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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11

Self-aligned fabrication of vertical, fin-based structures

Modern power devices rely on complex, three-dimensional, vertical designs to increase their power density, ease their thermal management, and improve their reliability. However, fabrication techniques have historically relied on 2D processes for patterning lateral features. This work presents a new technology that uses multiple steps of angled depositions to fabricate self-aligned vertical, fin-based devices that avoid fundamental lithography resolution and alignment limitations. The fabrication flows of two devices, the self-aligned vertical finFET and the high-κ dielectric fin diode, are presented to demonstrate how angled depositions can readily achieve transistors with submicrometer, vertical gates in a source-first process and also create high-aspect ratio GaN fins with a record 70:1 aspect ratio.

Perozek, Joshua (ORCID:0000000251519131)↗

Influence of Time and Frequency Domain Wave Forcing on the Power Estimation of a Wave Energy Converter Array

Industry-specific tools for analyzing and optimizing the design of wave energy converters (WECs) and associated power systems are essential to advancing marine renewable energy. This study aims to quantify the influence of phase information on the device power output of a virtual WEC array. We run the phase-resolving wave model FUNWAVE-TVD (Total Variation Diminishing) to generate directional waves at the PacWave South site offshore from Newport, Oregon, where future WECs are expected to be installed for testing. The two broad cases presented correspond to mean wave climates during warm months (March–August) and cold months (September–February). FUNWAVE-TVD time series of sea-surface elevation are then used in WEC-Sim, a time domain numerical model, to simulate the hydrodynamic response of each device in the array and estimate their power output. For comparison, WEC-Sim is also run with wave energy spectra calculated from the FUNWAVE-TVD simulations, which do not retain phase information, and with wave spectra computed using the phase-averaged model Simulating WAves Nearshore (SWAN). The use of spectral data in WEC-Sim requires a conversion from frequency to time domain by means of random superposition of wave components, which are not necessarily consistent because of the linear assumption implicit in this method. Thus, power response is characterized by multiple realizations of the wave climates.

13 HYDRO ENERGY↗

A Comprehensive Strategy for Grid Forming Control in DC Coupled Photovoltaic and Battery Energy Storage Inverters

This paper presents an integrated DC-DC and DCAC grid-forming control strategy for DC-coupled photovoltaic (PV) plus battery energy storage systems, considering the effect of DC link voltage variations caused by direct PV connections. A power reference algorithm determines power distribution between the PV and battery to the grid while observing device power ratings to prevent the over-rating of components and keep the battery's state of charge within an acceptable range. The simulated utility-scale model in MATLAB/Simulink illustrates its ability against extreme phase angle variation contingencies in the grid while controlled through grid-forming control with a fast dynamic on DC link voltage. The simulation results confirm the effectiveness of the proposed control in integrating PV plus battery configurations with grid forming control and maintaining reliable grid operation under severe grid disturbances.

battery, boost, control, energy storage, grid form↗

Kilovolt dc solid state remote power controller development

The experience gained in developing and applying solid state power controller (SSPC) technology at high voltage dc (HVDC) potentials and power levels of up to 25 kilowatts is summarized. The HVDC switching devices, power switching concepts, drive circuits, and very fast acting overcurrent protection circuits were analyzed. A 25A bipolar breadboard with Darlington connected switching transistor was built. Fault testing at 900 volts was included. A bipolar transistor packaged breadboard design was developed. Power MOSFET remote power controller (RPC) was designed.

Mitchell, J. T.↗

Electrical Impact of SiC Structural Crystal Defects on High Electric Field Devices (Invited)

As illustrated by the invited paper at this conference and other works, SiC wafers and epilayers contain a variety of crystallographic imperfections, including micropipes, closed-core screw dislocations, grain boundaries, basal plane dislocations, heteropolytypic inclusions, and surfaces that are often damaged and contain atomically rough features like step bunching and growth pits or hillocks. Present understanding of the operational impact of various crystal imperfections on SiC electrical devices is reviewed, with an emphasis placed on high-field SiC power devices and circuits.

Neudeck, Philip G.↗

Whispering-Gallery Mode-Locked Lasers

Mode-locked lasers of a proposed type would incorporate features of the design and operation of previously demonstrated miniature electro-optical modulators and erbium-doped glass lasers that contain whispering-gallery-mode (WGM) resonators. That is to say, WGM lasers and WGM electro-optical modulators would be integrated into monolithic units that, when suitably excited with pump light and microwaves, would function as mode-locked lasers. The proposed devices are intended to satisfy an anticipated demand for compact, low-power devices that could operate in the optical-communication wavelength band centered at a wavelength of 1.55 m and could generate pulses as short as picoseconds at repetition rates of multiple gigahertz.

Matsko, Andrey↗

Hand Held Device for Wireless Powering and Interrogation of Biomems Sensors and Actuators

A compact, hand-held device for wireless powering, interrogation and data retrieval from at least one implanted sensor. The hand-held device includes an antenna for powering an implanted sensor and for receiving data from the implanted sensor to the hand-held device for at least one of storage, display or analysis. The hand-held device establishes electromagnetic coupling with a low radiating radio frequency power inductor in the implanted sensor at a predefined separation and the antenna geometry allows for the antenna to power, interrogate and retrieve data from the implanted sensor without strapping the hand-held device to a human body housing the implanted sensor The hand-held device optionally allows for activation of the implanted sensor only during interrogation and data retrieval.

