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Data from the scientific payload, OSTA 1, is available. Images of the Earth's surface taken from the Shuttle Imaging Radar-A were processed, and can be obtained in the form of photographic prints, negatives, or positive transparencies. Magnetic tapes containing data for the ocean color experiment and the Shuttle multispectral infrared radiometer are also available.
During this phase of the cathode development program, SRI improved the multiple electron beam exposure system used to print hole patterns for the cathode arrays, studied anisotropic etch processes, conducted cathode investigations using an emission microscope, reviewed possible alternate materials for cathode fabrication, studied cathode storage techniques, conducted high power operation experiments, and demonstrated high-current-density operation with small arrays of tips.
This index of NACA Technical Publications covers the NACA research reports issued in the period of July 1956 through June 1957. It is the sixth supplement to the basic 1915-1949 Index. The research reports issued prior to July 1956 which have been declassified since that date have also been included. A list of these reports may be found on pages 243-244. Cards for this list may be discarded as entries for them are included in this Index. Current announcement of newly declassified materials is regularly made in the NACA Research Abstracts and Reclassification Notice. The arrangement of this Index follows: (1) Explanatory chart of NACA publications series designations, (2) outline of subject classification system, (3) chronological list of NACA reports under each subject classification, (4) list of reports declassified from July 1956 through June 1957, (5) alphabetical index to subject categories, and (6) author index. Entries included herein duplicate in part the information of the index cards furnished with the individual research reports. Recipients maintaining card files may wish to discard those index cards on hand for unclassified research reports issued during the July 1956-June 1957 period. Such cards were printed on yellow stock for easy identification in the discard process. Please note that some classified reports issued during the July-December 1956 period are included in the yellow stock area. Therefore care must be taken to avoid destroying such cards. Newly available research reports are currently announced in the NACA Research Abstracts and Reclassification Notice and are normally available for a period of five years after announcement. Most of the older research reports (those issued prior to July 1952) are thus available on a "loan only" basis within the United states.
Additive manufacturing (AM) has unique process attributes that facilitate the creation of optimized, complex, and unique parts for aerospace applications. However, the multi-scale and complicated building process for AM parts can cause unexpected build conditions that result in microstructural variability within the deposited material. The need for richer datasets and computational modeling capabilities to improve AM process reliability is a consequence of this microstructural variability. A computational approach, referred to as the Additive Manufacturing Moment Measure (AM3), addresses this need by leveraging the way AM processes fuse material in precise, incremental steps. During the layering sequence, each previous step contributes to the condition of the current step at the center of the heat source. The precise steps can be selected to systematically create a time-space point field with co-located machine input and in-situ sensor data. The sequential nature of the AM process, coupled with nearest neighbor calculations, allows for a fully parallel computation for part-scale build profile analysis. The AM3 concept introduced here enables part-scale assessment directly from build files and in-situ process monitoring sensors alike. The AM moment measures were calculated for build point fields and compared with co-located in-situ and ex-situ nondestructive evaluation and optical microscopy observations. These comparisons permit a better understanding of how the sequential process actions can affect the quality of a laser powder bed fusion (LPBF) build. Details of the AM3technique will be discussed and compared to measured LPBF part characteristics. The AM3 results indicate a strong potential to advance the qualification process for aerospace applications.
Selective laser melting (SLM) is a metal additive manufacturing process that has several advantages such as the large range of metal materials that can be accommodated, 3D printing of complex shape components, the ability to adjust material properties, and cost reduction as expensive production equipment may not be required. Therefore, process monitoring is crucial in different stages of the component building. In this work, convolutional neural networks (CNNs) are investigated as a suitable technique for post-inspection of builds. The monitoring of manufactured parts was conducted by collecting computed tomography (CT) images and identifying defects. Five CNN models were implemented and tested for the classification of the CT images. The models were based on NASNetMobile and DenseNet121, and a custom built CNN model. The results of this work show that CNNs can be feasible and reliable for rapid monitoring and classification of defects in CT images from build fabrication using SLM.
The optimization, evaluation, and demonstration of a solar cell metallization system is discussed. Screen printing, air firing, reducted atmospheres, and conductive air coating were studied.
A process sequence is described which utilizes a preformed metal mesh electrostatically bonded to each cell to provide the front contact. Cells of 12 percent AM1 efficiency have been produced using this scheme. This method also permits access to both contacts on the cell from the back side. In addition, low cost cell interconnection is accomplished using a flexible 'printed circuit' sheet which is ultrasonically bonded to the cell contacts. The complete process sequence as well as automated equipment which also uses ion implantation and pulse annealing is described. The total cost for module fabrication is estimated at $0.64 per peak watt for a 30 MW/year plant.
NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.
