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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Processing inferences derived from event-related potential measures in a monitoring task

Event-related potentials (ERPs) were recorded from the scalp of subjects as they monitored changing digital readouts for values that went 'out-of-bounds'. Workload was manipulated by varying the number of readouts that were monitored concurrently. The ERPs elicited by changes in the readouts showed long latency positivities that increased in amplitude, not only with the number of readouts monitored, but also with the number of monitored readouts that were 'in danger' of going out-of-bounds. No effects were found due to the number of nonmonitored readouts 'in danger'. This evidence indicates that subjects (1) selectively attended to the monitored readouts and (2) processed the monitored readouts differently as the readouts approached the out-of-bounds levels to which an overt response was required.

Horst, R. L.↗
NASA NTRS2005

Hybrid UV Imager Containing Face-Up AlGaN/GaN Photodiodes

A proposed hybrid ultraviolet (UV) image sensor would comprise a planar membrane array of face-up AlGaN/GaN photodiodes integrated with a complementary metal oxide/semiconductor (CMOS) readout-circuit chip. Each pixel in the hybrid image sensor would contain a UV photodiode on the AlGaN/GaN membrane, metal oxide/semiconductor field-effect transistor (MOSFET) readout circuitry on the CMOS chip underneath the photodiode, and a metal via connection between the photodiode and the readout circuitry (see figure). The proposed sensor design would offer all the advantages of comparable prior CMOS active-pixel sensors and AlGaN UV detectors while overcoming some of the limitations of prior (AlGaN/sapphire)/CMOS hybrid image sensors that have been designed and fabricated according to the methodology of flip-chip integration. AlGaN is a nearly ideal UV-detector material because its bandgap is wide and adjustable and it offers the potential to attain extremely low dark current. Integration of AlGaN with CMOS is necessary because at present there are no practical means of realizing readout circuitry in the AlGaN/GaN material system, whereas the means of realizing readout circuitry in CMOS are well established. In one variant of the flip-chip approach to integration, an AlGaN chip on a sapphire substrate is inverted (flipped) and then bump-bonded to a CMOS readout circuit chip; this variant results in poor quantum efficiency. In another variant of the flip-chip approach, an AlGaN chip on a crystalline AlN substrate would be bonded to a CMOS readout circuit chip; this variant is expected to result in narrow spectral response, which would be undesirable in many applications. Two other major disadvantages of flip-chip integration are large pixel size (a consequence of the need to devote sufficient area to each bump bond) and severe restriction on the photodetector structure. The membrane array of AlGaN/GaN photodiodes and the CMOS readout circuit for the proposed image sensor would be fabricated separately.

Zheng, Xinyu↗
NASA NTRSDate not supplied

Toward Large Field-of-view X-ray Spectrometers with Magnetic Microcalorimeters

A future X-ray telescope mission like Lynx, a X-ray flagship mission concept, requires a large field of view, high energy resolution, and high spatial resolution. The Magnetic Microcalorimeter (MMC) detectors we are developing for such a mission feature a 5-arcminute field of view, approximately 100,000 pixels, each spanning 0.5–1 arcsecond. These detectors require the readout of 8,000 sensors. Three different array types have been designed to meet scientific goals, two of which utilize thermal multiplexing to reduce the number of readout channels in a scheme called “Hydra.” We are currently fabricating detectors on a recently completed buried wiring wafer with connections to every sensor. The sensors are read out using a microwave multiplexer (μMUX) with flux ramp modulation. A single μMUX can read out approximately 1,000 sensors with only two feed lines. We will report on the test of the first two-dimensional μMUX chip, consisting of 78 resonators. μMUX chips that pass screening will be directly bonded to MMC array chips using indium bump bonding. In parallel, we have tested a kinetic inductance traveling wave parametric amplifier (KI-TWPA) to amplify signals at low temperatures. The KI-TWPA exhibits extremely low internal noise, approaching the standard quantum limit. Since the energy resolution of an MMC is primarily limited by the readout system, the KI-TWPA is an ideal amplifier for MMCs with μMUX readout. We recently measured the readout noise of a μMUX with a KI-TWPA, demonstrating its capability for reading out MMC arrays. We present the design and fabrication of the latest MMC detectors, along with its readout performance.

