1985

Rapid adhesive bonding of advanced composites and titanium

Rapid adhesive bonding (RAB) concepts utilize a toroid induction technique to heat the adhesive bond line directly. This technique was used to bond titanium overlap shear specimens with 3 advanced thermoplastic adhesives and APC-2 (graphite/PEEK) composites with PEEK film. Bond strengths equivalent to standard heated-platen press bonds were produced with large reductions in process time. RAB produced very strong bonds in APC-2 adherend specimens; the APC-2 adherends were highly resistant to delamination. Thermal cycling did not significantly affect the shear strengths of RAB titanium bonds with polyimide adhesives. A simple ultrasonic non-destructive evaluation process was found promising for evaluating bond quality.

Stein, B. A.↗

NASA NTRS1984

Polyimide adhesives - Modified with ATBN and silicone elastomers

A series of studies evaluating the effects of added elastomers on the properties of a high-temperature addition polyimide adhesive is reviewed. First, thermoset polyimides containing various butadiene/acrylonitrile and silicone elastomers were synthesized either as physical polybends or by chemically reacting the elastomers directly onto the polymer backbone. The modified adhesive resins were characterized for thermomechanical properties, fracture toughness and adhesive strength. A second series of elastomer-containing polyimides was also prepared in order to study the effects of the elastomer chain length on polymer properties. Aromatic amine-terminated silicone rubbers with repeat units varying from n = 10 to 105 were reacted onto the polyimide backbone, and the resulting polymers were characterized for their adhesive properties.

St. Clair, A. K.↗

NASA NTRS1985

Adhesives for Aerospace

The industry is hereby challenged to integrate adhesive technology with the total structure requirements in light of today's drive into automation/mechanization. The state of the art of adhesive technology is fairly well meeting the needs of the structural designers, the processing engineer, and the inspector, each on an individual basis. The total integration of these needs into the factory of the future is the next collective hurdle to be achieved. Improved processing parameters to fit the needs of automation/mechanization will necessitate some changes in the adhesive forms, formulations, and chemistries. Adhesives have, for the most part, kept up with the needs of the aerospace industry, normally leading the rest of the industry in developments. The wants of the aerospace industry still present a challenge to encompass all elements, achieving a totally integrated joined and sealed structural system. Better toughness with hot-wet strength improvements is desired. Lower cure temperatures, longer out times, and improved corrosion inhibition are desired.

Meade, L. E.↗

NASA NTRS1985

Rapid adhesive bonding and field repair of aerospace materials

Adhesive bonding in the aerospace industry typically utilizes autoclaves or presses which have considerable thermal mass. As a consequence, the rates of heatup and cooldown of the bonded parts are limited and the total time and cost of the bonding process are often relatively high. Many of the adhesives themselves do not inherently require long processing times. Bonding could be performed rapidly if the heat was concentrated in the bond lines or at least in the adherends. Rapid Adhesive Bonding concepts are developed to utilize induction heating techniques to provide heat directly to the bond line and/or adherends without heating the entire structure, supports, and fixtures of a bonding assembly. Bonding times for specimens can be cut by a factor of 10 to 100 compared to standard press or autoclave bonding. The development of Rapid Adhesive Bonding for lap shear specimens (per ASTM D1002 and D3163), for aerospace panel or component bonding, and for field repair needs of metallic and advanced fiber reinforced polymeric-matrix composite structures is reviewed. Equipment and procedures are described for bonding and repairing thin sheets, simple geometries, and honeycomb core panels.

Stein, B. A.↗

NASA NTRS1986

Adhesive joint evaluation by ultrasonic interface and lamb waves

Some results on the application of interface and Lamb waves for the study of curing of thin adhesive layers were summarized. In the case of thick substrates (thickness much more than the wave length) the interface waves can be used. In this case the experimental data can be inverted and the shear modulus of the adhesive film may be explicitly found based on the measured interface wave velocity. It is shown that interface waves can be used for the study of curing of structural adhesives as a function of different temperatures and other experimental conditions. The kinetics of curing was studied. In the case of thin substrates the wave phenomena are much more complicated. It is shown that for successful measurements proper selection of experimental conditions is very important. This can be done based on theoretical estimations. For correctly selected experimental conditions the Lamb waves may be a sensitive probe of adhesive bond quality and may be used or cure monitoring.

Rokhlin, S. I.↗

NASA NTRS1986

Mode 1 delamination growth in adhesively bonded joints under static and fatigue loads

The objective of this investigation was to characterize the pure mode 1 delamination growth in metal to metal adhesively bonded joints under static and fatigue loading conditions, using FM 73 adhesive. Double cantilever beam specimens (DCB) were used for pure mode 1 tests. Aluminum 2024-T3 adherends were bonded with FM 73 adhesive. Delamination was introduced during fabrication by inserting a Teflon film between the two adherends. The mode 1 strain energy release rate G sub I sub c was obtained directly from static DCB tests conducted in accordance with the ASTM designation D1876-12. Constant amplitude fatigue tests on DCB specimens were conducted to determine the relationship between delamination growth rate da/dN and strain energy release rate G sub I sub c for a pure mode 1 delamination growth. It is found that the debond propagation rate in adhesive joints using FM 73 is more sensitive to errors in design load than is typical crack growth rate in metallic structures.