Miranda, Felix Antonio↗

Surge-Energy and Overvoltage Ruggedness of P-Gate GaN HEMTs

An essential ruggedness of power devices is the capability of safely withstanding the surge energy. The surge ruggedness of the GaN high-electron-mobility transistor (HEMT), a power transistor with no or minimal avalanche capability, has not been fully understood. This article unveils the comprehensive physics associated with the surge-energy withstand process and the failure mechanisms of p-gate GaN HEMTs. Two commercial p-gate GaN HEMTs with Ohmic- and Schottky-type gate contacts are studied. Two circuits are developed to study the device surge ruggedness: an unclamped inductive switching circuit is first used to identify the withstand dynamics and failure mechanisms, and a clamped inductive switching circuit with a controllable parasitic inductance is then designed to mimic the surge energy in converter-like switching events. The p-gate GaN HEMT is found to withstand the surge energy through a resonant energy transfer between the device capacitance and the load/parasitic inductance rather than a resistive energy dissipation as occurred in the avalanche. If the device resonant voltage goes below zero, the device reversely turns on and the inductor is discharged. The device failure occurs at the transient of peak resonant voltage and is limited by the device overvoltage capability rather than the surge energy, dV/dt , or overvoltage duration. Almost no energy is dissipated in the resonant withstand process and the device failure is dominated by an electric field rather than a thermal runaway. Furthermore, these results provide critical understandings on the ruggedness of GaN HEMTs and important references for their qualifications and applications.

42 ENGINEERING↗

High Input Voltage, Silicon Carbide Power Processing Unit Performance Demonstration

A silicon carbide brassboard power processing unit has been developed by the NASA Glenn Research Center in Cleveland, Ohio. The power processing unit operates from two sources: a nominal 300 Volt high voltage input bus and a nominal 28 Volt low voltage input bus. The design of the power processing unit includes four low voltage, low power auxiliary supplies, and two parallel 7.5 kilowatt (kW) discharge power supplies that are capable of providing up to 15 kilowatts of total power at 300 to 500 Volts (V) to the thruster. Additionally, the unit contains a housekeeping supply, high voltage input filter, low voltage input filter, and master control board, such that the complete brassboard unit is capable of operating a 12.5 kilowatt Hall effect thruster. The performance of the unit was characterized under both ambient and thermal vacuum test conditions, and the results demonstrate exceptional performance with full power efficiencies exceeding 97%. The unit was also tested with a 12.5kW Hall effect thruster to verify compatibility and output filter specifications. With space-qualified silicon carbide or similar high voltage, high efficiency power devices, this would provide a design solution to address the need for high power electric propulsion systems.

Power↗

Design of an Ultra-High Efficiency GaN High-Power Amplifier for SAR Remote Sensing

This work describes the development of a high-power amplifier for use with a remote sensing SAR system. The amplifier is intended to meet the requirements for the Sweep-SAR technique for use in the proposed DESDynI SAR instrument. In order to optimize the amplifier design, active load-pull technique is employed to provide harmonic tuning to provide efficiency improvements. In addition, some of the techniques to overcome the challenges of load-pulling high power devices are presented. The design amplifier was measured to have 49 dBm of output power with 75% PAE, which is suitable to meet the proposed system requirements.

active load-pull↗

Electrophoretic device and method to separate and detect analyte ions

This invention is directed to an inexpensive, miniaturized, portable, low-power device and method for electrophoretic separation and electrochemical detection of an analyte, including different isotopes of the same element. The invention replaces a conventional or microfabricated capillary electrophoresis tube with a microchip comprising an array of parallel electrophoretic separation nanotubes or aligned hollow channels fabricated in a porous substrate.

Klavetter, Kyle C.↗

Performance Evaluation of High-Speed, Low-Side Gate Driver, FAN3122, over Extended Temperature Range

Emerging power metal-oxide semiconductor field-effect transistor (MOSFETs) based on silicon carbide and gallium nitride technology are finding widespread use in many electronic applications such as motor control and DC/DC converters due to their higher voltage, higher temperature tolerance, and higher frequency switching capabilities. To utilize these power devices and to meet circuit/system compactness, modularity, and operational functionality, gate drivers that provide unique attributes, such as fast switching and high-current handling capability, are needed. In addition, power systems geared for use in space mission applications require on-board devices to withstand exposure to extreme temperatures and wide thermal swings. Very little data, however, exist on the performance of such devices and circuits under extreme temperatures. In this work, the performance of a high-speed gate driver with potential use in controlling power-level transistors was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Wide Bandgap Semiconductors↗

Diagnosing Field Strengths and Plasma Conditions in Magnetically Insulated Transmission Lines Using Active Dopant Spectroscopy

Experimental validation data is needed to inform simulations of large pulsed power devices which are in development to understand and improve existing accelerators and inform future pulsed power capabilities. Using current spectroscopic techniques on the Z-machine, we have been unable to reliably diagnose plasma conditions and electric and magnetic fields within power flow regions. Laser ablation of a material produces a low density plasma, resulting in narrow spectroscopic line widths. By introducing a laser ablated plasma to the anode cathode gap of the Mykonos accelerator, we can monitor how the line shapes change due the current pulse by comparing these line shapes to spectral measurements taken without power flow. In this report we show several examples of measurements conducted on Mykonos on various dopant materials. We also show a negligible effect on power flow due to the presence of the ablation plasma for a range of parameters.

