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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Performance and automatic calibration scheme of the waveform sampler in the ETROC2 ASIC chip

The waveform sampler in the CMS ETROC2 chip for LGAD gain aging monitoring is a 2.56-GS/s 12-bit 8x-Interleaved ADC that consists of a coarse SAR stage, and a fine stage. This architecture delivers high performance on a relatively modest 65 nm process, while requires finding up to 24 calibration constants through calibration. We developed an automatic calibration method using charge injection test data. After calibration, the baseline random error is reduced by a factor of 2.5–3 compared to the default calibration, and a 5% charge measurement precision is achieved in 15 fC charge injection tests.

Fu, Tao [Unlisted, US]↗
DOE OSTI2025

Robotic Assembly of Multi-Chip Modules Using Artificial Intelligence

With many properties of dark matter remaining a mystery, the OSCURA experiment aims to detect light dark matter particles using 1,536 Multi-Chip Modules (MCMs), containing a total of 24,576 skipper CCDs. Currently, each MCM is assembled by hand a time-consuming and error-prone process that can be automated. In this ongoing work, we present an automated assembly robot that leverages modern computer vision and artificial intelligence to assemble the OSCURA MCMs. This approach reduces cost, time, and error in the packaging of OSCURA sensors.

Arteaga, Matthew [Northern Illinois U.; Fermilab]↗
DOE OSTI2025

Radiation Effects on Network on Chips (NoC) Laboratory Directed Research and Development (LDRD) project

This project was motivated by State-of-the-Art (SOTA) technology that incorporates Network on Chips (NOC) for efficient data communication across the various computer kernels. For example, on the AMD Versal Field Programmable Gate Arrays (FPGA), an NoC has been incorporated for fast data communication from the programmable logic and other computer kernels (processing system, adaptable intelligence engines, etc.). The radiation effects on the legacy technology of this FPGA, such as the programmable logic, are well understood, and established methods exist to measure cross-sections when new families/generations are released; however, newly incorporated technologies, such as the NoC, are not fully understood and could introduce new failure points into the mission space.

36 MATERIALS SCIENCE↗
DOE OSTI2026

Digital Silicon Photomultiplier Chip Testing

Silicon Photomultipliers (SiPMs) are highly sensitive photodetectors. Traditional analog SiPMs require complex external readout electronics. Digital SiPMs (dSiPMs) include digital readout circuitry directly on-chip, offering superior timing resolution, reduced power consumption and compact size, pixel-level masking for active noise reduction. The primary objectives of this study are to, verify digital logic integrity of the shift registers used for controlling the pixel masking circuit, and determine the dark count rate of individual pixels as a function of bias voltage and clock frequency. I observe and explain behavior of the shift register and counting circuit.

Graham, Bennett [U. Chicago (main)]↗
NASA NTRS1966

Gage accurately controls force for placing chips on substrates

Device is developed to control the force used in manually placing chips on substrates. It controls the compression load between 2 small members at loads as low as 25 grams by means of a force control gage that is preset by varying the spring deflection.

Benzie, W. P.↗
NASA NTRS1972

Development of chip passivated monolithic complementary MISFET circuits with beam leads

Fabrication method is described for alumina passivated silicon MISFET arrays. Technique involves total passivation beam-lead approach and provides completely sealed chip with double level interconnect capability. Refractory metal alloy is used to form interconnect system and obtain metal contacts that withstand temperatures of 873 K for short periods of time.

Ragonese, L. J.↗