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At least 199 records · Page 11

Modeling and Characterization of Crushable Composite Structures

The crushing response and the energy absorption capacity of a quasi-isotropic C-shaped composite panel is presented to simulate the progressive damage and failure mechanisms involved in the component testing. Crushable composite structures are widely used for impact applications, as because of their great high-energy absorption capability and lower weight. Simulating the crush characteristics of composite structures is challenging, as the conventional tools fail to accurately represent the failure mechanisms at the component level. Here, a cost-effective predictive tool ‘CZone’ is applied for simulating the crushing response of composite materials. CZone for Abaqus (CZA) is an add-on capability for Abaqus/Explicit and combines with the commercially available impact modeling capabilities included within the Abaqus finite element software package.

crush zone↗

Failure Modes in Capacitors When Tested Under a Time-Varying Stress

Steady step surge testing (SSST) is widely applied to screen out potential power-on failures in solid tantalum capacitors. The test simulates the power supply's on and off characteristics. Power-on failure has been the prevalent failure mechanism for solid tantalum capacitors for decoupling applications. On the other hand, the SSST can also be reviewed as an electrically destructive test under a time-varying stress. It consists of rapidly charging the capacitor with incremental voltage increases, through a low resistance in series, until the capacitor under test is electrically shorted. Highly accelerated life testing (HALT) is usually a time-efficient method for determining the failure mechanism in capacitors; however, a destructive test under a time-varying stress like SSST is even more effective. It normally takes days to complete a HALT test, but it only takes minutes for a time-varying stress test to produce failures. The advantage of incorporating specific time-varying stress into a statistical model is significant in providing an alternative life test method for quickly revealing the failure modes in capacitors. In this paper, a time-varying stress has been incorporated into the Weibull model to characterize the failure modes. The SSST circuit and transient conditions to correctly test the capacitors is discussed. Finally, the SSST was applied for testing polymer aluminum capacitors (PA capacitors), Ta capacitors, and multi-layer ceramic capacitors with both precious metal electrode (PME) and base-metal-electrodes (BME). It appears that testing results are directly associated to the dielectric layer breakdown in PA and Ta capacitors and are independent on the capacitor values, the way the capacitors being built, and the manufactures. The testing results also reveal that ceramic capacitors exhibit breakdown voltages more than 20 times the rated voltage, and the breakdown voltages are inverse proportional to the dielectric layer thickness. The possibility of ceramic capacitors in front-end decoupling applications to block the surge noise from a power supply is also discussed.

Liu, David (Donhang)↗

Assessing photovoltaic module degradation and lifetime from long term environmental tests

The photovoltaic module failure mechanisms related to temperature, humidity, and electrical bias are analyzed using the data collected over a period of 20 years from various sites in the U.S. The approach is based on measuring the rate dependence of the mechanisms on site stress levels, and then using the rate data to analytically estimate the field life by means of computer models of the site environment. A correlation is established between the accelerated constant-stress testing and the time-varying field exposures. Test results are presented for two failure mechanisms for a module design featuring polyvinyl butyral encapsulant for the temperature range of 85 to 100 C and 85-percent relative humidity.

Otth, D. H.↗

Prognostics Approach for Power MOSFET Under Thermal-Stress

The prognostic technique for a power MOSFET presented in this paper is based on accelerated aging of MOSFET IRF520Npbf in a TO-220 package. The methodology utilizes thermal and power cycling to accelerate the life of the devices. The major failure mechanism for the stress conditions is dieattachment degradation, typical for discrete devices with leadfree solder die attachment. It has been determined that dieattach degradation results in an increase in ON-state resistance due to its dependence on junction temperature. Increasing resistance, thus, can be used as a precursor of failure for the die-attach failure mechanism under thermal stress. A feature based on normalized ON-resistance is computed from in-situ measurements of the electro-thermal response. An Extended Kalman filter is used as a model-based prognostics techniques based on the Bayesian tracking framework. The proposed prognostics technique reports on preliminary work that serves as a case study on the prediction of remaining life of power MOSFETs and builds upon the work presented in [1]. The algorithm considered in this study had been used as prognostics algorithm in different applications and is regarded as suitable candidate for component level prognostics. This work attempts to further the validation of such algorithm by presenting it with real degradation data including measurements from real sensors, which include all the complications (noise, bias, etc.) that are regularly not captured on simulated degradation data. The algorithm is developed and tested on the accelerated aging test timescale. In real world operation, the timescale of the degradation process and therefore the RUL predictions will be considerable larger. It is hypothesized that even though the timescale will be larger, it remains constant through the degradation process and the algorithm and model would still apply under the slower degradation process. By using accelerated aging data with actual device measurements and real sensors (no simulated behavior), we are attempting to assess how such algorithm behaves under realistic conditions.

