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"Book retriever" allows people confined to wheelchairs to remove or replace books from upper shelves of library stacks. Retriever is mechanical device composed of aluminum tube approximately 5 feet long with two jaws at upper end. Jaws securely clamp selected book; they are thin enough to be inserted between adjacent books.
Proposed bolt functions similarly to device described in article "Quick-Connect, Slow-Disconnect Nut" (MFS-28833). Bolt installed in standard threaded hole simply by pushing it into hole. Once inserted, bolt withdrawn only by turning it in conventional way.
Compact device has wide dynamic range, accurate square-law response, good thermal stability, high-level dc output with immunity to ground-loop problems, ability to insert known time constants for radiometric applications, and fast response times compatible with computer systems.
The application of tether technology has the potential to increase the overall performance efficiency and capability of the integrated space operations and transportation systems through the decade of the 90s. The primary concepts for which significant economic benefits were identified are dependent on the space station as a storage device for angular momentum and as an operating base for the tether system. Concepts examined include: (1) tether deorbit of shuttle from space station; (2) tethered orbit insertion of a spacecraft from shuttle; (3) tethered platform deployed from space station; (4) tether-effected rendezvous of an OMV with a returning OTV; (5) electrodynamic tether as an auxiliary power source for space station; and (6) tether assisted launch of an OTV mission from space station.
A silicon alignment pin is used to align successive layers of components made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
The primary object of the present invention is to provide a simple, reliable, and lightweight coupling that will also have an efficient thermal interface. A further object of the invention is to provide a coupling that is capable of blind mating with little or no insertion forces. Another object of the invention is to provide a coupling that acts as a thermal regulator to maintain a constant temperature on one side of the coupling. Another object of the invention is to increase the available surface area of a coupling thus providing a larger area for the conduction of heat across the thermal interface. Another object of the invention is to provide a fluidic coupling that has no fluid passing across the interface, thus reducing the likelihood of leaks and contamination. The foregoing objects are achieved by utilizing, as in the prior art, a hot area (at an elevated temperature as compared to a cold area) with a need to remove excess heat from the hot area to a cold area. In this device, the thermal interface will occur not on a planar horizontal surface, but along a non-planar vertical surface, which will reduce the reaction forces and increase the thermal conductivity of the device. One non-planar surface is a surface on a cold pin extending from the cold area and the other non-planar surface is a surface on a hot pin extending from the hot area. The cold pin is fixed and does not move while the hot pin is a flexible member and its movement towards the cold pin will bring the two non-planar surfaces together forming the thermal interface. The actuating member for the device is a shape-memory actuation wire which is attached through an aperture to the hot pin and through another aperture to an actuation wire retainer. By properly programming the actuation wire, heat from the hot area will cause the actuation wire to bend the hot wire. Heat from the hot area will cause the actuation wire to bend the hot pin towards the cold pin forming the coupling and the desired thermal interface. The shape-memory actuation wire is made of a shape-memory-effect alloy such as Nitinol.
We propose and demonstrate experimentally a fiber optic micro-device that is capable of tunably splitting, multiplexing, and demultiplexing optical signals using elliptical-core two-mode optical fiber. A crosstalk of 15 dB with an insertion loss of 1.2 dB was obtained.
Ka-band MEMS doubly anchored cantilever beam capacitive shunt devices are used to demonstrate a MEMS SPDT switch fabricated on high resistivity silicon (HRS) utilizing finite ground coplanar waveguide (FGC) transmission lines. The SPDT switch has an insertion loss (IL), return loss (RL), and isolation of 0.3dB, 40dB, and 30 dB, respectively at Ka-band.
In this paper we discuss radiation effects issues that have become important for NASA programs in the last few years. Particularly critical is the increasing usage of commericial off-the-shelf (COTS) devices and circuits in interplanetary missions that experience significant exposure to radiation.
