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NASA NTRS2009

A High Power Density Power System Electronics for NASA's Lunar Reconnaissance Orbiter

A high power density, modular and state-of-the-art Power System Electronics (PSE) has been developed for the Lunar Reconnaissance Orbiter (LRO) mission. This paper addresses the hardware architecture and performance, the power handling capabilities, and the fabrication technology. The PSE was developed by NASA s Goddard Space Flight Center (GSFC) and is the central location for power handling and distribution of the LRO spacecraft. The PSE packaging design manages and distributes 2200W of solar array input power in a volume less than a cubic foot. The PSE architecture incorporates reliable standard internal and external communication buses, solid state circuit breakers and LiIon battery charge management. Although a single string design, the PSE achieves high reliability by elegantly implementing functional redundancy and internal fault detection and correction. The PSE has been environmentally tested and delivered to the LRO spacecraft for the flight Integration and Test. This modular design is scheduled to flight in early 2009 on board the LRO and Lunar Crater Observation and Sensing Satellite (LCROSS) spacecrafts and is the baseline architecture for future NASA missions such as Global Precipitation Measurement (GPM) and Magnetospheric MultiScale (MMS).

Hernandez-Pellerano, A.↗

NASA NTRS1973

Development of a uninterrupted power system: ac and dc to dc converter

This program covered the design, fabrication and testing of an advanced development model uninterrupted power system. The input and output requirements imposed on the power processor were specified such that the unit is electrically interchangeable with existing power systems used by the Federal Aviation Administration in installations which have a history of failure due to electrical transient conditions. Input power is from either of two single-phase ac power sources or batteries with electronic selection and transfer between power sources. Battery reconditioning is automatic when either ac source is present. The output power is rated at 84OW; the nominal output is 24V at 35A. Within the 84OW limit, the regulated output voltage is adjustable from 22V to 30Vdc. Protection against continuous overloading or short circuit is provided. The unit is packaged in a standard 19-inch rack mount configuration with 7-inch panel height. Controls are on the front panel with power input and output through connectors on the rear surface. Cooling is by free convection from fin areas located on the side and rear panels. The packaged unit weighs 52.8 lbs., which can be reduced significantly if a three-phase ac power source is used.

Cronin, D. L.↗

NASA NTRS1988

Sports Training

Practitioners of martial arts have long seen a need for a precise method of measuring the power of a karate kick or a boxer's punch in training and competition. Impax sensor is a piezoelectric film less than one thousandth of an inch thick, yet extremely durable. They give out a voltage impulse when struck, the greater the force of impact, the higher the voltage. The impulse is transmitted to a compact electronics package where voltage is translated into a force-pounds reading shown on a digital display. Impax, manufactured by Impulse Technology, Inc. is used by martial arts instructors, practitioners, U.S. Olympic Committee Training Center, football blocking sleds, and boxers as well as police defensive tactics, providing a means of evaluating the performance of recruits.

Source record↗

NASA NTRS2009

Commercial Sensor Survey Fiscal Year 2009 master compendium radiation test report

The NASA Electronic Parts and Packaging (NEPP) Program Sensor Technology Commercial Sensor Survey task is geared toward benefiting future NASA space missions with low-cost, short-duty-cycle, visible-wavelength imaging needs. Such applications could include imaging for educational outreach purposes or short surveys of spacecraft, planetary, or lunar surfaces. Under the task, inexpensive, low-power, commercial grade CMOS sensors were surveyed in fiscal year 2007 (FY07), and three sensors were selected and tested for total ionizing dose (TID) and displacement damage dose (DDD) tolerance in fiscal year 2008 (FY08). The selected sensors had to meet selection criteria chosen to support small, low-mass cameras that produce good resolution color images. The commercial CMOS sensors tested under the task in FY08 showed very promising response to typical outreach and survey camera TID and DDD levels. In fiscal year 2009 (FY09), the survey was broadened to include two additional, similar sensor products. This compendium provides results for all radiation testing performed on the Micron and OmniVision sensors that were selected for radiation tolerance testing in FY08 and FY09.

Thorbourn, Dennis O.↗

NASA NTRS2018

Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds

This paper presents the results of NASA’s game-changing technology development entitled “Ultra Low Temperature Electronics” which represents a paradigm shift in spacecraft avionics development. The project has developed compact avionics technologies to address the Command & Data Handling (CDH), Power and Motor Control needs for mission concepts to ocean worlds such as a potential Europa Lander. We addressed this need by developing the key technologies necessary to develop a next generation compact avionics package. The key technologies that we developed significantly reduce the size, weight, power, and cost (SWAP-C) of the avionics package. These technologies will also allow extreme-environment missions to last longer in their environment by reducing the power and energy requirement to keep the avionics warm.

