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At least 217 records · Page 12

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NASA NTRS2016

Measurement Approach and Design of the CubeSat Infrared Atmospheric Sounder (CIRAS)

The CubeSat Infrared Atmospheric Sounder (CIRAS) will measure upwelling infrared radiation of the Earth in the MWIR region of the spectrum from space on a CubeSat. The observed radiances can be assimilated into weather forecast models and be used to retrieve lower tropospheric temperature and water vapor for climate studies. Multiple units can be flown to improve temporal coverage or in formation to provide new data products including 3D motion vector winds. CIRAS incorporates key new instrument technologies including a 2D array of High Operating Temperature Barrier Infrared Detector (HOT-BIRD) material, selected for its high uniformity, low cost, low noise and higher operating temperatures than traditional materials. The detectors are hybridized to a commercial ROIC and commercial camera electronics. The second key technology is an MWIR Grating Spectrometer (MGS) designed to provide imaging spectroscopy for atmospheric sounding in a CubeSat volume. The MGS has no moving parts and includes an immersion grating to reduce the volume and reduce distortion. The third key technology is an infrared blackbody fabricated with black silicon to have very high emissivity in a flat plate construction. JPL will also develop the mechanical, electronic and thermal subsystems for CIRAS, while the spacecraft will be a commercially available CubeSat. The integrated system will be a complete 6U CubeSat capable of measuring temperature and water vapor profiles with good lower tropospheric sensitivity. The CIRAS is the first step towards the development of an Earth Observation Nanosatellite Infrared (EON-IR) capable of meeting the replacement needs of the CrIS on JPSS.

Pagano, Thomas S.↗

NASA NTRS1998

Chemical Gas Sensors for Aeronautic and Space Applications 2

Aeronautic and space applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. Areas of interest include launch vehicle safety monitoring, emission monitoring, and fire detection. This paper discusses the needs of aeronautic and space applications and the point-contact sensor technology being developed to address these needs. The development of these sensors is based on progress in two types of technology: 1) Micromachining and microfabrication technology to fabricate miniaturized sensors. 2) The development of high temperature semiconductors, especially silicon carbide. Sensor development for each application involves its own challenges in the fields of materials science and fabrication technology. The number of dual-use commercial applications of this microfabricated gas sensor technology make this area of sensor development a field of significant interest.

Hunter, Gary W.↗

NASA NTRS1999

Chemical Gas Sensors for Aeronautics and Space Applications III

Hunter, G. W.↗

NASA NTRS1981

Sensitivity analysis of the add-on price estimate for the silicon web growth process

The web growth process, a silicon-sheet technology option, developed for the flat plate solar array (FSA) project, was examined. Base case data for the technical and cost parameters for the technical and commercial readiness phase of the FSA project are projected. The process add on price, using the base case data for cost parameters such as equipment, space, direct labor, materials and utilities, and the production parameters such as growth rate and run length, using a computer program developed specifically to do the sensitivity analysis with improved price estimation are analyzed. Silicon price, sheet thickness and cell efficiency are also discussed.

Mokashi, A. R.↗

NASA NTRS1989

Endurance Tests Of Amorphous-Silicon Photovoltaic Modules

Failure mechanisms in high-power service studied. Report discusses factors affecting endurance of amorphous-silicon solar cells. Based on field tests and accelerated aging of photovoltaic modules. Concludes that aggressive research needed if amorphous-silicon modules to attain 10-year life - value U.S. Department of Energy established as goal for photovoltaic modules in commercial energy-generating plants.

Ross, Ronald G., Jr.↗

NASA NTRS1991

Center for Space Power and Advanced Electronics, Auburn University

The union of Auburn University's Center for Space Power and Advanced Electronics and the Westinghouse Science and Technology Center to form a Center for the Commercial Development of Space (CCDS) is discussed. An area of focus for the CCDS will be the development of silicon carbide electronics technology, in terms of semiconductors and crystal growth. The discussion is presented in viewgraph form.