43 PARTICLE ACCELERATORS↗

Computational Modeling Program

An Integrated Product Team (IPT) has been formed at NASA Ames Research Center which has set objectives to investigate devices and processes suitable for meeting NASA requirements on ultrahigh performance computers, fast and low power devices, and high temperature wide bandgap materials. These devices may ultimately be sub-100nm feature-size. Processes and equipment must meet the stringent demands posed by the fabrication of such small devices. Until now, the reactors for Chemical Vapor Deposition (CVD) and plasma processes have been designed by trial and error procedures. Further, once the reactor is in place, optimum processing parameters are found through expensive and time-consuming experimentation. If reliable models are available that describe processes and the operation of the reactors, that chore would be reduced to a routine task while being a cost-effective option. The goal is to develop such a design tool, validate that tool using available data from current generation processes and reactors, and then use that tool to explore avenues for meeting NASA needs for ultrasmall device fabrication. Under the present grant, ARL/Penn State along with other IPT members has been developing models and computer code to meet IPT goals. Some of the accomplishments achieved during the first year of the grant are described in this report

Govindan, T. R.↗

High Input Voltage, Silicon Carbide Power Processing Unit Performance Demonstration

A silicon carbide brassboard power processing unit has been developed by the NASA Glenn Research Center in Cleveland, Ohio. The power processing unit operates from two sources - a nominal 300-Volt high voltage input bus and a nominal 28-Volt low voltage input bus. The design of the power processing unit includes four low voltage, low power supplies that provide power to the thruster auxiliary supplies, and two parallel 7.5 kilowatt power supplies that are capable of providing up to 15 kilowatts of total power at 300-Volts to 500-Volts to the thruster discharge supply. Additionally, the unit contains a housekeeping supply, high voltage input filter, low voltage input filter, and master control board, such that the complete brassboard unit is capable of operating a 12.5 kilowatt Hall Effect Thruster. The performance of unit was characterized under both ambient and thermal vacuum test conditions, and the results demonstrate the exceptional performance with full power efficiencies exceeding 97. With a space-qualified silicon carbide or similar high voltage, high efficiency power device, this design could evolve into a flight design for future missions that require high power electric propulsion systems.

Technology↗

Wide bandgap semiconductor materials and devices

The technological and societal impacts of electronic devices based on Ge, Si, and compound semiconductors like GaAs have been profound, fueling the decades long quest in identifying ever-larger bandgap semiconductors to untap new applications and possibilities. Specifically, an increase in the bandgap leads to shorter wavelength emission and an increased breakdown electric field, which has direct consequences for solid-state lighting like light-emitting diodes (LEDs) and laser diodes (LDs) from the visible (blue-green, blue, and violet) and beyond (UV and deep-UV) spectral range and for radically improved power devices supported by a higher intrinsic breakdown strength. Wide bandgap (WBG) semiconductors represent the frontier of materials that satisfy these criteria and include group IV, III–V, and II–VI material families like SiC (3.2 eV), GaN (3.4 eV), and ZnO (3.4 eV), respectively. With even larger bandgaps exceeding 4 eV, ultrawide bandgap (UWBG) semiconductors include diamond, III-nitrides incorporating Al and B (e.g., AlN, BN, and AlGaN), and sesquioxides like Ga 2 O 3 and (Al,Ga) 2 O 3 . These materials span widely varying stages of technological maturity, with SiC and GaN platforms among the most mature with commercially available devices in RF and high-power electronics, while other platforms such as Ga 2 O 3 rapidly advancing and poised to enable new UV and deep-UV optoelectronic devices. This Special Topic on Wide Bandgap Semiconductor Materials and Devices covers broad research subtopics on WBG and UWBG materials that span bulk crystals, epitaxy and substrate technologies, fundamental defect science, and doping, as well as electronic and optoelectronic device fabrication and characterization. Here, we highlight works from the collection, which we categorize by material platform of SiC, III-nitrides, and Ga 2 O 3 and related alloys.

36 MATERIALS SCIENCE↗

Dc-To-Dc Converter Uses Reverse Conduction Of MOSFET's

In modified high-power, phase-controlled, full-bridge, pulse-width-modulated dc-to-dc converters, switching devices power metal oxide/semiconductor field-effect transistors (MOSFET's). Decreases dissipation of power during switching by eliminating approximately 0.7-V forward voltage drop in anti-parallel diodes. Energy-conversion efficiency increased.

Gruber, Robert P.↗