Space missions rely utterly on metallic components, from the spacecraft to electronics. Yet, metals add mass, and electronics have the additional problem of a limited lifespan. Thus, current mission architectures must compensate for replacement. In space, spent electronics are discarded; on earth, there is some recycling but current processes are toxic and environmentally hazardous. Imagine instead an end-to-end recycling of spent electronics at low mass, low cost, room temperature, and in a non-toxic manner. Here, we propose a solution that will not only enhance mission success by decreasing upmass and providing a fresh supply of electronics, but in addition has immediate applications to a serious environmental issue on the Earth. Spent electronics will be used as feedstock to make fresh electronic components, a process we will accomplish with so-called 'urban biomining' using synthetically enhanced microbes to bind metals with elemental specificity. To create new electronics, the microbes will be used as 'bioink' to print a new IC chip, using plasma jet electronics printing. The plasma jet electronics printing technology will have the potential to use martian atmospheric gas to print and to tailor the electronic and chemical properties of the materials. Our preliminary results have suggested that this process also serves as a purification step to enhance the proportion of metals in the 'bioink'. The presence of electric field and plasma can ensure printing in microgravity environment while also providing material morphology and electronic structure tunabiity and thus optimization. Here we propose to increase the TRL level of the concept by engineering microbes to dissolve the siliceous matrix in the IC, extract copper from a mixture of metals, and use the microbes as feedstock to print interconnects using mars gas simulant. To assess the ability of this concept to influence mission architecture, we will do an analysis of the infrastructure required to execute this concept on Mars, and additional opportunities it could offer mission design from the biological and printing technologies. In addition, we will do an analysis of the impact of this technology for terrestrial applications addressing in particular environmental concerns and availability of metals.
As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.
Additive manufacturing (AM) enables low-cost, lightweight, and geometrically flexible antennas for rapid deployment missions. This work reports a left-hand circularly polarized magneto-electric dipole printed on a Radix dielectric with inkjet silver metallization and demonstrated as a process replacement for NASA weather-balloon RF hardware. By combining substrate fabrication and metallization, AM provides value for unrecoverable or field-replaceable systems. A physics based verification workflow links AM-specific material behavior to electromagnetic performance and yields bounded total, radiation, and mismatch efficiencies. Standard surface-impedance and roughness models failed to reproduce the frequency-dependent radiation loss observed in printed inks, underscoring the need for AM-specific conductor parameterization. Mission testing confirmed TDRSS link closure from NASA’s Columbia Scientific Balloon Facility and validated a repeatable print–measure–fly workflow for bounding RF performance and qualifying AM antennas for field use.
Additive manufacturing (AM) enables low-cost, lightweight, and geometrically flexible antennas for rapid deployment missions. This work reports a left-hand circularly polarized magneto-electric dipole printed on a Radix dielectric with inkjet silver metallization and demonstrated as a process replacement for NASA weather-balloon RF hardware. By combining substrate fabrication and metallization, AM provides value for unrecoverable or field-replaceable systems. A physics based verification workflow links AM-specific material behavior to electromagnetic performance and yields bounded total, radiation, and mismatch efficiencies. Standard surface-impedance and roughness models failed to reproduce the frequency-dependent radiation loss observed in printed inks, underscoring the need for AM-specific conductor parameterization. Mission testing confirmed TDRSS link closure from NASA’s Columbia Scientific Balloon Facility and validated a repeatable print–measure–fly workflow for bounding RF performance and qualifying AM antennas for field use.
The report is presented in four sections: The Introduction describes the duplicating configuration under evaluation and the Background contains a chronological description of the evaluation segmented by phases 1 and 2. This section includes the evaluation schedule, printing and duplicating requirements, storage and communication requirements, electronic publishing system configuration, existing processes and proposed processes, billing rates, costs and productivity analysis, and the return on investment based upon the data gathered to date. The third section contains the phase 1 comparative cost and productivity analysis. This analysis demonstrated that LaRC should proceed with a 90-day evaluation of the DocuTech and follow with a phase 2 cycle to actually demonstrate that the proposed system would meet the needs of LaRC's printing and duplicating requirements, benchmark results, cost comparisons, benchmark observations, and recommendations. These are documented after the recommendations.
Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.
A technique is proposed for the semi-automatic digitization of topographic maps using a vidicon camera interfaced with a mini-computer system. The required input is a black and white map that shows only contour lines and corresponding elevation values such as the advance prints of 7.5 minute USGS topographic sheets. A set of image processing algorithms is implemented on an image of the contour map acquired by a vidicon camera. The system developed performs extraction of contour lines, tagging elevation values and subsequent interpolation of elevations to produce, in 5 sec. x 5 sec. intervals of latitude and longitude, digital elevation matrices. The interpolation of elevations for non-contour points is achieved using a steepest descent algorithm. A communications capability allows the final data to be transferred over telephone lines to an off-site unit such as the floppy disk or a micro-computer.
Program-development time decreased while program quality increased. FORTRAN Programming Tools are series of programming tools used to support development and maintenance of FORTRAN 77 source codes. Included are debugging aid, central-processing-unit time-monitoring program, source-code maintenance aids, print utilities, and library of useful, well-documented programs. Tools assist in reducing development time and encouraging high-quality programming. Although intended primarily for FORTRAN programmers, some tools used on data files and other programming languages. Written in FORTRAN 77.
The Wave Propagation Lab. has completed the design and construction of a microprogrammable radar controller for atmospheric wind profiling. Unlike some radar controllers using state machines or hardwired logic for radar timing, this design is a high speed programmable sequencer with signal processing resources. A block diagram of the device is shown. The device is a single 8 1/2 inch by 10 1/2 inch printed circuit board and consists of three main subsections: (1) the host computer interface; (2) the microprogram sequencer; and (3) the signal processing circuitry. Each of these subsections are described in detail.
Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this work describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this research are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.