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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11

Structure and Fabrication of a Microscale Flow-Rate/Skin Friction Sensor

A floating element shear sensor and method for fabricating the same are provided. According to an embodiment, a microelectromechanical systems (MEMS)-based capacitive floating element shear stress sensor is provided that can achieve time-resolved turbulence measurement. In one embodiment, a differential capacitive transduction scheme is used for shear stress measurement. The floating element structure for the differential capacitive transduction scheme incorporates inter digitated comb fingers forming differential capacitors, which provide electrical output proportional to the floating element deflection.

Chandrasekharan, Vijay↗

Embedded Data Acquisition Tools for Rotorcraft Diagnostic Sensors

Rotorcraft drive trains must withstand enormous pressure while operating continuously in extreme temperature and vibration environments. Captive components, such as planetary and spiral bevel gears, see enormous strain but are not accessible to fixed instrumentation, such as a piezoelectric transducer. Thus, it is difficult to directly monitor components that are most susceptible to damage. This innovation is a self-contained data processing unit within a specialized fixture that installs directly inside the rotating pinion gear in the gearbox. From this location, it detects and transmits high-resolution prognostic data to a fixed transceiver. The sensor is based on microelectromechanical systems (MEMS) technology and uses innovative circuit designs to capture high-bandwidth data and transmit it wirelessly from inside an operational helicopter transmission. With Ridgetop's advanced MEMS-based sensor, researchers have, for the first time, been able to extract high-resolution acoustic signatures wirelessly from sensors within the transmission that would otherwise be muffled by background gear noises. Ridgetop's innovative instrument will help researchers perform dynamic analysis of gear interaction and develop improved designs for gear components. In addition, data from this instrument can be used to validate new algorithms that detect and predict faults based on external acoustic signatures, for prognostic purposes. The result of this work will be an improvement in safety, performance, and cost for future generations of rotating components.

Wagoner, Robert↗

Shear Stress Sensing using Elastomer Micropillar Arrays

The measurement of shear stress developed as a fluid moves around a solid body is difficult to measure. Stresses at the fluid-solid interface are very small and the nature of the fluid flow is easily disturbed by introducing sensor components to the interface. To address these challenges, an array of direct and indirect techniques have been investigated with various advantages and challenges. Hot wire sensors and other indirect sensors all protrude significantly into the fluid flow. Microelectromechanical systems (MEMS) devices, although facilitating very accurate measurements, are not durable, are prone to contamination, and are difficult to implement into existing model geometries. One promising approach is the use of engineered surfaces that interact with fluid flow in a detectable manner. To this end, standard lithographic techniques have been utilized to generate elastomeric micropillar arrays of various lengths and diameters. Micropillars of controlled length and width were generated in polydimethylsiloxane (PDMS) elastomer using a soft-lithography technique. The 3D mold for micropillar replication was fabricated using laser ablative micromachining and contact lithography. Micropillar dimensions and mechanical properties were characterized and compared to shear sensing requirements. The results of this characterization as well as shear stress detection techniques will be discussed.

Wohl, Christopher J.↗

Omnidirectional Inter-Satellite Optical Communicator (ISOC)

The objective of the Omnidirectional Inter-Satellite Optical Communicator (ISOC) project is to design a compact, lightweight,and energy efficient communicator module for use between satellites in space. This module will achieve continuous optical communication, with simultaneous data transmission and reception, at up to1 gigabit per second (Gbits) data rates for small spacecraft separated by up to 200 kilometers (kms). To achieve this goal,a data communicator with full spherical coverage field of view (FOV) needs to be designed. The proposed ISOC is a dodecahedron geometric array of chipscale, microelectromechanical systems (MEMS) based gimbal-less scanning mirrors that provide adjustable beam pointing and spherical FOV coverage for uninterrupted data transmission between several small spacecraft at arbitrary relative positions. This design eliminates known pointing issues and hence allows accurate direction of arrival calculations.Moreover, the proposed approach will enable data relaying between multiple satellites, and enable relative navigation control.

Inter-small satellite communication↗

Mars Organic Molecule Analyzer (MOMA) Laser Desorption/Ionization Source Design and Performance Characterization

The Mars Organic Molecule Analyzer (MOMA), a dual-source, ion trap-based instrument capable of both pyrolysis-gas chromatography mass spectrometry (pyr/GC-MS) and laser desorption/ionization mass spectrometry (LDI-MS), is the core astrobiology investigation on the ExoMars rover. The MOMA instrument will be the first spaceflight mass analyzer to exploit the LDI technique to detect refractory organic compounds and characterize host mineralogy; this mode of analysis will be conducted at Mars ambient conditions. In order to achieve high performance in the Martian environment while keeping the instrument compact and low power, a number of innovative designs and components have been implemented for MOMA. These include a miniaturized linear ion trap (LIT), a fast actuating aperture valve with ion inlet tube, and a Microelectromechanical System (MEMS) Pirani sensor. Advanced analytical capabilities like Stored Waveform Inverse Fourier Transform (SWIFT) for selected ion ejection and tandem mass spectrometry (MS/MS) are realized in LDI-MS mode, and enable the isolation and enhancement of specific mass ranges and structural analysis, respectively. We report here the technical details of these instrument components as well as system-level analytical capabilities, and we review the applications of this technology to Mars and other high-priority targets of planetary exploration.