Magntic Microcalorimeters↗
NASA NTRS1988

Primary task event-related potentials related to different aspects of information processing

The results of two studies which investigated the relationships between cognitive processing and components of transient event-related potentials (ERPs) are presented in a task in which mental workload was manipulated. The task involved the monitoring of an array of discrete readouts for values that went out of bounds, and was somewhat analogous to tasks performed in cockpits. The ERPs elicited by the changing readouts varied with the number of readouts being monitored, the number of monitored readouts that were close to going out of bounds, and whether or not the change took a monitored readout out of bounds. Moreover, different regions of the waveform differentially reflected these effects. The results confirm the sensitivity of scalp-recorded ERPs to the cognitive processes affected by mental workload and suggest the possibility of extracting useful ERP indices of primary task performance in a wide range of man-machine settings.

Munson, Robert C.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays through Mosaic Hybridization

We have demonstrated the hybridization of large mosaics of far-infrared detectors, joining separately fabricated sub-units into a single unit on a single, large substrate. We produced a single detector mockup on a 100mm diameter wafer and four mockup readout quadrant chips from a separate 100mm wafer. The individually fabricated parts were hybridized using a Suss FC150 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion (CTE) match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the mockup mosaic-hybridized detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently demonstrated.

Miller, Timothy M.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, TImothy M.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, Timothy M.↗
NASA NTRS2012

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit patbs by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabric.ted parts were hybridized using a Suss FCI50 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Miller, Timothy M.↗
NASA NTRS2016

The Impact of Crosstalk in the X-IFU Instrument on Athena Science Cases

In this paper we present a first assessment of the impact of various forms of instrumental crosstalk on the science performance of the X-ray Integral Field Unit (X-IFU) on the Athena X-ray mission. This assessment is made using the SIXTE end-to-end simulator in the context of one of the more technically challenging science cases for the XIFU instrument. Crosstalk considerations may influence or drive various aspects of the design of the array of high-count-rate Transition Edge Sensor (TES) detectors and its Frequency Domain Multiplexed (FDM) readout architecture. The Athena X-ray mission was selected as the second L-class mission in ESA's Cosmic Vision 2015–25 plan, with alaunch foreseen in 2028, to address the theme ''Hot and Energetic Universe"1. One of the two instruments on boardAthena is the X-ray Integral Field Unit2 (X-IFU) which is based on an array of ~3800 Transition Edge Sensors (TES's)operated at a temperature of ~90 mK. The science cases pose an interesting challenge for this instrument, as they requirea combination of high energy resolution (2.5 eV FWHM or better), high spatial resolution (5 arcsec or better) and highcount rate capability (several tens of counts per second per detector for point sources as bright as 10 mCrab).The performance at the single sensor level has been demonstrated3, but the operation of such detectors in an array, usingmultiplexed readout, brings additional challenges, both for the design of the array in which the sensors are placed and forthe readout of the sensors. The readout of the detector array will be based on Frequency Domain Multiplexing (FDM)4.In this system of detectors and readout, crosstalk can arise through various mechanisms: on the TES array, neighboringsensors can couple through thermal crosstalk. Detectors adjacent in carrier frequency may suffer from electrical crosstalkdue to the finite width of the bandpass filters, and shared sources of impedance in their signal lines. The signals from theindividual detectors are summed and then amplified by a pair of SQUID amplifiers before being sent to warm front-endelectronics. The transfer function of the SQUID amplifiers is non-linear, which will give rise to higher harmonics ofcarriers and intermodulation products when multiple signal pulses are simultaneously present in the SQUID. Under highcount rate conditions this is another source of crosstalk. The effect of all these crosstalk sources is that parasitic pulseswill appear in the record of a signal pulse which will create a stochastic offset of the measured energy and thus adegradation of the energy resolution.