Biswas, S. C.↗

NASA NTRS1987

Adhesive evaluation of water-soluble LARC-TPI

The water-soluble polyimide, identified as TPI(MTC)/H2O, was evaluated as a high temperature thermoplastic adhesive for bonding Ti-6Al-4V and comparing those results primarily with results reported in earlier work with the polyamic-acid/diglyme material. The lap shear strength test was the primary test performed to evaluate the adhesive before (controls) and after thermal exposure in air at 204 C for up to 5000 hours and after a 72 hour water-boil exposure. Lap shear strengths were determined at RT, 177, 204, and 232 C. The adhesive was also characterized after fracture by determining the glass transition temperature as well as defining the mode of failure by visual observation. In general, the results indicate that the TPI(MTC)/H2O retains high lap shear strengths after thermal exposure but had reduced strengths after the water-boil exposure. All failures were cohesive. The TPI(MTC)/H2O compared very well with previous data reported for the standard polyamic-acid/diglyme LARC-TPI results, and therefore, shows promise as a water-soluble adhesive for use in various applications.

Progar, Donald J.↗

NASA NTRS1986

Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

Buckley, John D.↗

NASA NTRS1988

Scanning electron microscopy study of adhesion in sea urchin blastulae

The dissociation supernatant (DS) isolated by disaggregating Strongylocentrotus purpuratus blastulae in calcium- and magnesium-free seawater specifically promotes reaggregation of S. purpuratus blastula cells. The purpose of this study was to use scanning electron microscopy to examine the gross morphology of aggregates formed in the presence of DS to see if it resembles adhesion in partially dissociated blastulae. A new reaggregation procedure developed here, using large volumes of cell suspension and a large diameter of rotation, was utilized to obtain sufficient quantities of aggregates for scanning electron microscopy. The results indicate that aggregates formed in the presence of DS resemble partially dissociated intact embryos in terms of the direct cell-cell adhesion observed. DS did not cause aggregation to form as a result of the entrapment of cells in masses of extracellular material. These studies provide the groundwork for further studies using transmission electron microscopy to more precisely define the adhesive contacts made by cells in the presence of the putative adhesion molecules present in DS.

Crowther, Susan D.↗

NASA NTRS1988

Adhesive evaluation of water-soluble LARC-TPI

The water-soluble polyimide, identified as TPI(MTC)/H2O, was evaluated as a high temperature thermoplastic adhesive for bonding Ti-6Al-4V and comparing those results primarily with results reported in earlier work with the polyamic-acid/diglyme material. The lap shear strength test was the primary test performed to evaluate the adhesive before (controls) and after thermal exposure in air at 204 C for up to 5000 hours and after a 72 hour water-boil exposure. Lap shear strengths were determined at RT, 177, 204, and 232 C. The adhesive was also characterized after fracture by determining the glass transition temperature as well as defining the mode of failure by visual observation. In general, the results indicate that the TPI(MTC)/H2O retains high lap shear strengths after thermal exposure but had reduced strengths after the water-boil exposure. All failures were cohesive. The TPI(MTC)/H2O compared very well with previous data reported for the standard polyamic-acid/diglyme LARC-TPI results, and therefore, shows promise as a water-soluble adhesive for use in various applications.

Progar, D. J.↗

NASA NTRS1988

Qualification of room-temperature-curing epoxy adhesives for spacecraft structural applications

An adhesive-bonding test program is being conducted in order to develop structural adhesives applicable to JPL spacecraft. A noteworthy application for such an adhesive will be JPL's Galileo mission, whose trajectory will involve the circumnavigation of the planet Venus prior to Jupiter rendezvous, and will accordingly require stringent temperature and radiation environment requirements. The baseline adhesive for the test program is the EA 934 room temperature-cure epoxy, which has been widely used as a 'space-qualified' material.

Carpenter, Alain↗

NASA NTRS1988

Adhesion, friction, and wear of plasma-deposited thin silicon nitride films at temperatures to 700 C

The adhesion, friction, and wear behavior of silicon nitride films deposited by low- and high-frequency plasmas (30 kHz and 13.56 MHz) at various temperatures to 700 C in vacuum were examined. The results of the investigation indicated that the Si/N ratios were much greater for the films deposited at 13.56 MHz than for those deposited at 30 kHz. Amorphous silicon was present in both low- and high-frequency plasma-deposited silicon nitride films. However, more amorphous silicon occurred in the films deposited at 13.56 MHz than in those deposited at 30 kHz. Temperature significantly influenced adhesion, friction, and wear of the silicon nitride films. Wear occurred in the contact area at high temperature. The wear correlated with the increase in adhesion and friction for the low- and high-frequency plasma-deposited films above 600 and 500 C, respectively. The low- and high-frequency plasma-deposited thin silicon nitride films exhibited a capability for lubrication (low adhesion and friction) in vacuum at temperatures to 500 and 400 C, respectively.