Bolotin, Gary↗

NASA NTRS2014

Venus High Temperature Atmospheric Dropsonde and Extreme-Environment Seismometer (HADES)

The atmospheric composition and geologic structure of Venus have been identified by the US National Research Council's Decadal Survey for Planetary Science as priority targets for scientific exploration, however the high temperature and pressure at the surface, along with the highly corrosive chemistry of the Venus atmosphere, present significant obstacles to spacecraft design that have severely limited past and proposed landed missions. Following the methodology of the NASA Innovative Advanced Concepts (NIAC) proposal regime and the Collaborative Modeling and Parametric Assessment of Space Systems (COMPASS) design protocol, this paper presents a conceptual study and initial feasibility analysis for a Discovery-class Venus lander capable of an extended-duration mission at ambient temperature and pressure, incorporating emerging technologies within the field of high temperature electronics in combination with novel configurations of proven, high Technology Readiness Level (TRL) systems. Radioisotope Thermal Power (RTG) systems and silicon carbide (SiC) communications and data handling are examined in detail, and various high-temperature instruments are proposed, including a seismometer and an advanced photodiode imager. The study combines this technological analysis with proposals for a descent instrument package and a relay orbiter to demonstrate the viability of an integrated atmospheric and in-situ geologic exploratory mission that differs from previous proposals by greatly reducing the mass, power requirements, and cost, while achieving important scientific goals.

HADES↗

NASA NTRS2001

System Miniaturization Via Heterogeneous Integration of Electronic Devices for Deep Space Missions

The scientific devices designed for each of the Outer Planets Program Focuses will likely be groundbreaking not only with respect to their scientific role but also regarding the electronics required to perform such investigations. In the past, the performance of packaged electronics was limited by the components themselves, with minimal influence of the packaging technology. The rapid development of integrated circuit technology, however, has drastically increased the importance of packaging technology in the ultimate performance of devices. If not carefully considered in the overall design, the packaging may become the limiting factor in the operation of the system. Although industry is responsible for several significant accomplishments in the field of electronics packaging, deep space/outer planet missions must take into account additional requirements such as extremely low temperatures, high radiation levels, hermetic sealing, and severe size and weight limitations. Therefore, the present investigation has been designed to meet the needs of NASA's sensor intensive outer planets program by combining (using flip chip technology) an array of devices (including analog, digital, power volt-age, passives, and MEMS) into a miniaturized heterogeneous system and utilizing optical buses to enable autonomy. Additional information is contained in the original extended abstract.

DelCastillo, L.↗

NASA NTRS2010

Compact Ku-Band T/R Module for High-Resolution Radar Imaging of Cold Land Processes

Global measurement of terrestrial snow cover is critical to two of the NASA Earth Science focus areas: (1) climate variability and change and (2) water and energy cycle. For radar backscatter measurements, Ku-band frequencies, scattered mainly within the volume of the snowpack, are most suitable for the SWE (snow-water equivalent) measurements. To isolate the complex effects of different snowpack (density and snowgrain size), and underlying soil properties and to distinctly determine SWE, the space-based synthetic aperture radar (SAR) system will require a dual-frequency (13.4 and 17.2 GHz) and dual polarization approach. A transmit/receive (T/R) module was developed operating at Ku-band frequencies to enable the use of active electronic scanning phased-array antenna for wide-swath, high-resolution SAR imaging of terrestrial snow cover. The T/R module has an integrated calibrator, which compensates for all environmental- and time-related changes, and results in very stable power and amplitude characteristics. The module was designed to operate over the full frequency range of 13 to 18 GHz, although only the two frequencies, 13.4 GHz and 17.2 GHz, will be used in this SAR radar application. Each channel of the transmit module produces > 4 W (35 dbm) over the operating bandwidth of 20 MHz. The stability requirements of <0.1 dB receive gain accuracy and <0.1 dB transmit power accuracy over a wide temperature range are achieved using a self-correction scheme, which does real-time amplitude calibration so that the module characteristics are continually corrected. All the calibration circuits are within the T/R module. The timing and calibration sequence is stored in a control FPGA (field-programmable gate array) while an internal 128K 8bit high-speed RAM (random access memory) stores all the calibration values. The module was designed using advanced components and packaging techniques to achieve integration of the electronics in a 2 x6.5x1-in. (5x17x2.5-cm) package. The module size allows 4 T/R modules to feed the 16 16-element subarray on an antenna panel. The T/R module contains four transmit channels and eight receive channels (horizontal and vertical polarizations).

