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Results for “thermal conductivities”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Thermal conductivity and diffusivity of Apollo 15 fines at low density

The thermal conductivity of the Apollo 15 fines, sample 15031,38, was measured under vacuum conditions as a function of temperature. Measurements were made for a sample density of 1300 kg/cu m. The conductivity was found to vary from about .00057 W per m per K at 95 K to about .00136 W per m per K at 406 K. The data are compared with the correlation using a cubic temperature dependence and also with data from samples gathered during prior Apollo missions. The thermal diffusivity is obtained for the sample by calculation using the given density and measured thermal conductivity along with specific heats from the literature.

Cremers, C. J.↗
NASA NTRS2024

Thermal Conductivity and Mechanical Properties of Epoxy Composites With Hybridized PAN- and Pitch-Based Fiber Architecture

A series of hybrid polyacrylonitrile- (PAN-) and pitch-based carbon fiber/epoxy composites were fabricated and tested to evaluate the influence of hybrid fiber configurations on composite strength, modulus, and through-thickness thermal conductivity. Two grades of pitch-based fiber were selected based on their thermal conductivity: YSH-60A and YSH-80A from Nippon Graphite. These pitch-based fibers were received in tow form and as plain weave to allow flexibility in the architecture of the multifiber laminate. Two hybridization approaches were followed: (1) interleave of pitch-based fiber weave within braided PAN/epoxy prepreg and (2) incorporation of pitch-based fiber tows within a three-dimensional braided preform. These showed considerable impact on overall composite mechanical properties and through-thickness thermal conductivity.

Polymer Composite↗
NASA NTRS1992

Thermal conductance of gold plated metallic contacts at liquid helium temperatures

The thermal conductance of gold plated OFHC copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel contacts has been measured over the temperature range of 1.6 to 4.2 K, with applied forces from 22 N to 670 N. The contact surfaces were prepared with a 0.8 micron lapped finish prior to gold coating. It was found that for all materials, except stainless steel, the thermal conductance was significantly improved as the result of gold coating the contact surfaces.

Kittel, Peter↗
NASA NTRS1992

Thermal conductance of two interface materials and their applications in space systems

The temperature control of spacecraft and instrument systems and subsystems requires heat transfer interface materials that possess good thermal and structural characteristics, among other properties, to respond to the vacuum environment of space. These materials must be easy to apply to, and remove from, the surfaces where they are applied, and must be able to withstand power dissipation extremes, and be used for different clamping configurations and pressures. Silicone based greases, used in the past, tend to migrate and to contaminate nearby surfaces. Bare metal to metal contact offers low thermal conductance and difficulties in estimating the actual heat transfer. Several polymeric materials containing different thermal conductive compounds and structural reinforcements were prepared to overcome grease and metal problems. Two polymeric materials were evaluated: Cho-Therm 1671 elastomer; and the CV-2946, a conductive RTV silicone. Tests were done to learn more about these products. Results indicate that the tightly bolted, torqued fixtures did not buckle or distort, and provided optimum thermal conductance. Fixtures simulating actual spacecraft configuration suffered bowing and separating.

Scialdone, J. J.↗
NASA NTRS1982

The thermal conductivity of oxygen

The paper presents new experimental measurements of the thermal conductivity of oxygen for thirteen isotherms at temperatures from 78 to 310 K with pressures to 70 MPa and densities from 0 to 40 mol/L. The measurements were made with a transient hot wire apparatus and they cover a wide range of physical states including the dilute gas, the moderately dense gas, the near critical region, the compressed liquid states, and the vapor at temperatures below the critical temperature. The thermal conductivity surface is represented with an equation that is based in part on an existing correlation of the dilute gas. The date are compared with the experimental measurements of others through the new correlation. The new measurements show that the critical enhancement extends to quite high temperatures, about 300 K. The precision (2 sigma) of the oxygen of the oxygen measurements is between 0.5 and 0.8 percent for wire temperature transients of 4 to 5 K, while the accuracy is estimated to be 1.5 percent.

Roder, H. M.↗
NASA NTRS1972

Thermal conductivity of Apollo 14 fines.

