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At least 199 records · Page 11

The Space Technology 5 Avionics System

The Space Technology 5 (ST5) mission is a NASA New Millennium Program project that will validate new technologies for future space science missions and demonstrate the feasibility of building launching and operating multiple, miniature spacecraft that can collect research-quality in-situ science measurements. The three satellites in the ST5 constellation will be launched into a sun-synchronous Earth orbit in early 2006. ST5 fits into the 25-kilogram and 24-watt class of very small but fully capable spacecraft. The new technologies and design concepts for a compact power and command and data handling (C&DH) avionics system are presented. The 2-card ST5 avionics design incorporates new technology components while being tightly constrained in mass, power and volume. In order to hold down the mass and volume, and quali& new technologies for fUture use in space, high efficiency triple-junction solar cells and a lithium-ion battery were baselined into the power system design. The flight computer is co-located with the power system electronics in an integral spacecraft structural enclosure called the card cage assembly. The flight computer has a full set of uplink, downlink and solid-state recording capabilities, and it implements a new CMOS Ultra-Low Power Radiation Tolerant logic technology. There were a number of challenges imposed by the ST5 mission. Specifically, designing a micro-sat class spacecraft demanded that minimizing mass, volume and power dissipation would drive the overall design. The result is a very streamlined approach, while striving to maintain a high level of capability, The mission's radiation requirements, along with the low voltage DC power distribution, limited the selection of analog parts that can operate within these constraints. The challenge of qualifying new technology components for the space environment within a short development schedule was another hurdle. The mission requirements also demanded magnetic cleanliness in order to reduce the effect of stray (spacecraft-generated) magnetic fields on the science-grade magnetometer.

Speer, Dave↗

Ultrafast radiographic imaging and tracking: An overview of instruments, methods, data, and applications

Ultrafast radiographic imaging and tracking (U-RadIT) use state-of-the-art ionizing particle and light sources to experimentally study sub-nanosecond transients or dynamic processes in physics, chemistry, biology, geology, materials science and other fields. These processes are fundamental to modern technologies and applications, such as nuclear fusion energy, advanced manufacturing, communication, and green transportation, which often involve one mole or more atoms and elementary particles, and thus are challenging to compute by using the first principles of quantum physics or other forward models. One of the central problems in U-RadIT is to optimize information yield through, e.g. high-luminosity X-ray and particle sources, efficient imaging and tracking detectors, novel methods to collect data, and large-bandwidth online and offline data processing, regulated by the underlying physics, statistics, and computing power. We review and highlight recent progress in: (a.) Detectors such as high-speed complementary metal-oxide semiconductor (CMOS) cameras, hybrid pixelated array detectors integrated with Timepix4 and other application-specific integrated circuits (ASICs), and digital photon detectors; (b.) U-RadIT modalities such as dynamic phase contrast imaging, dynamic diffractive imaging, and four-dimensional (4D) particle tracking; (c.) U-RadIT data and algorithms such as neural networks and machine learning, and (d.) Applications in ultrafast dynamic material science using XFELs, synchrotrons and laser-driven sources. Hardware-centric approaches to U-RadIT optimization are constrained by detector material properties, low signal-to-noise ratio, high cost and long development cycles of critical hardware components such as ASICs. Interpretation of experimental data, including comparisons with forward models, is frequently hindered by sparse measurements, model and measurement uncertainties, and noise. Alternatively, U-RadIT make increasing use of data science and machine learning algorithms, including experimental implementations of compressed sensing. Machine learning and artificial intelligence approaches, refined by physics and materials information, may also contribute significantly to data interpretation, uncertainty quantification and U-RadIT optimization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

AstroPix: ATLAS-Inspired Silicon Pixels for Future Space-Based Gamma-ray Telescopes

Space-based gamma-ray telescopes such as the Fermi Large Area Telescope have used single sided silicon strip detectors to measure the position of incident gamma-rays with high resolution. At lower energies, two dimensional position information within a single detector is required. This talk investigates the use of monolithic CMOS active pixel silicon sensors –AstroPix – as a novel technology for use in future gamma-ray telescopes. Based upon detectors designed for use in the ATLAS detector at the LHC, AstroPix has the potential to maintain the high energy and angular resolution required of a medium-energy gamma-ray telescope while reducing noise with the dual detection and readout capabilities of a CMOS chip. The status of AstroPix development and testing, as well as outlook for application in future telescopes such as the proposed medium-energy gamma-ray telescope AMEGO-X, will be presented.