Power MOSFET PHM↗

Special tests and destructive physical analyses as used by the Aerospace Corporation with nickel-hydrogen cells

The destructive physical analysis (DPA) of electrochemical devices is an important part of the overall test. Specific tests were developed to investigate the degradation mode or the failure mechanism that surfaces during the course of a cell being assembled, acceptance tested, and life-cycle tested. The tests that have been developed are peculiar to the cell chemistry under investigation. Tests are often developed by an individual or group of researchers as a result of their particular interest in an unresolved failure mechanism or degradation mode. A series of production, operational, and storage issues that were addressed by the Electrochemistry Group at The Aerospace Corporation are addressed. As a result of these investigations, as well as associated research studies carried out to develop a clearer understanding of the nickel oxyhydroxide electrode, a series of unique and useful specialized tests were developed. Some of these special tests were assembled to describe the methods that were found to be particularly useful in resolving a wide spectrum of manufacturing, operational, and storage issues related to nickel-hydrogen cells. The general methodology of these tests is given here with references listed to provide the reader with a more detailed understanding of the tests. The tests are classified according to the sequencing, starting with the impregnation of the nickel plaque material and culminating with the storage of completed cells. The details of the wet chemical procedures that were found to be useful because of their accuracy and reproducibility are given. The equations used to make the appropriate calculations are listed.

Zimmerman, A. H.↗

Proportional and scale change models to project failures of mechanical components with applications to space station

In this paper we develop the mathematical theory of proportional and scale change models to perform reliability analysis. The results obtained will be applied for the Reaction Control System (RCS) thruster valves on an orbiter. With the advent of extended EVA's associated with PROX OPS (ISSA & MIR), and docking, the loss of a thruster valve now takes on an expanded safety significance. Previous studies assume a homogeneous population of components with each component having the same failure rate. However, as various components experience different stresses and are exposed to different environments, their failure rates change with time. In this paper we model the reliability of a thruster valves by treating these valves as a censored repairable system. The model for each valve will take the form of a nonhomogeneous process with the intensity function that is either treated as a proportional hazard model, or a scale change random effects hazard model. Each component has an associated z, an independent realization of the random variable Z from a distribution G(z). This unobserved quantity z can be used to describe heterogeneity systematically. For various models methods for estimating the model parameters using censored data will be developed. Available field data (from previously flown flights) is from non-renewable systems. The estimated failure rate using such data will need to be modified for renewable systems such as thruster valve.

Taneja, Vidya S.↗

Healing of voids in the aluminum metallization of integrated circuit chips

The thermal stability of GaAs modulation-doped field effect transistors (MODFETs) is evaluated in order to identify failure mechanisms and validate the reliability of these devices. The transistors were exposed to thermal step-stress and characterized at ambient temperatures to indicate device reliability, especially that of the transistor ohmic contacts with and without molybdenum diffusion barriers. The devices without molybdenum exhibited important transconductance deterioration. MODFETs with molybdenum diffusion barriers were tolerant to temperatures above 300 C. This tolerance indicates that thermally activated failure mechanisms are slow at operational temperatures. Therefore, high-reliability MODFET-based circuits are possible.

Cuddihy, Edward F.↗

Controlled impact demonstration airframe bending bridges

The calibration of the KRASH and DYCAST models for transport aircraft is discussed. The FAA uses computer analysis techniques to predict the response of controlled impact demonstration (CID) during impact. The moment bridges can provide a direct correlation between the predictive loads or moments that the models will predict and what was experienced during the actual impact. Another goal is to examine structural failure mechanisms and correlate with analytical predictions. The bending bridges did achieve their goals and objectives. The data traces do provide some insight with respect to airframe loads and structural response. They demonstrate quite clearly what's happening to the airframe. A direct quantification of metal airframe loads was measured by the moment bridges. The measured moments can be correlated with the KRASH and DYCAST computer models. The bending bridge data support airframe failure mechanisms analysis and provide residual airframe strength estimation. It did not appear as if any of the bending bridges on the airframe exceeded limit loads. (The observed airframe fracture was due to the fuselage encounter with the tomahawk which tore out the keel beam.) The airframe bridges can be used to estimate the impact conditions and those estimates are correlating with some of the other data measurements. Structural response, frequency and structural damping are readily measured by the moment bridges.