Xiang Li↗

Distributed Attitude Control and Maneuvering for Deep Space SmallSats

The aim of the Distributed Attitude Control and Maneuvering for Deep Space SmallSats project is to advance a multi-purpose, deep space mission-enabling technology for low-power attitude and thermal control of small satellites to a flight demonstration technology readiness level (TRL). The film-evaporation microelectromechanical systems tunable array (FEMTA) small satellite technology combines innovative microelectromechanical systems (MEMS) microfabrication and microscale effects in fluid surface tension to produce a thermally actuated capillary valve. Using water as the propellant, the FEMTA thruster can generate finely controllable thrust at a thrust to power ratio of about 200 microNewton per Watt (W).

thermal control↗

Novel Applications of Focused Ion Beam Technique for Planetary Sample Analyses

We are using innovative FIB techniques to prepare samples of planetary materials for different types of coordinated analyses using ion microprobes, synchrotron beamlines, and specialized transmission electron microscopy (TEM) techniques. In these cases, the FIB sample preparation is the critical step in enabling these specialized analyses. We discuss several examples below utilizing the FEI Quanta3D instrument at the NASA Johnson Space Center. Trace element analyses utilizing synchrotron x-ray fluorescence. The trace element content of mineral grains in comet dust provides important clues on their formation and processing in the early solar system. We preformed coordinated analyses of a comet dust particle that had been prepared using ultramicrotomy for TEM analysis. Following the TEM analyses, we extracted a 70 nm thick section from a region of the carbon (C) film of the TEM grid, for additional analyses. A carbon ring ~2-3 μm thick was deposited on top of the C film using the FIB. The C film on the outer rim of the ring was milled away using various patterns to uniformly release the stresses on the film, preventing rupture and collapse, and was attached to the micromanipulator needle. We then isolated the ring completely and transferred the section to a silicon sample holder for analysis using the HXN (hard X-ray nanoprobe) beamline at NSLSII at Brookhaven National Lab. Coordinated Analyses of Presolar Grains. Rare sub-m presolar grains that originate in evolved stars and supernovae, occur in primitive astromaterials and are identified by their exotic isotopic compositions. Coordinated analyses of these grains using NanoSIMS, TEM, and other techniques on the same grain is enabled by innovative FIB sample preparation. In order to obtain subsequent isotopic analyses of Mg and Fe, contributions from surrounding grains were minimized. We precisely deposited a protective cap of Pt on top of the grain to preserve the grain of interest and then milled away about 5 μm diameter of the surrounding material. Following the isotopic analyses, the spindle was extracted and thinned to electron transparency for TEM microstructural analyses. In situ heating TEM experiments on lunar samples. We extracted a FIB thin section from Apollo 17 lunar rock 76015. To avoid ion-beam damage, e-beam deposition was used to deposit the first 500 nm of the C strap, followed by ion beam-assisted deposition of ~3 μm carbon. We performed an ex situ lift-out of the section and placed the section on one of the elements of a microelectromechanical systems (MEMS) - specialized heating substrate and attached the section to the substrate by depositing small C straps with the FIB. The heating chips utilize silicon nitride windows to support the samples and provide uniform heating while enabling TEM imaging. The heating chip was loaded into a Hitachi “Blaze” heating holder and analyzed using a Hitachi HF5000 at the University of Arizona.

Rahman, Z.↗

Temperature Variation Analysis of the STIM300 Inertial Measurement Unit

A key navigation instrument found on most autonomous and semi-autonomous platforms is the inertial measurement unit (IMU). This type of sensor is a combination of microelectromechanical systems (MEMS) that provide inertial information to the navigation system. Typical MEMS hardware include a gyroscope and an accelerometer (for rates and accelerations, respectively) within a single platform. The Near Earth Asteroid (NEA) Scout mission, slated to launch in October of 2018 (Author’s note: NEA Scout ultimately launch on November 16, 2022), carries an on-board IMU from Sensonor. This particular model has yet to see spaceflight, and questions about its on-orbit reliability remain. Dynamic tests were produced in the summer of 2016 by a visiting faculty member from Arkansas Tech University, Daniel Bullock. During these experiments, concerns about the noise characteristics of the sensor were raised, specifically relating to how temperature fluctuations affected the unit. It was found that the IMU took an extended period of time before reaching an internal steady state temperature. These tests often displayed large temperature variations, making the calculation of noise characteristics, such as bias drift, difficult to attribute entirely to noise. Static and dynamic tests were re-performed under more stringent constraints on temperature. Tests reported herein conclude that the IMU is adequately capable of providing inertial information for the NEA Scout mission.

Ivan Rodrigues Bertaska↗

Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications

Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.

Sharma, Ashok K.↗

COTS MEMS

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MicroElectroMechanical Systems MEMS COTS technolog↗

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗

MEMS Reliability Assurance Guidelines for Space Applications

This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.

Stark, Brian↗

NEPP Cots Mems Programs

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COTS Microelectromechanical Systems MEMS reliabili↗

Laser Welding in Electronic Packaging

The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

Source record↗

MEMS adaptive optics

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stroke actuator membrane transfer segmented space ↗