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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Printed circuit board design allows for thermal stressing of the soldered joints during many thermal cycles. Components' leads should be cleaned, tinned, and freed of particles that prevent solder adherence, have a thin conformal coating, and have an air space between the coating and the body of the component.
Test trap consists of logic nest of five printed circuit boards, plus power supply within the unit. Device monitors more than one logic area simultaneously, gives visual display of detected error, operates at computer speed, maintains readily available logic description of cards used, and is compatible with existing computer circuitry.
Conductor to terminal soldering and printed circuit soldering for Earth Resources Technology Satellite
Postsoldering cleaning agent evaluation for compatibility with printed circuit board assembly materials
Preamplifier-discriminator-gate generator in printed circuit for use with photomultipliers, noting pulse sensitivity and cost
Electrical spot terminal assembly for printed circuit boards
Improved electrical spot terminal has been developed which can be rigidly attached to terminal mounting board. Mounting board is bonded to epoxy board which in turn is bonded to printed circuit board with high temperature adhesive. Conductive lead is coupled between electrical terminal and circuit trace on circuit board. Shape is usually clover-leaf.
Development of magnetic probe for nondestructive testing of multilayer printed circuit boards to determine existence of opens or shorts is reported. Components of probe are described and procedures for operation are discussed. Two illustrations are provided to show magnetic circuits and principles of operation.
A description is given of a wide dynamic range pulse height analyzer system developed for use on High Energy Cosmic Ray Experiment (HECRE) Balloon Flights. A wide dynamic range of 100,000 is obtained by extending the range of a basic 1024 channel analyzer through the use of multiple ranges and range selection. The system described here contains four 100,000 pulse height analyzers. Each 100,000 pulse height analyzer consists of a group of cordwood welded modules mounted and interconnected on a printed circuit card. Four of these card assemblies, the required clock drive circuitry (discrete components mounted and interconnected on a separate card) and three input-output connectors are interconnected and mounted on the system board.
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
Parts are securely held on sealed, printed circuit board that is both package and test fixture. Parts can be handled, stored, and tested in sealed package.
Automatic method for selection of proper guard band eliminates human error and speeds up calibration process. There is also an option which allows a single channel to be calibrated, independently of other channels. Entire system is designed on 3- by 4-inch printed-circuit cards and may be used with any pulse code modulation system.
The structural test unit of the electron-proton spectrometer was tested to a random vibration spectra and to a sinusoidal resonant search to comply with the requirements of a verification plan for the spectrometer. The test item consisted of mass simulated electronic and printed circuit boards mounted in a flight type electronic housing. The arrangement, center of gravity, and weight were as proposed for flight units.
Design principles and test results of modifications to two wideband channels, 8 kHz DS located at 44kHz and 16 kHz SSB located at 104 kHz, are given. Data cover power supply modifications, wideband operational amplifiers, trade-off to determine requirements for precision components, printed circuit board layout, applicability of original equipment specification No. 110438, and optimum wideband channel design.
Guidelines for the selection of equipment to be used for manned spacecraft in order to assure a five year maintenance-free service life were developed. A special study was conducted to determine the adequacy of the procedures used to determine the quality and effectiveness of various components. The subjects examined are: (1) temperature cycling for acceptance of electronic assemblies; (2) accelerated testing techniques; (3) electronic part screening techniques; (4) electronic part derating practices; (5) vibration life extension of printed circuit board assemblies; and (6) tolerance funnelling and test requirements.
The effect of high humidity (95% RH) at 60 C, 70 C, 85 C and 100 C on the solid-to-liquid reversion of polyurethane elastomers (used for potting electrical connectors and conformal coating printed circuit boards) was investigated. Hardness measurements were conducted on eleven elastomers to track reversion for a 101-day period. The primary purpose of the tests was to provide data to predict service life for the polyurethane elastomers. This was not accomplished as the hardness did not deteriorate rapidly enough at the lower test temperatures. The tests did determine that the potting and coating materials most widely used on the S-1C Program are susceptible to reversion but appear adequate for service in the S-1C environment.
An interactive graphics display system was designed to be used in locating components on a printed circuit card and outputting data concerning their thermal values. The manner in which this was accomplished in terms of both hardware and software is described. An analysis of the accuracy of this approach is also included.
The recognition of the need for instrumentation in manned spacecraft life-support subsystems has increased significantly over the past several years. Of the required control and monitoring instrumentation, this paper will focus on the monitoring instrumentation as applied to life-support subsystems. The initial approach used independent sensors, independent sensor signal conditioning circuitry, and independent logic circuitry to provide shutdown protection only. This monitoring system was replaced with a coordinated series of printed circuit cards, each of which contains all the electronics to service one sensor and provide performance trend information, fault detection and isolation information, and shutdown protection. Finally, a review of sensor and instrumentation problems is presented, and the requirement for sensors with built-in signal conditioning and provisions for in situ calibration is discussed.