A thermally conductive composite material, a thermal transfer device made of the material, and a method for making the material are disclosed. Apertures or depressions are formed in aluminum or aluminum alloy. Plugs are formed of thermal pyrolytic graphite. An amount of silicon sufficient for liquid interface diffusion bonding is applied, for example by vapor deposition or use of aluminum silicon alloy foil. The plugs are inserted in the apertures or depressions. Bonding energy is applied, for example by applying pressure and heat using a hot isostatic press. The thermal pyrolytic graphite, aluminum or aluminum alloy and silicon form a eutectic alloy. As a result, the plugs are bonded into the apertures or depressions. The composite material can be machined to produce finished devices such as the thermal transfer device. Thermally conductive planes of the thermal pyrolytic graphite plugs may be aligned in parallel to present a thermal conduction path.
Flexible tube inserted into a 3/4-round strip receptacle inflates to form an airtight material fastener. Inflation is done with a carbon dioxide cartridge and deflation by a manually operated release valve. Device has potential use in space suits, underwater suits, and other protective clothing.
Tool attached to prosthetic hand or arm enables user to hold nails, screws, nuts, rivets, and other small ferromagnetic objects on small magnetic tip. Device adjusted to hold nail or screw at proper angle for hammering or for use of screwdriver, respectively. Includes base connector with threaded outer surface and lower male member inserted in standard spring-action, quick-connect/quick-disconnect wrist adapter on prosthetic hand or arm.
The Materials Science Research Facility (MSRF) is a modular facility designed to accommodate the current and evolving cadre of peer-reviewed materials science investigations selected to conduct research in the microgravity environment of the International Space Station (ISS). The MSRF concept consists of three Materials Science Research Racks (MSRR-1, MSRR-2, and MSRR-3) which will be developed for phased deployment into the United States Laboratory Module beginning on the third Utilization Flight (UF-3). The facility will house the materials processing apparatus and common subsystems required for operating each device, and will use the ISS Active Rack Isolation System (ARIS). Each MSRR is an autonomous rack and will be comprised of on-orbit replaceable Experiment Modules, Module Inserts, investigation unique apparatus, and/or multi-user generic processing apparatus. The MSRF will be the primary apparatus for satisfying near-term and long-range materials science discipline goals and objectives with each MSRR supporting a wide range of materials science themes in the NASA research program.
This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.
The following are updated or new subjects added to the FPGA SEE Test Guidelines manual: academic versus mission specific device evaluation, single event latch-up (SEL) test and analysis, SEE response visibility enhancement during radiation testing, mitigation evaluation (embedded and user-implemented), unreliable design and its affects to SEE Data, testing flushable architectures versus non-flushable architectures, intellectual property core (IP Core) test and evaluation (addresses embedded and user-inserted), heavy-ion energy and linear energy transfer (LET) selection, proton versus heavy-ion testing, fault injection, mean fluence to failure analysis, and mission specific system-level single event upset (SEU) response prediction. Most sections within the guidelines manual provide information regarding best practices for test structure and test system development. The scope of this manual addresses academic versus mission specific device evaluation and visibility enhancement in IP Core testing.
The following are updated or new subjects added to the FPGA SEE Test Guidelines manual: academic versus mission specific device evaluation, single event latch-up (SEL) test and analysis, SEE response visibility enhancement during radiation testing, mitigation evaluation (embedded and user-implemented), unreliable design and its affects to SEE Data, testing flushable architectures versus non-flushable architectures, intellectual property core (IP Core) test and evaluation (addresses embedded and user-inserted), heavy-ion energy and linear energy transfer (LET) selection, proton versus heavy-ion testing, fault injection, mean fluence to failure analysis, and mission specific system-level single event upset (SEU) response prediction. Most sections within the guidelines manual provide information regarding best practices for test structure and test system development. The scope of this manual addresses academic versus mission specific device evaluation and visibility enhancement in IP Core testing.
Wide-band power combining units for Ka-band are simulated for use as MMIC amplifier applications. Short-slot couplers as well as magic-tees are the basic elements for the combiners. Wide bandwidth (5 GHz) and low insertion (approx.0.2 dB) and high combining efficiencies (approx.90 percent) are obtained.