Soltis, S. J.↗

Impact Damage and Strain Rate Effects for Toughened Epoxy Composite Structures

Structural integrity of composite systems under dynamic impact loading is investigated herein. The GENOA virtual testing software environment is used to implement the effects of dynamic loading on fracture progression and damage tolerance. Combinations of graphite and glass fibers with a toughened epoxy matrix are investigated. The effect of a ceramic coating for the absorption of impact energy is also included. Impact and post impact simulations include verification and prediction of (1) Load and Impact Energy, (2) Impact Damage Size, (3) Maximum Impact Peak Load, (4) Residual Strength, (5) Maximum Displacement, (6) Contribution of Failure Modes to Failure Mechanisms, (7) Prediction of Impact Load Versus Time, and (8) Damage, and Fracture Pattern. A computer model is utilized for the assessment of structural response, progressive fracture, and defect/damage tolerance characteristics. Results show the damage progression sequence and the changes in the structural response characteristics due to dynamic impact. The fundamental premise of computational simulation is that the complete evaluation of composite fracture requires an assessment of ply and subply level damage/fracture processes as the structure is subjected to loads. Simulation results for the graphite/epoxy composite were compared with the impact and tension failure test data, correlation and verification was obtained that included: (1) impact energy, (2) damage size, (3) maximum impact peak load, (4) residual strength, (5) maximum displacement, and (6) failure mechanisms of the composite structure.

Chamis, Christos C.↗

Solid polymer membrane program

The results are presented for a solid polymer electrolyte fuel cell development program. Failure mechanism was identified and resolution of the mechanism experienced in small stack testing was demonstrated. The effect included laboratory analysis and evaluation of a matrix of configurations and operational variables for effects on the degree of hydrogen fluoride released from the cell and on the degree of blistering/delamination occurring in the reactant inlet areas of the cell and to correlate these conditions with cell life capabilities. The laboratory evaluation tests were run at conditions intended to accelerate the degradation of the solid polymer electrolyte in order to obtain relative evaluations as quick as possible. Evaluation of the resolutions for the identified failure mechanism in space shuttle configuration cell assemblies was achieved with the fabrication and life testing of two small stack buildups of four cell assemblies and eight cells each.

Source record↗

Building and Breaking Carbon Composites with REACTER

Carbon-based composites have become indispensable materials in aerospace and other high-performance applications, yet obtaining a detailed, nanoscale understanding of their morphology and failure mechanisms using only experimental methods remains a difficult challenge. REACTER is a versatile computational modeling tool for atomistic molecular dynamics simulations designed to model chemical reactions at the speed and length scales of classical force fields. In this work, several recent features of REACTER were applied to the creation and subsequent mechanical testing of two classes of carbon composites: carbon nanotube (CNT) composites and carbon fiber reinforced polymers (CFRP). A network of CNTs was grown dynamically using the new ‘create atoms’ feature of REACTER. The CNT filler was embedded into a polyarylacetylene (PAA) matrix by simulated in situ polymerization to obtain the final composite model. To generate the second class of carbon composite, fully carbonized (graphitic) carbon fiber morphologies were created by the method of Desai et al. [1], but using the advanced reaction constraints framework of REACTER. Two fiber models were created, representing a circular carbon fiber core and a flat surface, and similarly infiltrated with resin to obtain the final CFRP structure. Failure mechanisms were elucidated by simulating mechanically induced bond breaking, as characterized by third order DFT-based tight-binding simulations, via a reaction constraint on the total potential energy of the involved atoms.

Polymer↗

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

PRTs↗

Building and Breaking Carbon Composites with REACTER

Carbon composites have become indispensable for aerospace and other high-performance applications, and a detailed picture of their morphology and failure mechanisms remains difficult to obtain through experiment. REACTER is a versatile computational modeling tool for atomistic molecular dynamics designed to model chemical reactions at the speed and length scales of classical force fields.1 In this work, several recent features of REACTER were applied to the creation and subsequent mechanical testing of two classes of carbon composites, carbon-fiber reinforced polymers (CFRP) and carbon nanotube (CNT) composites. Carbon fiber core morphologies were created by the method of Desai et al.,2 but using the advanced reaction constraints framework of REACTER, their proposed multistep procedure was reduced to a single uninterrupted molecular dynamics simulation. The carbon fiber filler was embedded into a polymer matrix by simulated in situ polymerization of several thermosetting resins, including bismaleimide and polyarylacetylene, to obtain the final CFRP model. To generate the second class of carbon composite, CNT networks were grown dynamically using the new ‘create atoms’ feature of REACTER, and similarly infiltrated with resin to obtain CNT composites. The resulting models were compared directly to experiment using simulated high resolution transmission electron microscopy and x-ray diffraction. Failure mechanisms were elucidated by simulating mechanically induced bond breaking, as characterized by third-order DFT-based tight-binding (DFTB3) simulations, via a reaction constraint on the total potential energy of the involved atoms.