The thermal conductivity of the Apollo 14 fines, sample 14163,133, was measured under vacuum conditions as a function of temperature. Measurements were made for densities of 1100 and 1300 kg/cu m. A least-squares curve of the form k = A + B(T-cubed) is fitted to each data set in accordance with elementary theory. Comparisons are made with previously published data for terrestrial basalt and Apollo 11 and 12 samples.

Cremers, C. J.↗
NASA NTRS1987

Measuring Contact Thermal Conductances at Low Temperatures

Instrument measures thermal conductance of pressed contacts in liquid helium. Makes measurements automatically as function of force on pairs of brass samples having various surface finishes. Developed as part of effort to determine heat-transfer characteristics of bolted joints on cryogenically cooled focal planes in infrared equipment. Cylindrical chamber hangs from cover plate in bath of liquid helium. Inside chamber rocker arm applies controlled force to samples. Upper sample made slightly wider than lower one so two samples remain in complete contact even under slight lateral misalignment.

Salerno, Louis J.↗
NASA NTRS1954

Effect of variable viscosity and thermal conductivity on high-speed slip flow between concentric cylinders

Schamberg was the first to solve the differential equations of slip flow, including the Burnett terms, for concentric circular cylinders assuming constant coefficients of viscosity and thermal conductivity. The problem is solved for variable coefficients of viscosity and thermal conductivity in this paper by applying a transformation which leads to an iteration method. Starting with the solution for constant coefficients, this method enables one to approximate the solution for variable coefficients very closely after one or two steps. Satisfactory results are shown to follow from Schamberg's solution by using his values of constant coefficients multiplied by a constant factor, leading to what are denoted as the effective coefficients of viscosity and thermal conductivity.

Lin, T C↗
NASA NTRS1983

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

The thermal conductance of oxygen-free high conductivity (OFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

Salerno, L. J.↗
NASA NTRS1985

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

The thermal conductance of oxygen-free high conductivity (COFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

Salerno, L. J.↗
NASA NTRS2001

Device and method for measuring thermal conductivity of thin films

A device and method are provided for measuring the thermal conductivity of rigid or flexible, homogeneous or heterogeneous, thin films between 50 .mu.m and 150 .mu.m thick with relative standard deviations of less than five percent. The specimen is sandwiched between like material, highly conductive upper and lower slabs. Each slab is instrumented with six thermocouples embedded within the slab and flush with their corresponding surfaces. A heat source heats the lower slab and a heat sink cools the upper slab. The heat sink also provides sufficient contact pressure onto the specimen. Testing is performed within a vacuum environment (bell-jar) between 10.sup.-3 to 10.sup.-6 Torr. An anti-radiant shield on the interior surface of the bell-jar is used to avoid radiation heat losses. Insulation is placed adjacent to the heat source and adjacent to the heat sink to prevent conduction losses. A temperature controlled water circulator circulates water from a constant temperature bath through the heat sink. Fourier's one-dimensional law of heat conduction is the governing equation. Data, including temperatures, are measured with a multi-channel data acquisition system. On-line computer processing is used for thermal conductivity calculations.

Amer, Tahani R.↗
NASA NTRS1986

Thermal conductance of pressed aluminum and stainless steel contacts at liquid helium temperatures

The thermal conductance of aluminum and stainless steel 304 sample pairs with surface finishes ranging from 0.1 to 1.6 microns rms roughness was investigated over a temperature range from 1.6 to 6.0 k. The thermal conductance follows a simple power law function of temperature, with the exponent ranging from 0.5 to 2.25, increases asymptotically with increasing applied force, and exhibits an anomaly for surface finishes in the 0.4 micron region.

Salerno, L. J.↗
NASA NTRS1988

Thermal conductance of pressed aluminum and stainless steel contacts at liquid helium temperatures

The thermal conductance of aluminum and stainless steel 304 sample pairs with surface finishes ranging from 0.1 to 1.6 microns rms roughness was investigated over a temperature range from 1.6 to 6.0 K. The thermal conductance follows a simple power law function of temperature, with the exponent ranging from 0.5 to 2.25, increases asymptotically with increasing applied force, and exhibits an anomaly for surface finishes in the 0.4 micron region.

Salerno, L. J.↗