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Overview of agency-level electronic parts management, the NASA Electronic Parts and Packaging (NEPP) Program, and NEPP Program Fiscal Year 2019 task investment areas.
The purpose of the Integrated Sensor System (ISS) Data Enhancement Package (DEP) is to improve the accuracies of the data obtained from the inflight tests performed on aircraft. The DEP is a microprocessor-based, flight-qualified electronics package that assimilates data from a Ring Laser Gyro (RGL) system, a standard NASA air data package, and other inputs. The DEP then processes these inputs in real-time to obtain optimal estimates of the aircraft velocity, attitude, and altitude. These estimates can be passed to the flight crew, downlinked, and/or stored on a mass storage medium. The DEP is now being built for the NASA Dryden Flight Research Center. Completion is anticipated in early 1984. A primary use of the ISS/DEP will be for the collection of quality data for the estimation of aircraft aerodynamic coefficients, including stability derivatives, using system identification methods. Initial anticipated applications will be on the AV-8B, F-14, and X-29 test aircraft.
C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.
This project, initially part of OPEN 2018, and subsequently the ASCEND effort, targeted demonstration of significant enhancements in internal permanent magnet (IPM) motor torque and power density for current and future ground and air electric transportation applications. These were achieved through: (1) embedded two-phase system thermal management, (2) coupled, multi-scale electrical-electromagnetic-thermal-mechanical co-design and optimization, (3) size and weight reduction of motor and drive electronics through elimination of redundant cooling and coupling hardware, and (4) higher efficiency operation of SiC wide bandgap power electronics packaging through high temperature operation (200 oC). The proposed approach utilizes a single dielectric coolant for closed loop two-phase thermal management, and a combined heat rejection unit for the IPM and drive. Wick assisted liquid delivery for evaporative thermal management is utilized for the motor, and the drive electronics utilize the same coolant in flow boiling within the cold plate structures. Through the use of three-dimensional packaging for SiC, and novel drive topologies with reduced switching losses, significant increases in power density and compactness were targeted.
Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.
This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.
The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.
This presentation includes NASA Electronic Parts and Packaging (NEPP) Program Field Programmable Gate Array (FPGA) considerations and FPGA radiation tasks overview.
A multi-organizational team at the Goddard Space Flight Center is developing a new far infrared (FIR) camera system which furthers the state of the art for this type of instrument by the incorporating recent advances in several technological disciplines. All aspects of the camera system are optimized for operation at the high data rates required for astronomical observations in the far infrared. The instrument is built around a Blocked Impurity Band (BIB) detector array which exhibits responsivity over a broad wavelength band and which is capable of operating at 1000 frames/sec, and consists of a focal plane dewar, a compact camera head electronics package, and a Digital Signal Processor (DSP)-based data system residing in a standard 486 personal computer. In this paper we discuss the overall system architecture, the focal plane dewar, and advanced features and design considerations for the electronics. This system, or one derived from it, may prove useful for many commercial and/or industrial infrared imaging or spectroscopic applications, including thermal machine vision for robotic manufacturing, photographic observation of short-duration thermal events such as combustion or chemical reactions, and high-resolution surveillance imaging.
The Galileo Net Flux Radiometer (NFR) is a probe instrument designed to measure the vertical profile of upward and net radiation fluxes in five spectral bands spanning the range from solar to far infrared wavelengths. These unique measurements within Jupiter's atmosphere, from which radiative heating and cooling profiles will be derived, will contribute to our understanding of Jovian atmospheric dynamics, to the detection of cloud layers and determination of their opacities, and to the estimation of water vapor abundance. The NFR uses an array of pyroelectric detectors and individual bandpass filters in a sealed detector package. The detector package and optics rotate as a unit to provide chopping between views of upward and downward radiation fluxes. This arrangement makes possible the measurement of small net fluxes in the presence of large ambient fluxes. A microprocessor-controlled electronics package handles instrument operation.
The attitude Control Electronics (ACE) Box is the center of the Attitude Control Subsystem (ACS) for the Solar Anomalous and Magnetospheric Particle Explorer (SAMPEX) satellite. This unit is the single point interface for all of the Attitude Control Subsystem (ACS) related sensors and actuators. Commands and telemetry between the SAMPEX flight computer and the ACE Box are routed via a MIL-STD-1773 bus interface, through the use of an 80C85 processor. The ACE Box consists of the flowing electronic elements: power supply, momentum wheel driver, electromagnet driver, coarse sun sensor interface, digital sun sensor interface, magnetometer interface, and satellite computer interface. In addition, the ACE Box also contains an independent Safehold electronics package capable of keeping the satellite pitch axis pointing towards the sun. The ACE Box has dimensions of 24 x 31 x 8 cm, a mass of 4.3 kg, and an average power consumption of 10.5 W. This set of electronics was completely designed, developed, integrated, and tested by personnel at NASA GSFC. SAMPEX was launched on July 3, 1992, and the initial attitude acquisition was successfully accomplished via the analog Safehold electronics in the ACE Box. This acquisition scenario removed the excess body rates via magnetic control and precessed the satellite pitch axis to within 10 deg of the sun line. The performance of the SAMPEX ACS in general and the ACE Box in particular has been quite satisfactory.