Molecular Dynamics↗

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗

Real time acousto-ultrasonic NDE technique for monitoring damage in ceramic composites under dynamic loads

Research effort was directed towards developing a near real-time, acousto-ultrasonic (AU), nondestructive evaluation (NDE) tool to study the failure mechanisms of ceramic composites. Progression of damage is monitored in real-time by observing the changes in the received AU signal during the actual test. During the real-time AU test, the AU signals are generated and received by the AU transducers attached to the specimen while it is being subjected to increasing quasi-static loads or cyclic loads (10 Hz, R = 1.0). The received AU signals for 64 successive pulses were gated in the time domain (T = 40.96 micro sec) and then averaged every second over ten load cycles and stored in a computer file during fatigue tests. These averaged gated signals are representative of the damage state of the specimen at that point of its fatigue life. This is also the first major attempt in the development and application of real-time AU for continuously monitoring damage accumulation during fatigue without interrupting the test. The present work has verified the capability of the AU technique to assess the damage state in silicon carbide/calcium aluminosilicate (SiC/CAS) and silicon carbide/ magnesium aluminosilicate (SiC/MAS) ceramic composites. Continuous monitoring of damage initiation and progression under quasi-static ramp loading in tension to failure of unidirectional and cross-ply SiC/CAS and quasi-isotropic SiC/MAS ceramic composite specimens at room temperature was accomplished using near real-time AU parameters. The AU technique was shown to be able to detect the stress levels for the onset and saturation of matrix cracks, respectively. The critical cracking stress level is used as a design stress for brittle matrix composites operating at elevated temperatures. The AU technique has found that the critical cracking stress level is 10-15% below the level presently obtained for design purposes from analytical models. An acousto-ultrasonic stress-strain response (AUSSR) model for unidirectional and cross-ply ceramic composites was formulated. The AUSSR model predicts the strain response to increasing stress levels using real-time AU data and classical laminated plate theory. The Weibull parameters of the AUSSR model are used to calculate the design stress for thermo-structural applications. Real-time AU together with the AUSSR model was used to study the failure mechanisms of SiC/CAS ceramic composites under static and fatigue loading. An S-N curve was generated for a cross-ply SiC/CAS ceramic composite material. The AU results are corroborated and complemented by other NDE techniques, namely, in-situ optical microscope video recordings and edge replication.

Tiwari, Anil↗

High-Reliability Waveguide Vacuum/Pressure Window

The NASA Deep Space Network (DSN) uses commercial waveguide windows on the output waveguide of Ka-band (32 GHz) low-noise amplifiers. Mechanical failure of these windows resulted in an unacceptable loss in tracking time. To address this issue, a new Ka-band WR-28 waveguide window has been designed, fabricated, and tested. The window uses a slab of low-loss, low-dielectric constant foam that is bonded into a 1/2-wave-thick waveguide/flange. The foam is a commercially available, rigid, closed-cell polymethacrylimide. It has excellent electrical properties with a dielectric constant of 1.04, and a loss tangent of 0.01. It is relatively strong with a tensile strength of 1 MPa. The material is virtually impermeable to helium. The finished window exhibits a leak rate of less than 3x10(exp -3)cu cm/s with helium. The material is also chemically resistant and can be cleaned with acetone. The window is constructed by fabricating a window body by brazing a short length of WR-28 copper waveguide into a standard rectangular flange, and machining the resulting part to a thickness of 4.6 mm. The foam is machined to a rectangular shape with a dimension of 7.06x3.53 mm. The foam is bonded into the body with a two-part epoxy. After curing, the excess glue and foam are knife-trimmed by hand. The finished window has a loss of less than 0.08 dB (2%) and a return loss of greater than 25 dB at 32 GHz. This meets the requirements for the DSN application. The window is usable for most applications over the entire 26-to-40-GHz waveguide band. The window return loss can be tuned to a required frequency by var y in g the thickness of the window slightly. Most standard waveguide windows use a thin membrane of material bonded into a recess in a waveguide flange, or sandwiched between two flanges with a polymer seal. Designs using the recessed window are prone to mechanical failure over time due to constraints on the dimensions of the recess that allow the bond to fail. Designs using the sandwich method are often permeable to helium, which prohibits the use of helium leak detection. At the time of this reporting, 40 windows have been produced. Twelve are in operation with a combined operating time of over 30,000 hours without a failure.

Britcliffe, Michael J.↗

A new mechanism of failure on polymers

Transparent laminates containing imbedded crystals of various ionic and nonionic substances were prepared and their swelling in distilled water was observed. It was found that under certain conditions, disk-shaped cracks formed around the swollen pockets containing a dissolving crystal. Such cracks can form before equilibrium swelling is reached and may severely damage the elastomer.

Fedors, R. F.↗