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NASA NTRS2008

A Temperature Sensor using a Silicon-on-Insulator (SOI) Timer for Very Wide Temperature Measurement

A temperature sensor based on a commercial-off-the-shelf (COTS) Silicon-on-Insulator (SOI) Timer was designed for extreme temperature applications. The sensor can operate under a wide temperature range from hot jet engine compartments to cryogenic space exploration missions. For example, in Jet Engine Distributed Control Architecture, the sensor must be able to operate at temperatures exceeding 150 C. For space missions, extremely low cryogenic temperatures need to be measured. The output of the sensor, which consisted of a stream of digitized pulses whose period was proportional to the sensed temperature, can be interfaced with a controller or a computer. The data acquisition system would then give a direct readout of the temperature through the use of a look-up table, a built-in algorithm, or a mathematical model. Because of the wide range of temperature measurement and because the sensor is made of carefully selected COTS parts, this work is directly applicable to the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program--Jet Engine Distributed Engine Control Task and to the NASA Electronic Parts and Packaging (NEPP) Program. In the past, a temperature sensor was designed and built using an SOI operational amplifier, and a report was issued. This work used an SOI 555 timer as its core and is completely new work.

Patterson, Richard L.↗

NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗

NASA NTRS2023

Assessment of Electrical, Electronic, and Electromechanical (EEE) Parts Copper Wire Bonds for Space Programs

The NASA Electronic Parts and Packaging Program co-manager, requested the NASA Engineering and Safety Center (NESC) to compile a body of publicly available knowledge on copper (Cu) wire bonds and perform reliability testing and analysis on these bonds, including environment tests, sample destructive physical analysis, and bond pull/shear tests during environment test intervals. The goal was to understand the risks of using Cu wire bonds for space applications and develop guidelines on Cu bond pull/shear limits for NASA applications. This document contains the results of the NESC assessment.

Electrical, Electronic, and Electromechanical↗

NASA NTRS2018

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Physics of Failure↗

NASA NTRSDate not supplied

Wide Bandgap Reliability and Application Guidelines

Wide Bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN) have emerged as promising technologies due to the advantages they offer over silicon (Si). Under the NASA Electronic Parts and Packaging (NEPP) Program, Glenn Research Center (GRC) supports a task called "Wide Bandgap Reliability and Application Guidelines." This presentation summarizes the work performed under this task, to be presented at the 2020 NEPP Electronics Technology Workshop in June 2020.

Wide Bandgap Semiconductors↗

NASA NTRS2016

Body of Knowledge for Silicon Carbide Power Electronics

Wide band gap semiconductors, such as silicon carbide (SiC), have emerged as very promising materials for future electronic components due to the tremendous advantages they offer in terms of power capability, extreme temperature tolerance, and high frequency operation. This report documents some issues pertaining to SiC technology and its application in the area of power electronics, in particular those geared for space missions. It also serves as a body of knowledge (BOK) in reference to the development and status of this technology obtained via literature and industry survey as well as providing a listing of the major manufacturers and their capabilities. Finally, issues relevant to the reliability of SiC-based electronic parts are addressed and limitations affecting the full utilization of this technology are identified.