Andricos, Constantine↗

NASA NTRS1985

Thermal microstructure measurement system

A thermal microstructure measurement system (TMMS) operates autonomously h its own internal power supply and telemeters data to a platform. A thermal array is mounted on a cross-braced frame designed to orient itself normal to existing currents with fixed sensor positioning bars protruding from the cross bars. A plurality of matched thermistors, conductivity probes and inclinometers are mounted on the frame. A compass and pressure transducer are contained in an electronics package suspended below the array. The array is deployed on a taut mooring below a subsurface float. Data are digitized, transmitted via cable to a surface buoy and then telemetered to the platform where the data is processed via a computer, recorded and/or displayed. The platform computer also sends commands to the array via telemetry.

Carver, Michael J.↗

NASA NTRSDate not supplied

Wide Bandgap Reliability and Application Guidelines

Wide Bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN) have emerged as promising technologies due to the advantages they offer over silicon (Si). Under the NASA Electronic Parts and Packaging (NEPP) Program, Glenn Research Center (GRC) supports a task called "Wide Bandgap Reliability and Application Guidelines." This presentation summarizes the work performed under this task, to be presented at the 2020 NEPP Electronics Technology Workshop in June 2020.

Wide Bandgap Semiconductors↗

NASA NTRS1995

Micro-Electromechanical Instrument and Systems Development at the Charles Stark Draper Laboratory

Several generations of micromechanical gyros and accelerometers have been developed at Draper. Current design effort centers on tuning-fork gyro design and pendulous accelerometer configurations. Over 200 gyros of different generations have been packaged and tested. These units have successfully performed across a temperature range of -40 to 85 degrees C, and have survived 30,000-g shock tests along all axes. Draper is currently under contract to develop an integrated micro-mechanical inertial sensor assembly (MMISA) and global positioning system (GPS) receiver configuration. The ultimate projections for size, weight, and power for an MMISA, after electronic design of the application specific integrated circuit (ASIC ) is completed, are 2 x 2 x 0.5 cm, 5 gm, and less than 1 W, respectively. This paper describes the fabrication process, the current gyro and accelerometer designs, and system configurations.

Connelly, J. H.↗

NASA NTRS1986

Switches, lasers and electronically-hopped beam antennas in space - NASA's advanced communications technology satellite

The proposed design and operation of the Advanced Communications Technology Satellite (ACTS) are described. The ACTS is a three-axis stabilized spacecraft with an in-orbit weight of 2300 lbs and a beginning-of-life power of 1770 W; it is composed of a 20 GHz 2.2 m downlink antenna, a 30 GHz 3.3 m uplink antenna, a 1 m steerable antenna, and a laser package. The space segment communications payload uses high and low burst rate modes; the operations of these modes are discussed. The components of the laser intersatellite link instrument package are examined. Consideration is given to the ACTS's antennas, RF matrix switch system, and the base band processor. Diagrams of the ACTs systems are presented.

Lovell, Robert R.↗

NASA NTRS1981

Bio-medical flow sensor

A bio-medical flow sensor including a packageable unit of a bottle, tubing and hypodermic needle which can be pre-sterilized and is disposable. The tubing has spaced apart tubular metal segments. The temperature of the metal segments and fluid flow therein is sensed by thermistors and at a downstream location heat is input by a resistor to the metal segment by a control electronics. The fluids flow and the electrical power required for the resisto to maintain a constant temperature differential between the tubular metal segments is a measurable function of fluid flow through the tubing. The differential temperature measurement is made in a control electronics and also can be used to control a flow control valve or pump on the tubing to maintain a constant flow in the tubing and to shut off the tubing when air is present in the tubing.

Winkler, H. E.↗

NASA NTRS1987

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting.

Clarke, Clifton A.↗

NASA NTRS2005

X-Band, 17-Watt Solid-State Power Amplifier

An advanced solid-state power amplifier that can generate an output power of as much as 17 W at a design operating frequency of 8.4 GHz has been designed and constructed as a smaller, lighter, less expensive alternative to traveling-wave-tube X-band amplifiers and to prior solid-state X-band power amplifiers of equivalent output power. This amplifier comprises a monolithic microwave integrated circuit (MMIC) amplifier module and a power-converter module integrated into a compact package (see Figure 1). The amplifier module contains an input variable-gain amplifier (VGA), an intermediate driver stage, a final power stage, and input and output power monitors (see Figure 2). The VGA and the driver amplifier are 0.5-m GaAs-based metal semiconductor field-effect transistors (MESFETs). The final power stage contains four parallel high-efficiency, GaAs-based pseudomorphic high-electron-mobility transistors (PHEMTs). The gain of the VGA is voltage-variable over a range of 10 to 24 dB. To provide for temperature compensation of the overall amplifier gain, the gain-control voltage is generated by an operational-amplifier circuit that includes a resistor/thermistor temperature-sensing network. The driver amplifier provides a gain of 14 dB to an output power of 27 dBm to drive the four parallel output PHEMTs, each of which is nominally capable of putting out as much as 5 W. The driver output is sent to the input terminals of the four parallel PHEMTs through microstrip power dividers; the outputs of these PHEMTs are combined by microstrip power combiners (which are similar to the microstrip power dividers) to obtain the final output power of 17 W.