Deis, Dan W.↗

NASA NTRS1996

Application of Phase Shifted, Laser Feedback Interferometry to Fluid Physics

We have combined the principles of phase-shifting interferometry (PSI) and laser-feedback interferometry (LFI) to produce a new instrument that can measure both optical path length (OPL) changes and discern sample reflectivity variations. In LFI, coherent feedback of the incident light either reflected directly from a surface or reflected after transmission through a region of interest will modulate the output intensity of the laser. LFI can yield a high signal-to-noise ratio even for low reflectivity samples. By combining PSI and LFI, we have produced a robust instrument, based upon a HeNe laser, with high dynamic range that can be used to measure either static (dc) or oscillatory changes along the optical path. As with other forms of interferometry, large changes in OPL require phase unwrapping. Conversely, small phase changes are limited by the fraction of a fringe that can be measured. We introduce the phase shifts with an electro-optic modulator (EOM) and use either the Carre or Hariharan algorithms to determine the phase and visibility. We have determined the accuracy and precision of our technique by measuring both the bending of a cantilevered piezoelectric bimorph and linear ramps to the EOM. Using PSI, sub-nanometer displacements can be measured. We have combined our interferometer with a commercial microscope and scanning piezoelectric stage and have measured the variation in OPL and visibility for drops of PDMS (silicone oil) on coated single crystal silicon. Our measurement of the static contact angle agrees with the value of 68 deg stated in the literature.

Ovryn, Ben↗

NASA NTRS2008

25th Space Simulation Conference. Environmental Testing: The Earth-Space Connection

Topics covered include: Methods of Helium Injection and Removal for Heat Transfer Augmentation; The ESA Large Space Simulator Mechanical Ground Support Equipment for Spacecraft Testing; Temperature Stability and Control Requirements for Thermal Vacuum/Thermal Balance Testing of the Aquarius Radiometer; The Liquid Nitrogen System for Chamber A: A Change from Original Forced Flow Design to a Natural Flow (Thermo Siphon) System; Return to Mercury: A Comparison of Solar Simulation and Flight Data for the MESSENGER Spacecraft; Floating Pressure Conversion and Equipment Upgrades of Two 3.5kw, 20k, Helium Refrigerators; Affect of Air Leakage into a Thermal-Vacuum Chamber on Helium Refrigeration Heat Load; Special ISO Class 6 Cleanroom for the Lunar Reconnaissance Orbiter (LRO) Project; A State-of-the-Art Contamination Effects Research and Test Facility Martian Dust Simulator; Cleanroom Design Practices and Their Influence on Particle Counts; Extra Terrestrial Environmental Chamber Design; Contamination Sources Effects Analysis (CSEA) - A Tool to Balance Cost/Schedule While Managing Facility Availability; SES and Acoustics at GSFC; HST Super Lightweight Interchangeable Carrier (SLIC) Static Test; Virtual Shaker Testing: Simulation Technology Improves Vibration Test Performance; Estimating Shock Spectra: Extensions beyond GEVS; Structural Dynamic Analysis of a Spacecraft Multi-DOF Shaker Table; Direct Field Acoustic Testing; Manufacture of Cryoshroud Surfaces for Space Simulation Chambers; The New LOTIS Test Facility; Thermal Vacuum Control Systems Options for Test Facilities; Extremely High Vacuum Chamber for Low Outgassing Processing at NASA Goddard; Precision Cleaning - Path to Premier; The New Anechoic Shielded Chambers Designed for Space and Commercial Applications at LIT; Extraction of Thermal Performance Values from Samples in the Lunar Dust Adhesion Bell Jar; Thermal (Silicon Diode) Data Acquisition System; Aquarius's Instrument Science Data System (ISDS) Automated to Acquire, Process, Trend Data and Produce Radiometric System Assessment Reports; Exhaustive Thresholds and Resistance Checkpoints; Reconfigurable HIL Testing of Earth Satellites; FPGA Control System for the Automated Test of MicroShutters; Ongoing Capabilities and Developments of Re-Entry Plasma Ground Tests at EADS-ASTRIUM; Operationally Responsive Space Standard Bus Battery Thermal Balance Testing and Heat Dissipation Analysis; Galileo - The Serial-Production AIT Challenge; The Space Systems Environmental Test Facility Database (SSETFD), Website Development Status; Simulated Reentry Heating by Torching; Micro-Vibration Measurements on Thermally Loaded Multi-Layer Insulation Samples in Vacuum; High Temperature Life Testing of 80Ni-20Cr Wire in a Simulated Mars Atmosphere for the Sample Analysis at Mars (SAM) Instrument Suit Gas Processing System (GPS) Carbon Dioxide Scrubber; The Planning and Implementation of Test Facility Improvements; and Development of a Silicon Carbide Molecular Beam Nozzle for Simulation Planetary Flybys and Low-Earth Orbit.

