Search NASA⌕ Search

SEARCH · Search NASA

Results for “ELECTRONIC EQUIPMENT TESTING”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 217 records · Page 12

Flexible Generation Of Array-Detector Timing Signals

Assembly of custom-made electronic equipment and multipurpose commercial electronic equipment commonly found in electronics-development laboratories facilitates generation and modification of timing pattern signals for control of array detectors. Designed to serve as flexible electronic array-detector-testing apparatus configured via software; timing patterns created, stored, and changed easily. Assembly prepared for experimental evaluation of new detector design in much less time and less expense than necessary to construct special circuits to generate all timing patterns to be tried on new design.

Travis, Jeffrey W.↗

Evaluation of Pd-Cr Wires for Strain Gage Application

A newly developed alloy, palladium-13 weight percent chromium (Pd13Cr), was identified by United Technologies Research Center under a NASA contract to be the best material for high temperature strain gage applications. An electrical resistance strain gage that can provide accurate static strain measurement to a temperature higher than that of a commercially available gage is urgently needed in aerospace and aeronautics research. A strain gage made of a 25.4 micron (1 mil) diameter Pd13Cr wire has been recently demonstrated to be usable for static strain measurements to 800 C. This compares to the 400 C temperature limit of the commercially available strain gages. The performance of the Pd-Cr gage, however, strongly depends on the quality of the Pd13Cr wire. Four batches of Pd-Cr wires purchased from three different manufacturers were therefore evaluated to determine the best source of the wire for strain gage applications. The three suppliers were Precious Metal Institute in China, Sigmund Cohn Co., and G & S Titanium, Inc. in the United States. Two batches of wires obtained from Previous Metal Institute in 1987 and 1992, respectively are referred to herein as China87 and China92 wires. The mechanical, chemical and electrical properties of these wires, both as-received and after high temperature exposures at 800 C for 50 hours were analyzed. The elastic modulus and the failure strength of the wires were evaluated using a tensile test machine equipped with a laser speckle strain measurement system. The chemical and microstructural properties of the wires were inspected using a plasma atomic emission spectrometer and a scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscope (EDS). The electrical stability and repeatability of the wires were determined by measuring the electrical resistance of the wires during three thermal cycles to 1000 C and a ten-hour soak at 1000 C. As a result of this study, the wire which has the highest strength, the least impurities content, the best oxidation resistance and the best electrical stability will be selected for upcoming strain gage applications.

Lei, Jih-Fen↗

NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology

Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.

3D packaging↗

Resolution of Forces and Strain Measurements from an Acoustic Ground Test

The Conservatism in Typical Vibration Tests was Demonstrated: Vibration test at component level produced conservative force reactions by approximately a factor of 4 (approx.12 dB) as compared to the integrated acoustic test in 2 out of 3 axes. Reaction Forces Estimated at the Base of Equipment Using a Finite Element Based Method were Validated: FEM based estimate of interface forces may be adequate to guide development of vibration test criteria with less conservatism. Element Forces Estimated in Secondary Structure Struts were Validated: Finite element approach provided best estimate of axial strut forces in frequency range below 200 Hz where a rigid lumped mass assumption for the entire electronics box was valid. Models with enough fidelity to represent diminishing apparent mass of equipment are better suited for estimating force reactions across the frequency range. Forward Work: Demonstrate the reduction in conservatism provided by; Current force limited approach and an FEM guided approach. Validate proposed CMS approach to estimate coupled response from uncoupled system characteristics for vibroacoustics.

Smith, Andrew M.↗

Smart built-in test

The work which built-in test (BIT) is asked to perform in today's electronic systems increases with every insertion of new technology or introduction of tighter performance criteria. Yet the basic purpose remains unchanged -- to determine with high confidence the operational capability of that equipment. Achievement of this level of BIT performance requires the management and assimilation of a large amount of data, both realtime and historical. Smart BIT has taken advantage of advanced techniques from the field of artificial intelligence (AI) in order to meet these demands. The Smart BIT approach enhances traditional functional BIT by utilizing AI techniques to incorporate environmental stress data, temporal BIT information and maintenance data, and realtime BIT reports into an integrated test methodology for increased BIT effectiveness and confidence levels. Future research in this area will incorporate onboard fault-logging of BIT output, stress data and Smart BIT decision criteria in support of a singular, integrated and complete test and maintenance capability. The state of this research is described along with a discussion of directions for future development.

Richards, Dale W.↗

Fire Signatures of Materials Used in Spacecraft Construction

The focus of my work this summer was fire safety, specifically determining fire signatures from the combustion of materials commonly found in the construction of spacecraft. This project was undertaken with the aim of addressing concerns for health and safety onboard spacecraft. Under certain conditions, burning electronics produce surprisingly large amounts of acrid smoke, release fine airborne particles and expel condensable aerosols. Similarly, some wire insulation and packing material evolves smoke when in contact with a hot surface. In the limited, enclosed space available on spacecraft, these combustion products may pose a nuisance at the very least - at worst, a hazard to health or equipment. There is also a concern for fire safety in early detection on spacecraft. Our goal for the summer was to determine the most effective methods to test the materials, develop a protocol for sampling, and generate samples for analysis. We restricted our testing to electronic components, packaging and insulation materials, and wire insulation materials.