Silicon Carbide Power Electronics↗

NASA NTRSDate not supplied

Shielding Considerations for CubeSat Structures During Solar Maximum

The purpose of this lessons learned is to communicate the utility of shielding in small spacecraft planning for the support of mission assurance and reliability. Numerous SmallSats have been flying in polar low earth orbit for scientific, communications, technology demonstrations, and imaging with academic, commercial, and government interests. Shielding has been part of mission assurance and reliability from the advent of long duration spacecraft missions. The Shields-1 CubeSat has been operating in polar low earth orbit since 16 December 2018 with atomic number (Z)-grade radiation shielding and demonstrates shielding effectiveness. Shields-1 has collected a representative example of solar minimum data in 2019 with 8 Teledyne dosimeters over varying shielding effectiveness. It serves as current experimental data and has been compared with NOVICE Shielding estimates using the AP8 –AE8 trapped radiation model with the Shields-1 CAD and generic CubeSat 3 unit (U) models. Using NOVICE model radiation analysis coding, the shielding effectiveness's, based on a generic CubeSat 3U structure with 4 electronic boards, were estimated for aluminum wall thicknesses ranging from 0.204 cmto4.44 cm (0.550 g/cm2–12.0 g/cm2) thick aluminum. For modeled polar orbiting spacecraft, solar maximum total ionizing dose (TID)increases by nearly a magnitude for thin-walled aluminum 0.550g/cm2-0.686 g/cm2(0.204 cm –0.254 cm) typical CubeSat structures. The shielding effectiveness by NOVICE Sigma estimates, which is a shielding sphere approximation around a detector, showed a linear relationship with wall thickness, which increased over the wall thickness by a ratio of 1.43 determined by linear regression analysis. Using NOVICE Adjoint Monte-Carlo Modeling of solar minimum and solar maximum with the inclusion of a worst-case solar particle event over a one year mission without geomagnetic shielding, the TID for minimum and maximum conditions for a generic 3U with a wall thickness of 0.254 cm is 158 RAD and 1540 RAD, respectively. The modeled total solar maximum TID is over estimated, because at low orbital latitudes a spacecraft will have shielding from Earth's magnetic field. However, TID will still be significant at high latitudes over the poles, where a spacecraft is exposed in a solar particle event. In contrast, to a thin walled generic 3U CubeSat, Shields-1 electronics enclosure has a shielding effectiveness of 21.3 g/cm2from NOVICE Sigma modeling and is expected to show reduced total ionizing dose increases during the present active Solar Cycle 25 period. Because solar particle events during solar maximum increase TID on electronic parts with thin-walled shielding in short periods of time, it is a mission assurance and reliability consideration on the spacecraft’s mission value versus adding shielding for risk reduction of premature spacecraft or instrument payload loss. Since the volumes of many instruments and system electronics have reduced with small spacecraft, shielding material costs and weight penalties have diminished. A small spacecraft project budget and schedule may limit traditional radiation-hardened part use and radiation testing requirements, where shielding can contribute to mission assurance and reliability with reduced costs.

Shields-1↗

NASA NTRSDate not supplied

Shielding Considerations for CubeSat Structures During Solar Maximum

The purpose of this lessons learned paper is to communicate the utility of shielding in small spacecraft planning for the support of mission assurance and reliability. Numerous SmallSats have been flying in polar low Earth orbit for science, communications, technology demonstrations, and imaging with academic, commercial, and government interests. Shielding has been part of mission assurance and reliability from the advent of long duration spacecraft missions. The Shields-1 CubeSat has been operating in polar low Earth orbit since 16 December 2018 with atomic number (Z)-grade radiation shielding and demonstrates shielding effectiveness. Shields-1 has collected a representative example of solar minimum data in 2019 with eight Teledyne µDosimeters over varying shielding effectivenesses. It serves as current experimental data and has been compared with NOVICE Shielding estimates using the AP8 – AE8 trapped radiation model with the Shields-1 CAD and generic CubeSat three unit (3U) models. Using NOVICE model radiation analysis coding, the shielding effectivenesses, based on a generic CubeSat 3U structure with four electronic boards, were estimated for aluminum wall thicknesses ranging from 0.204 cm to 4.44 cm (0.550 g/cm 2 to 12.0 g/cm 2 ). For modeled polar orbiting spacecraft, solar maximum total ionizing dose (TID) increases by nearly a magnitude for thin-walled aluminum 0.550-g/cm 2 - 0.686-g/cm 2 (0.204-cm – 0.254-cm) typical CubeSat structures. The shielding effectiveness estimated by NOVICE Sigma, which is a shielding sphere approximation around a detector, showed a linear relationship with wall thickness, which increased over the wall thickness by a ratio of 1.43 determined by linear regression analysis. Using NOVICE Adjoint Monte-Carlo Modeling of solar minimum and solar maximum with the inclusion of a worst-case solar particle event over a one-year mission without geomagnetic shielding, the TID for minimum and maximum conditions for a generic 3U with a wall thickness of 0.254 cm is 158 RAD and 1540 RAD, respectively. The modeled total solar maximum TID is over estimated, because at low orbital latitudes a spacecraft will have shielding from the Earth’s magnetic field. However, TID will still be significant at high latitudes over the poles, where a spacecraft is exposed in a solar particle event. In contrast to a thin-walled generic 3U CubeSat, the Shields-1 electronics enclosure has a shielding effectiveness of 21.3 g/cm 2 from NOVICE Sigma modeling and is expected to show reduced total ionizing dose increases during the present active Solar Cycle 25 period. Because solar particle events during solar maximum increase TID on electronic parts with thin-walled shielding in short periods of time, it is a mission assurance and reliability consideration on the mission value of the spacecraft versus adding shielding for risk reduction of premature spacecraft or instrument payload loss. Since the volumes of many instruments and system electronics have reduced with small spacecraft, shielding material costs and weight penalties have diminished. A small spacecraft project budget and schedule may limit traditional radiation-hardened part use and radiation testing requirements, where shielding can contribute to mission assurance and reliability with reduced costs.