Packard, Edward↗

NASA NTRS1998

Chemical Gas Sensors for Aeronautic and Space Applications 2

Aeronautic and Space applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. Areas of most interest include launch vehicle safety monitoring emission monitoring and fire detection. This paper discusses the needs of aeronautic and space applications and the point-contact sensor technology being developed to address these needs. The development of these sensor is based on progress two types of technology: 1) Micro-machining and micro-fabrication technology to fabricate miniaturized sensors. 2) The development of high temperature semiconductors, especially silicon carbide. Sensor development for each application involves its own challenges in the fields of materials science and fabrication technology. The number of dual-use commercial applications of this micro-fabricated gas sensor technology make this area of sensor development a field of significant interest.

Hunter, G. W.↗

NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗

NASA NTRS1990

Luminescent barometry in wind tunnels

A flexible and relatively inexpensive method and apparatus are described for continuous pressure mapping of aerodynamic surfaces using photoluminescence and imaging techniques. Platinum octaethylporphyrin (PtOEP) has a phosphorescence known to be quenched by oxygen. When dissolved in a silicone matrix, PtOEP may be distributed over a surface as a thin, uniform film. When the film is irradiated with ultraviolet light, the luminescence intensity provides a readily detectable, qualitative surface flow visualization. Moreover, since the luminescence intensity is found to be inversely proportional to the partial pressure of oxygen, a quantitative measure of pressure change may be obtained using a silicon target vidicon or a charge-coupled device video sensor to measure intensity. Luminescent images are captured by a commercial frame buffer board. Images taken in wind tunnels during airflow are ratioed to images taken under ambient 'wind-off' conditions. The resulting intensity ratio information is converted to pressure using calibration curves of I0/I vs p/p0, where I0 is the intensity at ambient pressure p0 and I is the intensity at any other pressure p.

Kavandi, Janet↗

NASA NTRS2000

Level 1 Processing of MODIS Direct Broadcast Data From Terra

In February 2000, an effort was begun to adapt the Moderate Resolution Imaging Spectroradiometer (MODIS) Level 1 production software to process direct broadcast data. Three Level 1 algorithms have been adapted and packaged for release: Level 1A converts raw (level 0) data into Hierarchical Data Format (HDF), unpacking packets into scans; Geolocation computes geographic information for the data points in the Level 1A; and the Level 1B computes geolocated, calibrated radiances from the Level 1A and Geolocation products. One useful aspect of adapting the production software is the ability to incorporate enhancements contributed by the MODIS Science Team. We have therefore tried to limit changes to the software. However, in order to process the data immediately on receipt, we have taken advantage of a branch in the geolocation software that reads orbit and altitude information from the packets themselves, rather than external ancillary files used in standard production. We have also verified that the algorithms can be run with smaller time increments (2.5 minutes) than the five-minute increments used in production. To make the code easier to build and run, we have simplified directories and build scripts. Also, dependencies on a commercial numerics library have been replaced by public domain software. A version of the adapted code has been released for Silicon Graphics machines running lrix. Perhaps owing to its origin in production, the software is rather CPU-intensive. Consequently, a port to Linux is underway, followed by a version to run on PC clusters, with an eventual goal of running in near-real-time (i.e., process a ten-minute pass in ten minutes).

