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A method for making panels which selectively absorb solar energy is disclosed. The panels are comprised of an aluminum substrate, a layer of zinc thereon, a layer of nickel over the zinc layer and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a layer of nickel thereon and a layer of solar energy absorbing nickel oxide distal from the copper substrate.
It is shown that the content of total iron, copper and manganese in the liver of animals is altered depending on the intensity and duration of their swimming. Hypodynamia for 7 days does not alter the concentration of iron, but sufficiently increases the content of copper and manganese. The barometric factor effectively influences the maintenance of constancy in the content of microelements accumulated in the liver after intensive muscle activity.
Silicon nitride and nickel pastes are investigated in conjunction with a brush copper plating process for the purpose of identifying one or more fabrication sequences which yield at least 10 percent efficient N(+)/P(+) flat plate solar cells. The adhesion of all nickel pastes is reduced significantly when subjected to acidic and alkaline brush copper plating solutions as a result of a combination of thermally induced stress and chemical attack of the frit, which occurs at the interface with the silicon solar cell. The AgF is penetrating the 800 a of Si3N4 and ohmic contact is occurring at all fire-in tempertures. During the brush plating process, fingers and buss bars tend to spread.
Foam insulation nickel-plated with one less step. Changing tie-in layer from plasma-sprayed nickel to plasma-sprayed copper eliminates intermediate copper electroplating step previously required.
Experimental matrices were conducted to determine a suitable firing schedule for fritless tin printing ink. considerable difficulties were encountered with oxidation. Best results were obtained with a firing cycle consisting of 400 C for 20 minutes in nitrogen followed by 5 minutes in air at 500 C. Elimination of oxidizing conditions impaired the adhesion of both tin and copper fritless printing inks, although adhesion of fritless copper inks was obtained when fired in nitrogen with slight oxidation.
The variations of the mean depth of penetration, the mean depth rate of penetration, MDRP, the pit diameter 2a and depth h due to cavitation attack on Al 6061-T6, Cu, brass of composition Cu-35Zn-3Pb and Ti-5A1-2.5Sn are presented. The experiments are conducted in a mineral oil of viscosity 110 CS using a magnetostrictive oscillator of 20 kHz frequency. Based on MDRP on the materials, it is found that Ti-5Al-2.5Sn exhibits cavitation erosion resistance which is two orders of magnitude higher than the other three materials. The values of h/a are the largest for copper and decreased with brass, titanium, and aluminum. Scanning electron microscope studies show that extensive slip and cross slip occurred on the surface prior to pitting and erosion. Twinning is also observed on copper and brass.
Carbon-copper chloride intercalation compounds have been obtained by using variously graphitized carbon fibers as host materials. The resultant conductors are air stable, thermally stable to 450 K, have electrical resistivities as low as 12.9 microohm cm at room temperature, and have metallic conductivity temperature dependencies. These intercalated fibers have tensile strengths of 160000 psi, and Young's moduli of 25 x 10 to the 6th psi. For aerospace use, 1/(resistivity x density) is a figure of merit. On this basis, a reduction in resistivity by a factor of two will make this conductor competitive with copper.
For a number of years Landsat data have been used to locate areas of iron oxide occurrences which might be associated with hydrothermal alteration zones. However, the usefulness of the Landsat data was restricted because of certain limitations of the spectral information provided by Landsat. A new generation multispectral scanner will, therefore, be carried by the fourth Landsat, which is to be launched in July, 1982. This instrument, called the Thematic Mapper (TM), will have seven channels and provide data with 30 m spatial resolution. Two of the spectral channels (1.6 micron and 2.2 micron) should allow detection of hydrous minerals. Possible applications of Landsat-D TM data for copper exploration were studied on the basis of a comparison of Landsat data with simulated TM data acquired using an aircraft scanner instrument. Three porphyr copper deposits in Arizona were selected for the study. It is concluded that the new Landsat-D TM scanner will provide Exploration geologists with a new improved tool for surveying mineral resources on a global basis.
The feasibility of a copper-base metallization for shallow-junction cells applied in flexible solar arrays in space is discussed. This type of metallization will reduce usage of precious metals (such as silver), increase case of bonding (by welding or by soldering) and eliminate heavy high Z interconnects (such as molybdenum). The main points of concern are stability against thermally induced diffusion of copper into silicon which causes degradation of shallow cell junctions, and low series resistance of the contact with semiconductor which promotes cell efficiency.
Surface-enhanced Raman spectroscopy has been used to study the molecular interactions of malononitrile with copper electrode surfaces. The doubly degenerate CN stretching frequency at 2263/cm is removed when malononitrile adsorbs on copper. Two nu(CN) bands are observed at 2096 and 2204/cm at -0.6 V(SCE). The result shows that only one CN group is pi-coordinated with Cu, which contributes to the observed large shift (-167/cm) in nu(CN). The other CN group is not coordinated to the metal surface.
A method of improving the efficiency of multistage depressed collectors (MDC's) for traveling-wave tubes (TWT's) has been demonstrated at the NASA Lewis Research Center. A significant increase in MDC efficiency was brought about by the application of a thin layer of highly-textured carbon to the surfaces of oxygen-free, high-conductivity (OFHC) copper collector electrodes in an experimental TWT. The textured carbon layer was applied by means of a NASA developed sputtering procedure. In an experimental investigation recently completed, this electrode surface modification resulted in an increase in MDC efficiency by as much as 8.6 percentage points relative to that of the same MDC with untreated copper electrode surfaces. This increase in MDC efficiency was reflected by an increase in overall TWT efficiency by as much as 5.4 percentage points.