Shields-1↗

NASA NTRS2005

Reliability of Electronics for Cryogenic Space Applications Being Assessed

Many future NASA missions will require electronic parts and circuits that can operate reliably and efficiently in extreme temperature environments below typical device specification temperatures. These missions include the Mars Exploration Laboratory, the James Webb Space Telescope, the Europa Orbiter, surface rovers, and deep-space probes. In addition to NASA, the aerospace and commercial sectors require cryogenic electronics in applications that include advanced satellites, military hardware, medical instrumentation, magnetic levitation, superconducting energy management and distribution, particle confinement and acceleration, and arctic missions. Besides surviving hostile space environments, electronics capable of low-temperature operation would enhance circuit performance, improve system reliability, extend lifetime, and reduce development and launch costs. In addition, cryogenic electronics are expected to result in more efficient systems than those at room temperature.

Patterson, Richard L.↗

NASA NTRS1974

Reliability inputs to Mariner 9 data explosion

This paper describes the prelaunch and post-launch reliability functions which contributed to the success of the Mariner 9 spacecraft. Examples are included to illustrate how each reliability activity was a vital part of each phase of the project. Prelaunch reliability functions included: (1) establishing, negotiating, and monitoring system and subsystem requirements, (2) participating in spacecraft system and subsystem design/hardware reviews, (3) monitoring preparation of failure mode effects and criticality analyses (FMECA), (4) establishing and managing a problem failure reporting (PFR) system for the spacecraft and its support equipment, (5) monitoring electronic parts activities, and (6) participating in spacecraft reviews. Particular emphasis is placed on mission operations reliability assurance activities, which included: (1) spacecraft problem/failure reporting, (2) managing an integrating failure reporting system which covered all mission operations activities, (3) real-time analysis of spacecraft anomalies, and (4) risk assessment.

Macgregor, D. S.↗

NASA NTRS2014

MSFC/EV44 Natural Environment Capabilities

The Natural Environments Branch at Marshall Space Flight Center is an integral part of many NASA satellite and launch vehicle programs, providing analyses of the space and terrestrial environments that are used for program development efforts, operational support, and anomaly investigations. These capabilities include model development, instrument build and testing, analysis of space and terrestrial related data, spacecraft charging anomaly investigations, surface and internal charging modeling, space environment definition, and radiation assessments for electronic parts. All aspects of space and terrestrial design are implemented with the goal of devising missions that are successful from launch to operations in the space environment of LEO, polar, GEO, and interplanetary orbits.

NeergaardParker, Linda↗

NASA NTRS2020

Body of Knowledge for Gallium Nitride Power Electronics

Gallium nitride (GaN), a wide bandgap (WBG) semiconductor, has emerged as a very promising material for electronic components due to the tremendous advantages it offers compared to silicon (Si), such as power capability, extreme temperature tolerance, and high frequency operation. This report serves as a body of knowledge (BOK) in reference to the development and current status of GaN technology obtained via literature and industry surveys. It provides a listing of the major manufacturers and their capabilities, as well as government, industry, and academic parties interested in the technology. The document also discusses GaN’s applications in the area of power electronics, in particular those geared for space missions. Finally, issues relevant to the reliability of GaN-based electronic parts are addressed and limitations affecting the full utilization of this technology are identified. This BOK focuses mainly on power applications for GaN, but will also briefly mention radio frequency (RF) applications for completeness.