Lynnes, Christopher↗

NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗

NASA NTRS1973

Improved mold release for filled-silicone compounds

Ceramic and filled-plastic materials used for fabrication of tiles are relatively brittle and easily break as they are being removed from molds. Dusting mold surfaces with commercially available glass microspheres provides mold release superior to existing spray releases. Glass-microsphere dusting also permits removal of uncured tile which has very little strength.

Accountius, O. E.↗

NASA NTRS1981

Ultrasonic velocity for estimating density of structural ceramics

The feasibility of using ultrasonic velocity as a measure of bulk density of sintered alpha silicon carbide was investigated. The material studied was either in the as-sintered condition or hot isostatically pressed in the temperature range from 1850 to 2050 C. Densities varied from approximately 2.8 to 3.2 g cu cm. Results show that the bulk, nominal density of structural grade silicon carbide articles can be estimated from ultrasonic velocity measurements to within 1 percent using 20 MHz longitudinal waves and a commercially available ultrasonic time intervalometer. The ultrasonic velocity measurement technique shows promise for screening out material with unacceptably low density levels.

Klima, S. J.↗

NASA NTRS2012

Verilog-A Device Models for Cryogenic Temperature Operation of Bulk Silicon CMOS Devices

Verilog-A based cryogenic bulk CMOS (complementary metal oxide semiconductor) compact models are built for state-of-the-art silicon CMOS processes. These models accurately predict device operation at cryogenic temperatures down to 4 K. The models are compatible with commercial circuit simulators. The models extend the standard BSIM4 [Berkeley Short-channel IGFET (insulated-gate field-effect transistor ) Model] type compact models by re-parameterizing existing equations, as well as adding new equations that capture the physics of device operation at cryogenic temperatures. These models will allow circuit designers to create optimized, reliable, and robust circuits operating at cryogenic temperatures.

Akturk, Akin↗

NASA NTRS1982

Effect of lubricant environment on saw damage in silicon wafers

The chemomechanical effect of lubricant environments on the inner diameter (ID) sawing induced surface damage in Si wafers was tested for four different lubricants: water, dielectric oil, and two commercial cutting solutions. The effects of applying different potential on Si crystals during the sawing were also tested. It is indicated that the number and depth of surface damage are sensitive to the chemical nature of the saw lubricant. It is determined that the lubricants that are good catalysts for breaking Si bonds can dampen the out of plane blade vibration more effectively and produce less surface damage. Correlations between the applied potential and the depth of damage in the dielectric oil and one of the commercial cutting solutions and possible mechanisms involved are discussed.

Kuan, T. S.↗

NASA NTRS1997

Chemical Gas Sensors for Aeronautic and Space Applications

Aeronautic and space applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. Two areas of particular interest are safety monitoring and emission monitoring. In safety monitoring, detection of low concentrations of hydrogen at potentially low temperatures is important while for emission monitoring the detection of nitrogen oxides, hydrogen, hydrocarbons and oxygen is of interest. This paper discusses the needs of aeronautic and space applications and the point-contact sensor technology being developed to address these needs. The development of these sensors is based on progress in two types of technology: (1) Micromachining and microfabrication technology to fabricate miniaturized sensors. (2) The development of high temperature semiconductors, especially silicon carbide. The detection of each type of gas involves its own challenges in the fields of materials science and fabrication technology. The number of dual-use commercial applications of this microfabricated gas sensor technology make this general area of sensor development a field of significant interest.

Hunter, Gary W.↗