Taylor, Christina↗

Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

Brown, Christina↗

Bar-Code System Tracks Test Equipment

Administration of complicated system speeded and simplified. Computer system uses bar codes to keep track of more than 2,200 items of test equipment. BETUS (Barcode Equipment Tracking and Utilization System), maintains data base on what items borrowed, who is using them and where, and when calibrated. Keeps records on tools and small electronic components. Saves on equipment purchases and recovers missing equipment more quickly. Cuts check-in and checkout time by 90 percent.

Rogers, Jacob R.↗

Application of Fresnel Zone to Cross Talk

Unintentional radiation results in cross coupling to nearby cables. As frequency increases, the amount of this coupling becomes significant especially in high speed data transmission and space lab experiments. There has been a considerable amount of research to model this radiation and design the electronic equipment accordingly so that operation of space lab instruments will be immune to unwanted radiation. Here at MSFC, the Electromagnetics and Aerospace Environment Branch has the responsibility to analyze, test, and make the necessary recommendation as to the safe operation of instruments used in the space program. Rules, regulation, and limits as set by this group are published in Electromagnetic Compatibility Design and Interference Control (MEDIC) Handbook. This document contains both conducted and radiate emission rules and limits are set by NASA. However cross coupling have not been included. At the time of assigning the research task for the author, the Group decided that a more in-depth investigation of Near Field is needed before establishing a set of rules and limits for cross coupling. Thus this task was assigned to the author with hope that his work will be more beneficial to NASA's Space mission experiments. The model and the method which will be described shortly is intended to improve the present approach of this Group and suggests a method for measuring the cross field coupling capacitance.

Javan, Hank↗

Non-Destructive Evaluation Method and Apparatus for Measuring Acoustic Material Nonlinearity

An acoustic non-linearity parameter (beta) measurement method and system for Non-Destructive Evaluation (NDE) of materials and structural members obviates the need for electronic calibration of the measuring equipment. Unlike known substitutional measuring techniques requiring elaborate calibration procedures, the electrical outputs of the capacitive detector of a sample with known beta and the test sample of unknown beta are compared to determine the unknown beta. In order to provide the necessary stability of the present-inventive reference-based approach, the bandpass filters of the measurement system are maintained in a temperature-controlled environment, and the line voltage supplied to said amplifiers is well-regulated.

William T Yost↗

Evaluation of Low-Pressure Cold Plasma for Disinfection for ISS Grown Produce and Metallic Instrumentation

Cold plasma (CP) cleaning is a dry, non-thermal process, which can provide broad-spectrum antimicrobial activity yet reportedly causes little to no damage to the object being sanitized. Since cold plasma uses no liquids, it has the distinct advantage when used in microgravity of not having to separate liquids from the item being cleaned. This paper will present results on an effort to use low pressure CP to disinfect or sterilize materials for in space applications. Exposure times from 0 to 60 minutes and pressures ranging from 10 to 100 Pa were used to optimize plasma parameters to achieve acceptable kill rates for 3 bacteria, Bacillus cereus, E. coli and Bacillus pumulis SAFR-32 and one fungi, Aspergillus niger. These tests were done on produce and metal coupons to simulate medical equipment. Produce testing was not successful, with unacceptable kill rates and the produce being negatively impacted by exposure to the plasma. The plasma caused a 5 log reduction in the number of viable bacteria on metal coupon tests, which placed the number of viable bacteria below the detection limit. This is a very promising result showing that sterilization of medical equipment with cold plasma is feasible. Scanning Electron Microscope images were taken before and after exposure. The images after plasma exposure shows that the bacteria spores have been physically affected, as their size has gotten smaller and the appearance has changed.

Hintze, Paul E.↗

Evaluation of Low-Pressure Cold Plasma for Disinfection of ISS Grown Produce and Metallic Instrumentation

Cold plasma (CP) cleaning is a dry, non-thermal process, which can provide broad-spectrum antimicrobial activity yet reportedly causes little to no damage to the object being sanitized. Since cold plasma uses no liquids, it has the distinct advantage when used in microgravity of not having to separate liquids from the item being cleaned. This paper will present results on an effort to use low pressure CP to disinfect or sterilize materials for in space applications. Exposure times from 0 to 60 minutes and pressures ranging from 0.10 to 1.0 mbar were used to optimize plasma parameters. Tests were done on produce and metal coupons to simulate medical equipment. Escherichia coli was used as the challenge organism on produce and Bacillus pumilus SAFR-32 was used on metal surfaces. Produce testing was not successful, with unacceptable kill rates and the produce being negatively impacted by exposure to the plasma. The plasma caused a 5 log reduction in the number of viable bacteria on metal coupon tests, which placed the number of viable bacteria below the detection limit. This is a very promising result showing that sterilization of medical equipment with cold plasma is feasible. Scanning Electron Microscope images were taken before and after exposure. The images after plasma exposure show that the bacteria spores have been physically affected, as their size has gotten smaller and their appearance has changed.