Amanda L. Steinhebel↗

256X256 CMOS Active Pixel Sensor Camera-on-a-Chip

A CMOS imaging sensor is described that uses active pixel sensor (APS) technology which permits the integration of the detector array with on-chip timing, control and signal chain electronics. This sensor has been used to implement a CMOS APS camera-on-a-chip.

active↗

Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors

In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.

Jewell, April D.↗

Cosmic ray-induced soft errors in static MOS memory cells

Previous analytical models were extended to predict cosmic ray-induced soft error rates in static MOS memory devices. The effect is due to ionization and can be introduced by high energy, heavy ion components of the galactic environment. The results indicate that the sensitivity of memory cells is directly related to the density of the particular MOS technology which determines the node capacitance values. Hence, CMOS is less sensitive than e.g., PMOS. In addition, static MOS memory cells are less sensitive than dynamic ones due to differences in the mechanisms of storing bits. The flip-flop of a static cell is inherently stable against cosmic ray-induced bit flips. Predicted error rates on a CMOS RAM and a PMOS shift register are in general agreement with previous spacecraft flight data.

Sivo, L. L.↗

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification.

Buehler, M. G.↗

Heavy-ion induced single-event upset in integrated circuits

The cosmic ray environment in space can affect the operation of Integrated Circuit (IC) devices via the phenomenon of Single Event Upset (SEU). In particular, heavy ions passing through an IC can induce sufficient integrated current (charge) to alter the state of a bistable circuit, for example a memory cell. The SEU effect is studied in great detail in both static and dynamic memory devices, as well as microprocessors fabricated from bipolar, Complementary Metal Oxide Semiconductor (CMOS) and N channel Metal Oxide Semiconductor (NMOS) technologies. Each device/process reflects its individual characteristics (minimum scale geometry/process parameters) via a unique response to the direct ionization of electron hole pairs by heavy ion tracks. A summary of these analytical and experimental SEU investigations is presented.

Zoutendyk, J. A.↗

Self arbitrated VLSI asynchronous sequential circuits

A new class of asynchronous sequential circuits is introduced in this paper. The new design procedures are oriented towards producing asynchronous sequential circuits that are implemented with CMOS VLSI and take advantage of pass transistor technology. The first design algorithm utilizes a standard Single Transition Time (STT) state assignment. The second method introduces a new class of self synchronizing asynchronous circuits which eliminates the need for critical race free state assignments. These circuits arbitrate the transition path action by forcing the circuit to sequence through proper unstable states. These methods result in near minimum hardware since only the transition paths associated with state variable changes need to be implemented with pass transistor networks.

Whitaker, S.↗

Reliability Considerations of ULP Scaled CMOS in Spacecraft Systems

NASA, the aerospace community, and other high reliability (hi-rel) users of advanced microelectronic products face many challenges as technology continues to scale into the deep sub-micron region. Decreasing the feature size of CMOS devices not only allows more components to be placed on a single chip, but it increases performance by allowing faster switching (or clock) speeds with reduced power compared to larger scaled devices. Higher performance, and lower operating and stand-by power characteristics of Ultra-Low Power (ULP) microelectronics are not only desirable, but also necessary to meet low power consumption design goals of critical spacecraft systems. The integration of these components in such systems, however, must be balanced with the overall risk tolerance of the project.