Miyoshi, K.↗

NASA NTRS1988

Thermoplastic adhesives based on 4,4'-isophthaloyldiphthalic anhydride (IDPA)

Thermoplastic polyimides were prepared and evaluated as adhesives. These materials are based on 4,4'-isophthaloyldiphathalic anhydride (IDAP) and either metaphenylene diamine (MPD) or 3,3'-diaminobenzophenone (DBAP). Both polymers exhibit excellent adhesive properties; however, the IDPA-MPD is the more attractive system because of a combination of high mechanical and physical properties as well as being made from commercially attractive monomers. The IDPA-MPD is an isomeric form of the commercially available adhesive and matrix resin, LARC-TPI and both systems have the same glass transition temperature and exhibit similar adhesive properties.

Progar, Donald J.↗

NASA NTRS1989

Adhesion, friction, and wear of plasma-deposited thin silicon nitride films at temperatures to 700 C

The adhesion, friction, and wear behavior of silicon nitride films deposited by low- and high-frequency plasmas (30 kHz and 13.56 MHz) at various temperatures to 700 C in vacuum were examined. The results of the investigation indicated that the Si/N ratios were much greater for the films deposited at 13.56 MHz than for those deposited at 30 kHz. Amorphous silicon was present in both low- and high-frequency plasma-deposited silicon nitride films. However, more amorphous silicon occurred in the films deposited at 13.56 MHz than in those deposited at 30 kHz. Temperature significantly influenced adhesion, friction, and wear of the silicon nitride films. Wear occurred in the contact area at high temperature. The wear correlated with the increase in adhesion and friction for the low- and high-frequency plasma-deposited films above 600 and 500 C, respectively. The low- and high-frequency plasma-deposited thin silicon nitride films exhibited a capability for lubrication (low adhesion and friction) in vacuum at temperatures to 500 and 400 C, respectively.

Miyoshi, K.↗

NASA NTRS1991

Adhesion at metal interfaces

A basic adhesion process is defined, the theory of the properties influencing metallic adhesion is outlined, and theoretical approaches to the interface problem are presented, with emphasis on first-principle calculations as well as jellium-model calculations. The computation of the energies of adhesion as a function of the interfacial separation is performed; fully three-dimensional calculations are presented, and universality in the shapes of the binding energy curves is considered. An embedded-atom method and equivalent-crystal theory are covered in the framework of issues involved in practical adhesion.

Banerjea, Amitava↗

NASA NTRS1992

Surface characterization and adhesion of oxygen plasma-modified LARC-TPI

LARC-TPI, an aromatic thermoplastic polyimide, was exposed to an oxygen plasma as a surface pretreatment for adhesive bonding. Chemical and physical changes which occurred in the polyimide surface as a result of the plasma treatment were investigated using X-ray photoelectron spectroscopy (XPS), infrared reflection-absorption spectroscopy (IR-RAS), contact-angle analysis, ellipsometry, and high resolution SEM. A 180-deg peel test with an acrylate-based pressure sensitive adhesive as a flexible adherent was utilized to study the interactions of the plasma-treated polyimide surface with other polymeric materials. The surface characterization and adhesion testing results showed that the oxygen plasma treatment, while creating a more hydrophilic, polar surface, also caused chain scission, resulting in the formation of a weak boundary layer which inhibited adhesion.

Chin, J. W.↗

NASA NTRS1992

Coherent structures in the universe and the adhesion model

An adhesion model is used to study the formation process of large-scale structures due to nonlinear gravitational growth of small initial fluctuations in the universe dominated by dark matter. The model is compared with 2D N-body simulations with initial power-law spectral indices n = -2, 0, +2, and various cutoffs. It is found that the adhesion model imitates the skeleton of the structure extremely well for the parameters of the initial spectra until the stage when the nonlinear scale reaches the correlation length R(phi) of the initial gravitational potential. The model explains the origin of large-scale coherent sructures, such as superpancakes and superfilaments, as a result of coherent motion of clumps due to large-scale inhomogeneities in the initial gravitational potential. It is found that clumps of mass identified in the N-body simulations correspond to several knots in the adhesion model, which influences the way of calculating the mass distribution function. The distribution functions of velocities and masses of clumps and areas of cells in the adhesion model satisfy self-similar scaling laws of the n = 2 model.

Kofman, Lev↗