Mittskus, Anthony↗

NASA NTRS1998

GSFC Cutting Edge Avionics Technologies for Spacecraft

With the launch of NASA's first fiber optic bus on SAMPEX in 1992, GSFC has ushered in an era of new technology development and insertion into flight programs. Predating such programs the Lewis and Clark missions and the New Millenium Program, GSFC has spearheaded the drive to use cutting edge technologies on spacecraft for three reasons: to enable next generation Space and Earth Science, to shorten spacecraft development schedules, and to reduce the cost of NASA missions. The technologies developed have addressed three focus areas: standard interface components, high performance processing, and high-density packaging techniques enabling lower cost systems. To realize the benefits of standard interface components GSFC has developed and utilized radiation hardened/tolerant devices such as PCI target ASICs, Parallel Fiber Optic Data Bus terminals, MIL-STD-1773 and AS1773 transceivers, and Essential Services Node. High performance processing has been the focus of the Mongoose I and Mongoose V rad-hard 32-bit processor programs as well as the SMEX-Lite Computation Hub. High-density packaging techniques have resulted in 3-D stack DRAM packages and Chip-On-Board processes. Lower cost systems have been demonstrated by judiciously using all of our technology developments to enable "plug and play" scalable architectures. The paper will present a survey of development and insertion experiences for the above technologies, as well as future plans to enable more "better, faster, cheaper" spacecraft. Details of ongoing GSFC programs such as Ultra-Low Power electronics, Rad-Hard FPGAs, PCI master ASICs, and Next Generation Mongoose processors.

Luers, Philip J.↗

NASA NTRS2006

Cryogenic Cooling for Myriad Applications-A STAR Is Born

Cryogenics, the science of generating extremely low temperatures, has wide applicability throughout NASA. The Agency employs cryogenics for rocket propulsion, high-pressure gas supply, breathable air in space, life support equipment, electricity, water, food preservation and packaging, medicine, imaging devices, and electronics. Cryogenic liquid oxygen and liquid hydrogen systems are also replacing solid rocket motor propulsion systems in most of the proposed launch systems, a reversion to old-style liquid propellants. In the late 1980s, NASA wanted a compact linear alternator/motor with reduced size and mass, as well as high efficiency, that had unlimited service life for use in a thermally driven power generator for space power applications. Prior development work with free-piston Stirling converters (a Stirling engine integrated with a linear actuator that produces electrical power output) had shown the promise of that technology for high-power space applications. A dual use for terrestrial applications exists for compact Stirling converters for onsite combined heat and power units. The Stirling cycle is also usable in reverse as a refrigeration cycle suitable for cryogenic cooling, so this Stirling converter work promised double benefits as well as dual uses. The uses for cryogenic coolers within NASA abound; commercial applications are similarly wide-ranging, from cooling liquid oxygen and nitrogen, to cryobiology and bio-storage, cryosurgery, instrument and detector cooling, semiconductor manufacturing, and support service for cooled superconducting power systems.

Source record↗

NASA NTRSDate not supplied

Progress Towards Prolonged Deployment of SiC JFET-R ICs Into Previously Inaccessible Hostile Environments

This invited presentation describes demonstration of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. SiC junction field effect transistor-resistor (JFET-R) ICs with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient [1], 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber [2], and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes [3]. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C T-span) without significant change in signal (input /output) or power supply voltages [4]. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards this end, the processing that forms the SiC JFETs and resistors (without interconnect) for the NASA Glenn “Generation 12” design prototype JFET-R ICs was conducted at GE Research. Once the COVID-delayed IC interconnect and bond pad fabrication processing on these wafers is completed at NASA Glenn, the resulting chips will be packaged and oven-tested [5]. It is expected that further technology transfer to complete commercial production will lower investment and risk barriers to useful application deployment. For NASA, an initial high-value deployment is opening the Venus surface to extended missions for robotic scientific exploration.

Silicon Carbide↗