reliability↗

Study of CMOS strip sensor for future silicon tracker

Monolithic silicon sensors developed with High-Voltage CMOS (HV-CMOS) processes have become highly attractive for charged particle tracking. Compared with the standard CMOS sensors, HV-CMOS sensors can provide larger and deeper depletion regions that lead to larger signals and faster charge collection. They can provide high position resolution, low material budget, high radiation hardness and low cost that are desirable for high performance tracking in harsh collision environment. Various studies have been conducted to explore the technology feasibility for the large-area tracking systems at future collider experiments. CHESS (CMOS HV/HR Evaluation for Strip Sensor) sensor series have been developed as an alternative solution to the conventional silicon micro-strip detectors for the ATLAS inner tracker upgrade. The first prototype (named CHESS1) was to evaluate the diode geometry and the in-pixel analog electronics. Obtained test results were used to optimize the second prototype (named CHESS2). CHESS2 was implemented with a full digital readout architecture and realized as a full reticle sized monolithic sensor. Here, the basic characteristics of the CHESS2 prototype sensors and their performance in response to different input signals are presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Development of CMOS Sensors for HEP with a US-based foundry

We will present a program to establish the first development and manufacturing of HEP-specific sensors monolithically integrated into a standard CMOS process using a US-based foundry. In collaboration with several US universities the project aims to develop Monolithic Active Pixel Sensors (MAPS) designs implemented in the 90 nm technology node, including simple test structures and multi-pixel arrays, and monolithic CMOS sensors with readout integrated circuits, perform detailed characterization of the detector prototypes and quantify their performance for HEP applications.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Gate-Tunable Short-Wave Infrared Polycrystalline GeSn Phototransistors on Noncrystalline Substrates

GeSn is a group-IV alloy with immense potential to advance microelectronics technology due to its intrinsic compatibility with existing Si CMOS processes. With a sufficiently high Sn composition, GeSn is classified as a direct bandgap semiconductor. Polycrystalline GeSn holds several additional advantages, including its significantly lower synthesis cost compared to its epitaxial counterpart, as well as the versatility to grow these films on a variety of substrates. Here, in this work, we present a polycrystalline thin-film GeSn phototransistor on a fused silica substrate with a Sn composition of ~10%, showing a photoresponse in the short-wave infrared wavelength range, critical for emerging sensing applications. This device shows a gate-tunable response, with responsivities approaching up to 1.7 mA/W with only a 30 nm-thick GeSn layer. Furthermore, phototransistors offer additional adaptability through gating, which allows for the reduction of dark current. This not only enhances the signal-to-noise ratio but also offers more flexible integration with various image sensor readout implementations using different substrates. The specific detectivity of this phototransistor is within an order of magnitude of those of previously reported GeSn photodetectors grown by molecular beam epitaxy and chemical vapor deposition, even though the absorber is 3 to 20× thinner while the electrode spacing for photocarrier transport is approximately 15× longer than the carrier diffusion length in this work, showing great potential benefits of extending similar device structures to epitaxial GeSn layers. As these GeSn phototransistors utilize a noncrystalline substrate, our work establishes a fundamentally more versatile path toward monolithically integrated GeSn-based photodetectors for next-generation multimodal sensors.

36 MATERIALS SCIENCE↗

LSI computer design - SUMC/DV.

Advanced Technology Laboratories has designed, built, and tested the first CMOS general-purpose computer. The computer executes 32 instructions that are operation-code compatible with the IBM 360 and RCA Spectra 70 series of computers. The computer is supported by 2k words of main-memory LSI storage and a TTY peripheral for input and output operations. Additionally, a simulator, an assembler, and a loader have been constructed to provide software support to the hardware. This paper provides an overall picture of this computer project.

Clapp, W. A.↗

Bridging faults in BiCMOS circuits

Combining the advantages of CMOS and bipolar, BiCMOS is emerging as a major technology for many high performance digital and mixed signal applications. Recent investigations revealed that bridging faults can be a major failure mode in IC's. Effects of bridging faults in BiCMOS circuits are presented. Bridging faults between logical units without feedback and logical units with feedback are considered. Several bridging faults can be detected by monitoring the power supply current (I(sub DDQ) monitoring). Effects of bridging faults and bridging resistance on output logic levels were examined along with their effects on noise immunity.