Gallium Nitride Power Electronics↗

NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗

NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗

NASA NTRS2014

MSFC/EV44 Natural Environment Capabilities

The Natural Environments Branch at Marshall Space Flight Center is an integral part of many NASA satellite and launch vehicle programs, providing analyses of the space and terrestrial environments that are used for program development efforts, operational support, and anomaly investigations. The space environment capabilities of the Natural Environments Branch at MSFC will be presented. These capabilities include model development, analysis of space and terrestrial related data, spacecraft charging anomaly investigations, surface charging modeling (e.g., Nascap-2k), space environment definition and radiation assessments for electronic parts. All aspects of space and terrestrial design are implemented with the goal of devising missions that are successful from launch to operations in the space environment of LEO, polar, GEO, and interplanetary orbits. We will show examples of recent applications of branch capabilities to NASA missions.

Parker, L. Neergaard↗

NASA NTRS2010

FPGA NEPP : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for re-programmable field programmable gate arrays (FPGAs). The FY09 task was divided into three efforts: 1. Device physics-based design modifications 2. Contention study of Xilinx Virtex-4 3. IDDQ study of Actel A54SX The FY09 NEPP FPGA study was organized into these three sections in recognition of the continued and increasing importance of FPGAs to NASA. FPGAs represent the state of the art in electronic components with millions and millions of transistors integrated into a single device. Modern NASA spacecraft design has dozens and dozens of FPGAs implemented onboard. FPGAs are used in critical command and data handling, instrument control and monitoring, and communications protocols, to name just a few. The reliability of FPGAs is fundamental to mission success for NASA.

Sheldon, Douglas↗

NASA NTRS2014

Single-Event Effects in Silicon and Silicon Carbide Power Devices

NASA Electronics Parts and Packaging program-funded activities over the past year on single-event effects in silicon and silicon carbide power devices are presented, with focus on SiC device failure signatures.

heavy-ion single-event effects↗

NASA NTRS2011

Pulsed Laser System to Simulate Effects of Cosmic Rays in Semiconductor Devices

Spaceflight system electronic devices must survive a wide range of radiation environments with various particle types including energetic protons, electrons, gamma rays, x-rays, and heavy ions. High-energy charged particles such as heavy ions can pass straight through a semiconductor material and interact with a charge-sensitive region, generating a significant amount of charge (electron-hole pairs) along their tracks. These excess charges can damage the device, and the response can range from temporary perturbations to permanent changes in the state or performance. These phenomena are called single event effects (SEE). Before application in flight systems, electronic parts need to be qualified and tested for performance and radiation sensitivity. Typically, their susceptibility to SEE is tested by exposure to an ion beam from a particle accelerator. At such facilities, the device under test (DUT) is irradiated with large beams so there is no fine resolution to investigate particular regions of sensitivity on the parts. While it is the most reliable approach for radiation qualification, these evaluations are time consuming and costly. There is always a need for new cost-efficient strategies to complement accelerator testing: pulsed lasers provide such a solution. Pulsed laser light can be utilized to simulate heavy ion effects with the advantage of being able to localize the sensitive region of an integrated circuit. Generally, a focused laser beam of approximately picosecond pulse duration is used to generate carrier density in the semiconductor device. During irradiation, the laser pulse is absorbed by the electronic medium with a wavelength selected accordingly by the user, and the laser energy can ionize and simulate SEE as would occur in space. With a tightly focused near infrared (NIR) laser beam, the beam waist of about a micrometer can be achieved, and additional scanning techniques are able to yield submicron resolution. This feature allows mapping of all of the sensitive regions of the studied device with fine resolution, unlike heavy ion experiments. The problematic regions can be precisely identified, and it provides a considerable amount of information about the circuit. In addition, the system allows flexibility for testing the device in different configurations in situ.

Aveline, David C.↗