SIXTE↗
NASA NTRS1973

Performance evaluation of a strapdown electrically suspended gyro for space

The engineering development directed to improvement in strapdown electrically suspended gyro (SD/ESG) readout accuracy are described. The results of this development effort were represented by new and modified parts which were assembled into a strapdown ESG which was evaluated in terms of its readout system accuracy. The program performance goal was the demonstration of gyro readout to an accuracy of 15 arc-seconds or better. The results of calibrating over two sets of data were error amounts of 11.4 and 12.7 arc-seconds rms. The rms values of readout error were 12.7 and 13.8 arc-seconds for two sets of data not included in the calibration. The techniques for rotor preparation which were investigated under this contract included the application of a thin metal coating to the rotor surface in addition to the use of bare, polished beryllium rotors. Patterning application means which were utilized included a laser for pattern exposure of a photoresist coating and a grit-blast patterning machine which applied the pattern directly onto the metal surface of the rotor.

Elwell, D. F.↗
NASA NTRS1984

A CCD System for Photometry of Direct and Spectroscopic Images

A charge-coupled device (CCD) for direct imagery at the focus of a ground-based telescope and for high dispersion spectroscopy of stars is evaluated. The CCD is an RCA SID 53612 thinned, buried channel array of 512x320 30-micron square pixels that are back-illuminated and refrigerated to about -60 C in a rugged, RF-shielded vacuum housing. The double-correlated sampling (integrator) readout system, the Z80 microprocessor readout control system, and the data collection system are described. The readout noise is 120 electron-hole pairs (ehp) per pixel per readout, the thermal dark current is 50 ehp/pixel/sec, and the scale of the 12-bit analog-to-digital converter is 25 ehp/AD unit. Unique features of this system are compared to other astronomical implementations of the same model of CCD.

Frecker, J. E.↗
NASA NTRS1986

Wide field and diffraction limited array camera for SIRTF

The Infrared Array Camera for the space Infrared Telescope Facility (SIRTF/IRAC) is capable of two-dimensional photometry in either a wide field or diffraction-limited mode over the wavelength interval from 2 to 30 microns. Three different two-dimensional direct readout (DRO) array detectors will be used: Band 1-InSb or Si:In (2-5 microns) 128 x 128 pixels, Band 2-Si:Ga (5-18 microns) 64 x 64 pixels, and Band 3-Si:Sb (18-30 microns) 64 x 64 pixels. The hybrid DRO readout architecture has the advantages of low read noise, random pixel access with individual readout rates, and nondestructive readout. The scientific goals of IRAC are discussed, which are the basis for several important requirements and capabilities of the array camera: (1) diffraction-limited resolution from 2-30 microns, (2) use of the maximum unvignetted field of view of SIRTF, (3) simultaneous observations within the three infrared spectral bands, and (4) the capability for broad and narrow bandwidth spectral resolution. A strategy has been developed to minimize the total electronic and environmental noise sources to satisfy the scientific requirements.

Fazio, G. G.↗
NASA NTRS1986

Wide field and diffraction limited array camera for SIRTF

The Infrared Array Camera for the Space Infrared Telescope Facility (SIRTF/IRAC) is capable of two-dimensional photometry in either a wide field or diffraction-limited mode over the wavelength interval from 2 to 30 microns. Three different two-dimensional direct readout (DRO) array detectors are being considered: Band 1-InSb or Si:In (2-5 microns) 128 x 128 pixels, Band 2-Si:Ga (5-18 microns) 64 x 64 pixels, and Band 3-Si:Sb (18-30 microns) 64 x 64 pixels. The hybrid DRO readout architecture has the advantages of low read noise, random pixel access with individual readout rates, and nondestructive readout. The scientific goals of IRAC are discussed, which are the basis for several important requirements and capabilities of the array camera: (1) diffraction-limited resolution from 2-30 microns, (2) use of the maximum unvignetted field of view of SIRTF, (3) simultaneous observations within the three infrared spectral bands, and (4) the capability for broad and narrow bandwidth spectral resolution. A strategy has been developed to minimize the total electronic and environmental noise sources to satisfy the scientific requirements.