Hintze, Paul E.↗

Spacecraft charging technology in the satellite X-ray test facility

A satellite X-ray test facility (SXTF) is planned for studying system generated electromagnetic pulse effects on full scale, operational spacecraft. The environment created by a distant, high altitude nuclear burst can be simulated using pulsed X-ray sources. The facility is to be installed in a thermal vacuum chamber with dimensions greater then 10 m diameter and 20 m height and equipped with solar simulators and equipment for simulating the charging environment of space. The spacecraft charging system consists of several low energy electron and hydrogen ion sources (5-25 keV), one or two medium energy electron accelerators (150-300 keV), an array of vacuum ultraviolet lamps, and geomagnetic field suppression coils. Military, scientific, and commercial spacecraft can be tested before launching into the radiation environment of space. construction of SXTF is scheduled to begin in 1982 and the facility should be available for general use in 1984. Potential users are encouraged to express their needs for specific testing environments in SXTF.

Sponaugle, T. J.↗

Electron gun test report

Shock and vibration tests were performed to determine the electron optical properties of the electron gun. The test procedure included complete mechanical inspection including a dimensional check of all critical parts. Electrical inspection involved tests for dielectric strengths and element to element leakage resistance. All test circuits and equipment for each test are specified in the test plan.

Source record↗

On-Wafer Measurement of a Silicon-Based CMOS VCO at 324 GHz

The world s first silicon-based complementary metal oxide/semiconductor (CMOS) integrated-circuit voltage-controlled oscillator (VCO) operating in a frequency range around 324 GHz has been built and tested. Concomitantly, equipment for measuring the performance of this oscillator has been built and tested. These accomplishments are intermediate steps in a continuing effort to develop low-power-consumption, low-phase-noise, electronically tunable signal generators as local oscillators for heterodyne receivers in submillimeter-wavelength (frequency > 300 GHz) scientific instruments and imaging systems. Submillimeter-wavelength imaging systems are of special interest for military and law-enforcement use because they could, potentially, be used to detect weapons hidden behind clothing and other opaque dielectric materials. In comparison with prior submillimeter- wavelength signal generators, CMOS VCOs offer significant potential advantages, including great reductions in power consumption, mass, size, and complexity. In addition, there is potential for on-chip integration of CMOS VCOs with other CMOS integrated circuitry, including phase-lock loops, analog- to-digital converters, and advanced microprocessors.

Samoska, Lorene↗

Maintaining Stability During a Conducted-Ripple EMC Test

An improved technique, and electronic circuitry to implement the technique, have been developed for a military-standard electromagnetic-compatibility (EMC) test in which one analyzes susceptibility to low-frequency ripple conducted into the equipment under test via a DC power line. In the traditional technique for performing the particular test, the ripple is coupled onto the DC power line via a transformer. Depending upon some design details of the equipment under test, the inductance of the transformer can contribute a degree of instability that results in an oscillation of amplitude large enough to destroy the equipment. It is usually possible to suppress the oscillation by connecting a damping resistor to the primary terminals of the ripple-injection transformer. However, it is important to emphasize the usually in the preceding sentence: sometimes, the resistive damping becomes insufficient to suppress destructive oscillation. In addition, undesirably, the resistor contributes to power dissipation and power demand, and thereby also necessitates the use of a larger ripple voltage amplifier. Yet another disadvantage of the transformer-coupling technique is that the transformer introduces low-frequency distortion of the injected ripple voltage. The improved technique makes it possible to inject ripple with very low distortion at low frequency, without inducing oscillation. In this technique, a transformer is not used: Instead, power is fed to the equipment under test via series power field-effect transistors (FETs) controlled by a summing operational amplifier. One of the inputs to the amplifier controls the DC component of the power-line voltage; the other input, generated by an external oscillator, controls the ripple component. The circuitry for implementing this technique includes panel displays, an internal power supply for the operational amplifier and panel displays, and amplitude controls for the DC and ripple powerline voltage components.

Vorperian, Vatche↗

Energetic particle flux experiment (IMP-F and G)

The technical aspects of the University of California IMP-F experiment aboard the Explorer-34 and the University of California IMP-G (S1) and (S2) experiments aboard the Explorer-41. The experiment detectors and electronics are discussed for each experiment as well as the fabrication, preflight and post-flight history. A description of the ground support equipment is also given for each experiment. These three experiments were essentially all different. The IMP-G experiment was essentially the IMP-F experiment with the addition of four Geiger-Mueller detectors. The IMP-G (S-2) was a supplementary experiment and differed completely from the IMP-F and IMP-G experiments. It was concluded that the ground support equipment approach used for the IMP-F and IMP-G experiments where emphasis was placed on a thorough exercise and monitoring of the experiment operation during various testing phases provided a high degree of confidence and reliability in these experiments. No known electronic failures have occurred during the spacecraft lifetime although some detector problems were experienced.

Anderson, K. A.↗