A number of oxidizing agents, including chlorine, bromine, ozone and other peroxides, were allowed to act on copper solutions with the intention of forming copper peroxide. The only successful agent appears to be hydrogen peroxide. It must be used in a neutral 50 to 30 percent solution at a temperature near zero. Other methods described in the literature apparently do not work. The excess of hydrogen must be quickly sucked out of the brown precipitate, which it is best to wash with alcohol and ether. The product, crystalline under a microscope, can be analyzed only approximately. It approaches the formula CuO2H2O. In alkaline solution it appears to act catalytically in causing the decomposition of other peroxides, so that Na2O2 cannot be used to prepare it. On the addition of acids the H2O2 is regenerated. The dry substance decomposes much more slowly than the moist but is not very stable.
We have developed a new copper-carbon fiber composite which possesses properties of copper, i.e., excellent thermal and electrical conductivities, in combination with a property of carbon fiber, i.e., a small thermal expansion coefficient. The composite properties can be controlled by the amount, type and orientation of the carbon fibers they contain. Therefore, this composite is considered to be useful as an electrical material. The effects of volume and arrangement of fibers on the thermal conductivity, electrical conductivity and specific heat of the composite were studied. The results obtained were as follows: (1) The thermal and electrical conductivities of the composite became smaller as the volume of carbon fibers increased, and they were also influenced by the fiber arrangement. (2) The above conductivities could be calculated by careful application of the “rule of mixtures” for composites. (3) The specific heat of the composite was dependent not on the fiber arrangement but on the fiber volume. (4) In thermal fatigue tests, no degradation in electrical conductivity was observed.
A fractographic and metallographic investigation was performed on specimens of a tungsten fiber reinforced copper matrix composite (9 vol percent), which had experienced fatigue failures at elevated temperatures. Major failure modes and possible failure mechanisms, with an emphasis placed on characterizing fatigue damage accumulation, were determined. Metallography of specimens fatigued under isothermal cyclic loading suggested that fatigue damage initiates in the matrix. Cracks nucleated within the copper matrix at grain boundaries, and they propagated through cavity coalescence. The growing cracks subsequently interacted with the reinforcing tungsten fibers, producing a localized ductile fiber failure. Examinations of interrupted tests before final failure confirmed the suggested fatigue damage processes.
The high temperature fatigue behavior of a 9 vol percent, tungsten fiber reinforced copper matrix composite was investigated. Load-controlled isothermal fatigue experiments at 260 and 560 C and thermomechanical fatigue (TMF) experiments, both in phase and out of phase between 260 and 560 C, were performed. The stress-strain response displayed considerable inelasticity under all conditions. Also, strain ratcheting was observed during all the fatigue experiments. For the isothermal fatigue and in-phase TMF tests, the ratcheting was always in a tensile direction, continuing until failure. The ratcheting during the out-of-phase TMF test shifted from a tensile direction to a compressive direction. This behavior was thought to be associated with the observed bulging and the extensive cracking of the out-of-phase specimen. For all cases, the fatigue lives were found to be controlled by damage to the copper matrix. Grain boundary cavitation was the dominant damage mechanism of the matrix. On a stress basis, TMF loading reduced lives substantially, relative to isothermal cycling. In-phase cycling resulted in the shortest lives, and isothermal fatigue at 260 C, the longest.
The role of grain boundary sliding in copper and Cu-30 pct Zn in the temperature range 0.50-0.72 Tm, where Tm is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. The results indicate that the stress exponent for sliding is similar to that for lattice deformation, while the activation energy for sliding varies between 0.5 and 1.6 of the activation energy for creep. Several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.
The present study investigates the high-temperature fatigue behavior of a 9-v/o tungsten fiber-reinforced copper matrix composite. Load-controlled isothermal fatigue at 260 and 560 C and thermomechanical fatigue (TMF) experiments, both in-phase and out-of-phase between 260 and 560 C, were performed. The stress-strain response under all conditions displayed considerable inelasticity. Strain ratchetting was observed during all the fatigue experiments. For the isothermal fatigue and in-phase TMF tests, the ratchetting was always in a tensile direction, continuing until failure. The ratchetting during the out-of-phase TMF test shifted from a tensile to a compressive direction. For all cases, the fatigue lives were found to be controlled by the damage of the copper matrix. On a stress basis, TMF loading substantially reduced lives relative to isothermal cycling.
Evaporated copper films were exposed to an atomic oxygen flux of 1.4 x 10(exp 17) atoms/sq cm per sec at temperatures in the range 285 to 375 F (140 to 191 C) for time intervals between 2 and 50 minutes. Rutherford backscattering spectroscopy (RBS) was used to determine the thickness of the oxide layers formed and the ratio of the number of copper to oxygen atoms in the layers. Oxide film thicknesses ranged from 50 to 3000 A (0.005 to 0.3 microns, or equivalently, 5 x 10(exp -9) to 3 x 10(exp -7); it was determined that the primary oxide phase was Cu2O. The growth law was found to be parabolic (L(t) varies as t(exp 1/2)), in which the oxide thickness L(t) increases as the square root of the exposure time t. The analysis of the data is consistent with either of the two parabolic growth laws. (The thin-film parabolic growth law is based on the assumption that the process is diffusion controlled, with the space charge within the growing oxide layer being negligible. The thick-film parabolic growth law is also based on a diffusion controlled process, but space-charge neutrality prevails locally within very thick oxides.) In the absence of a voltage measurement across the growing oxide, a distinction between the two mechanisms cannot be made, nor can growth by the diffusion of neutral atomic oxygen be entirely ruled out. The activation energy for the reaction is on the order of 1.1 eV (1.76 x 10(exp -19) joule, or equivalently, 25.3 kcal/mole).