Fazio, G. G.↗
NASA NTRS1987

IRAC test report. Gallium doped silicon band 2: Read noise and dark current

A direct readout infrared detector array, a candidate for the Space Infrared Telescope Facility (SIRTF) Infrared Array Camera (IRAC), has been tested. The array has a detector surface of gallium doped silicon, bump bonded to a 58x62 pixel MOSFET multiplexer on a separate chip. Although this chip and system do not meet all the SIRTF requirements, the critically important read noise is within a factor of 3 of the requirement. Significant accomplishments of this study include: (1) development of a low noise correlated double sampling readout system with a readout noise of 127 to 164 electrons (based on the detector integrator capacitance of 0.1 pF); (2) measurement of the readout noise of the detector itself, ranging from 123 to 214 electrons with bias only (best to worst pixel), and 256 to 424 electrons with full clocking in normal operation at 5.4 K where dark current is small. Thirty percent smaller read noises are obtained at a temperature of 15K; (3) measurement of the detector response versus integration time, showing significant nonlinear behavior for large signals, well below the saturation level; and (4) development of a custom computer interface and suitable software for collection, analysis and display of data.

Lamb, Gerald↗
NASA NTRS1988

Development of a unit cell for a Ge:Ga detector array

Two modules of gallium-doped germanium (Ge:Ga) infrared detectors with integrated multiplexing readouts and supporting drive electronics were designed and tested. This development investigated the feasibility of producing two-dimensional Ge:Ga arrays by stacking linear modules in a housing capable of providing uniaxial stress for enhanced long-wavelength response. Each module includes 8 detectors (1x1x2 mm) mounted to a sapphire board. The element spacing is 12 microns. The back faces of the detector elements are beveled with an 18 deg angle, which was proved to significantly enhance optical absorption. Each module includes a different silicon metal-oxide semiconductor field effect transistor (MOSFET) readout. The first circuit was built from discrete MOSFET components; the second incorporated devices taken from low-temperature integrated circuit multiplexers. The latter circuit exhibited much lower stray capacitance and improved stability. Using these switched-FET circuits, it was demonstrated that burst readout, with multiplexer active only during the readout period, could successfully be implemented at approximately 3.5 K.

Source record↗
NASA NTRS1987

Delay line anodes for microchannel-plate spectrometers

A photon-counting readout system for microchannel-plate spectrometers is described that uses a delay line and timing circuit for the wavelength coordinate and a wedge-wedge charge division system for the orthogonal spatial coordinate. A novel zigzag layout allows these two anode patterns to coexist on a common planar substrate and share the charge from each photoevent, thereby simultaneously localizing the photon in each of its two dimensions. Unlike wedge-and-strip or resistive anode encoders, the delay line offers a spatial resolution that is relatively independent of the format length. Unlike discrete anode systems, the delay line readout system's complexity is also independent of the field of view size. These facts make the delay line readout system advantageous in large format detectors. A testbed detector having a delay line propagation speed of 2.2 mm/ns and a time resolution of 33 ps FWHM has been assembled. Ultraviolet testing shows a Gaussian event distribution having a 70-micron FWHM width; the readout system blur contribution is less than 50-micron FWHM.

Lampton, M.↗
NASA NTRS1990

Improved low frequency stability of bolometric detectors

An ac bridge readout system has been developed that greatly improves the low-frequency stability of bolometric detectors. The readout can be implemented with a simple circuit appropriate for use in space applications. A matched pair of detectors was used in the readout to achieve system noise within a factor of two of the fundamental noise limit of the detectors at frequencies as low as 10 mHz. The low-frequency stability of the readout system allows slower, more sensitive detectors to be used in many applications, and it facilitates observing strategies that are well suited to spaceborne observations.

Wilbanks, T.↗
NASA NTRS1990

LDEF Experiment P0006 Linear Energy Transfer Spectrum Measurement (LETSME) quick look report

A preliminary analysis of the various passive radiation detector materials included in the P0006 LETSME experiment flown on LDEF (Long Duration Exposure Facility) is presented. It consists of four tasks: (1) readout and analysis of thermoluminescent detectors (TLD); (2) readout and analysis of fission foil/mica detectors; (3) readout and analysis of (6)LiF/CR-39 detectors; and (4) preliminary processing and readout of CR-39 and polycarbonate plastic nuclear track detectors (PNTD).

Source record↗