Menon, Sankaran M.↗

A 32-Channel Cryo-CMOS ASIC for SNSPD Biasing and Readout with Picosecond

Superconducting nanowire single-photon detectors (SNSPD) are a promising technology for particle detection. Although SNSPDs have demonstrated picosecond timing accuracy, scaling up large arrays has proved challenging. In this work, we introduce a 32-channel cryo-CMOS application-specific integrated circuit (ASIC) that can be tightly integrated with SNSPD arrays. The ASIC is designed to operate at a temperature of 4K and can perform up to 32 simultaneous timing measurements with a root-mean-square (RMS) accuracy of 8.0ps. The ASIC includes on-chip circuitry for externally biasing superconducting devices, low-noise amplifiers for reading superconducting devices, high-resolution time-to-digital converters (TDC) for time-tagging events, and serializers for transmitting data to room-temperature electronics. The ASIC is manufactured in a 22nm FDSOI process and occupies an area of 4.0mm x 1.0mm. The performance of the ASIC was verified using custom cryogenic device models internally developed for the 22nm SOI process. Measurement results will be presented at the conference.

Fredenburg, Jeff↗

Flight Computer Design for the Space Technology 5 (ST-5) Mission

As part of NASA's New Millennium Program, the Space Technology 5 mission will validate a variety of technologies for nano-satellite and constellation mission applications. Included are: a miniaturized and low power X-band transponder, a constellation communication and navigation transceiver, a cold gas micro-thruster, two different variable emittance (thermal) controllers, flex cables for solar array power collection, autonomous groundbased constellation management tools, and a new CMOS ultra low-power, radiation-tolerant, +0.5 volt logic technology. The ST-5 focus is on small and low-power. A single-processor, multi-function flight computer will implement direct digital and analog interfaces to all of the other spacecraft subsystems and components. There will not be a distributed data system that uses a standardized serial bus such as MIL-STD-1553 or MIL-STD-1773. The flight software running on the single processor will be responsible for all real-time processing associated with: guidance, navigation and control, command and data handling (C&DH) including uplink/downlink, power switching and battery charge management, science data analysis and storage, intra-constellation communications, and housekeeping data collection and logging. As a nanosatellite trail-blazer for future constellations of up to 100 separate space vehicles, ST-5 will demonstrate a compact (single board), low power (5.5 watts) solution to the data acquisition, control, communications, processing and storage requirements that have traditionally required an entire network of separate circuit boards and/or avionics boxes. In addition to the New Millennium technologies, other major spacecraft subsystems include the power system electronics, a lithium-ion battery, triple-junction solar cell arrays, a science-grade magnetometer, a miniature spinning sun sensor, and a propulsion system.

Speer, David↗

Gigahertz-frequency acousto-optic phase modulation of visible light in a CMOS-fabricated photonic circuit

Optical phase modulators operating at visible wavelengths are essential components for photonic technologies such as those for quantum control, communications, and laser ranging. However, they remain challenging to implement in scalable, integrated platforms capable of handling high optical powers. Here we present a visible-light, gigahertz-frequency acousto-optic phase modulator, fabricated on a 200-mm wafer in a volume CMOS foundry, that supports greater than 500 mW of optical power at 730 nm. The device combines a piezoelectric transducer and a photonic waveguide within a single, wavelength-scale structure that confines both a propagating optical mode and an electrically excitable breathing-mode mechanical resonance. By tuning the device’s geometry to optimize the optomechanical interaction, we achieve modulation depths up to 4.85 rad with 80 mW of applied microwave power at 2.31 GHz in a 2-mm-long device. This corresponds to resonant modulation figures of merit of V π = 1.32V and V π ⋅ L = 0.26V cm. To our knowledge, this is the lowest V π ever demonstrated in any acousto-optic phase modulator and represents a 15-fold reduction in V π and a 100-fold reduction in required microwave power relative to state-of-the-art modulators with high visible-wavelength power handling commonly employed in quantum control systems.

Freedman, Jacob M. [Univ. of Arizona, Tucson, AZ (↗