The use of printed electronics technologies (PETs), 2D or 3D printing approaches either by conventional electronic fabrication or by rapid graphic printing of organic or nonorganic electronic devices on various small or large rigid or flexible substrates, is projected to grow exponentially in commercial industry. This has provided an opportunity to determine whether or not PETs could be applicable for low volume and high-reliability applications. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps- on this subject-OE-A, ITRS, and iNEMI-each with a different name identification for this emerging technology. This followed by a brief review of the status of the industry on standard development for this technology, including IEEE and IPC specifications. The report concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging. Understanding key technology roadmaps, parameters, and applications is important when judicially selecting and narrowing the follow-up of new and emerging applicable technologies for evaluation, as well as the low risk insertion of organic, large area, and printed electronics.
Two electrohydraulic vibration isolation systems were designed and fabricated to reduce the vertical vibrations transmitted to the XH-51N research helicopter cabin at the blade passage frequency (18 Hz) and its first harmonic (36 Hz). Hydraulic power and electrical control are provided to two separate servoactuators from a common power supply and control electronics package located behind the pilot's seat. One servoactuator is installed between the cabin and fuselage and replaces an existing passive spring. A second servoactuator is mounted between the existing seat and cabin floor. Both servoactuators incorporate a mechanical failsafe design. The control electronics circuitry provides automatic tracking of the blade passage frequency. Results of laboratory, environmental and ground vibration tests employing an XH-51A stripped down helicopter fuselage show that the active cabin isolator reduces the vertical vibrations transmitted from the fuselage attachment point to the cabin attachment point at 18 and 36 Hz (or as an alternative, 6 Hz) by better than 90 percent.
NLR's advanced power electronics and electric machines (APEEM) research group develops world-class experimental and modeling capabilities to design and evaluate efficient and reliable power electronics and electric machines, as well as innovative thermal management systems to maximize their performance. They also design, fabricate, and characterize advanced power electronics packaging and are developing state-of-health monitoring techniques.
Faraday cups have proven to be very reliable and accurate instruments capable of making 3-D velocity distribution measurements on spinning or 3-axis stabilized spacecraft. Faraday cup instrumentation continues to be appropriate for heliospheric missions. As an example, the reductions in mass possible relative to the solar wind detection system about to be flown on the WIND spacecraft were estimated. Through the use of technology developed or used at the MIT Center for Space Research but were not able to utilize for WIND: surface-mount packaging, field-programmable gate arrays, an optically-switched high voltage supply, and an integrated-circuit power converter, it was estimated that the mass of the Faraday Cup system could be reduced from 5 kg to 1.8 kg. Further redesign of the electronics incorporating hybrid integrated circuits as well as a decrease in the sensor size, with a corresponding increase in measurement cycle time, could lead to a significantly lower mass for other mission applications. Reduction in mass of the entire spacecraft-experiment system is critically dependent on early and continual collaborative efforts between the spacecraft engineers and the experimenters. Those efforts concern a range of issues from spacecraft structure to data systems to the spacecraft power voltage levels. Requirements for flight qualification affect use of newer, lighter electronics packaging and its implementation; the issue of quality assurance needs to be specifically addressed. Lower cost and reduced mass can best be achieved through the efforts of a relatively small group dedicated to the success of the mission. Such a group needs a fixed budget and greater control over quality assurance requirements, together with a reasonable oversight mechanism.
Solar Electric Propulsion (SEP) is currently being studied for possible use in a number of near earth and planetary missions. The thruster subsystem for these missions would consist of 30 centimeter ion thrusters with Power Processor Units (PPU) clustered in assemblies of from two to ten units. A preliminary design study of the electronic packaging of the PPU has been completed at Lewis Research Center of NASA. This study evaluates designs meeting the competing requirements of low system weight and overall mission flexibility. These requirements are evaluated regarding structural and thermal design, electrical efficiency, and integration of the electrical circuits into a functional PPU layout.
Solar Electric Propulsion (SEP) is currently being studied for possible use in a number of near earth and planetary missions. The thruster subsystem for these missions would consist of 30 centimeter ion thrusters with Power Processor Units (PPU) clustered in assemblies of from two to ten units. A preliminary design study of the electronic packaging of the PPU has been completed at Lewis Research Center of NASA. This study evaluates designs meeting the competing requirements of low system weight and overall mission flexibility. These requirements are evaluated regarding structural and thermal design, electrical efficiency, and integration of the electrical circuits into a functional PPU layout.
Abstract Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and HEVs), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms of performance. Particular focus is placed upon emerging solutions regarded to hold great potential, such as phase-change materials (PCMs). PCMs have been regarded for some time as a means of transferring heat quickly away from the region with the electronic components and are widely regarded as a possible means of carrying out cooling in large scale from small areas, because of their high latent heat of fusion, high specific heat, temperature stability, and small volume change during phase change, etc. They have already been utilized as a method of passive cooling in electronics in various ways, but their adoption in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available power module used in automotive applications.