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At least 217 records · Page 12

Development of sputtered techniques for thrust chambers

The 0.152 cm thick sputtered and copper deposits were electron beam welded to wrought copper. Tensile specimens were machined from the weld assemblies and tested at room temperature. Tensile strength approached the strength of wrought material. Elongations up to 25% were measured. Sputtered aluminum was used to fill 0.157 cm wide by 0.127 cm deep grooves in thrust chamber spool piece liners. The liners were closed out by sputtering copper from post and hollow cathodes.

Mullaly, J. R.↗

Ion beam sputtering of fluoropolymers

Etching and deposition of fluoropolymers are of considerable industrial interest for applications dealing with adhesion, chemical inertness, hydrophobicity, and dielectric properties. This paper describes ion beam sputter processing rates as well as pertinent characteristics of etched targets and films. An argon ion beam source was used to sputter etch and deposit the fluoropolymers PTFE, FEP, and CTFE. Ion beam energy, current density, and target temperature were varied to examine effects on etch and deposition rates. The ion etched fluoropolymers yield cone or spire-like surface structures which vary depending upon the type of polymer, ion beam power density, etch time, and target temperature. Also presented are sputter target and film characteristics which were documented by spectral transmittance measurements, X-ray diffraction, ESCA, and SEM photomicrographs.

Sovey, J. S.↗

Industrial potential, uses, and performance of sputtered and ion plated films

The sputtering and ion plating technology is reviewed in terms of potential, uses, and performance. Sputtering is not regulated by classical thermodynamics and Gibb's phase rule relationships, thus eliminating the restrictions for materials combinations, and consequently making possible tailoring of coatings in any preferred chemical combination. The future of sputtered and ion plated films for industrial applications is expected to depend primarily on greater comprehension of materials selection, and the utilization of the proper deposition parameters.

Spalvins, T.↗

Sputtering - Its relationship to isotopic fractionation on the lunar surface

Silicon, oxygen, sulfur and, possibly, potassium show systematic enrichment of heavier isotopes with increasing soil maturity, probably as a result of solar-wind sputtering, but such a pattern is not exhibited by solar wind-implanted species. Apparently sputter-erosion is not penetrating to their implantation depth, about 200 A. This suggests that sputtering on the moon is being impeded by deposition of vapor condensate following meteoritic impact. Although neither secular variation in the isotopic composition at the source of regolith carbon, probably the solar wind, nor isotopic fractionation of carbon after implantation in the regolith can be ruled out, carbon isotope systematics currently yield no evidence in support of either process.

Kerridge, J. F.↗

Possible isotopic fractionation effects in sputtered minerals

A model which makes definite predictions for the fractionation of isotopes in sputtered material is discussed. The fractionation patterns are nonlinear, and the pattern for a particular set of isotopes depends on the chemical matrix within which those isotopes are contained. Calculations are presented for all nonmonoisotopic elements contained in the minerals perovskite, anorthite, ackermanite, enstatite, and troilite. All isotopes are fractionated at the level of approximately 4-6 deg/o per atomic mass unit. Oxygen is always positively fractionated (heavier isotopes sputtered preferentially), and heavier elements are generally negatively fractioned (light isotopes sputtered preferentially). The value of Delta (O-18:O-16) is always less by about 1.8 deg/o than a linear extrapolation based upon the calculated delta (O-17:O-16) value would suggest. The phenomenon of both negative and positive fractionation patterns from a single target mineral are used to make an experimental test of the proposed model.

Haff, P. K.↗

A sputtered zirconia primer for improved thermal shock resistance of plasma sprayed ceramic turbine seals

The development of plasma-sprayed yttria stabilized zirconia (YSZ) ceramic turbine blade tip seal components is discussed. The YSZ layers are quite thick (0.040 to 0.090 in.). The service potential of seal components with such thick ceramic layers is cyclic thermal shock limited. The most usual failure mode is ceramic layer delamination at or very near the interface between the plasma sprayed YSZ layer and the NiCrAlY bondcoat. Deposition of a thin RF sputtered YSZ primer to the bondcoat prior to deposition of the thick plasma sprayed YSZ layer was found to reduce laminar cracking in cyclic thermal shock testing. The cyclic thermal shock life of one ceramic seal design was increased by a factor of 5 to 6 when the sputtered YSZ primer was incorporated. A model based on thermal response of plasma sprayed YSZ particles impinging on the bondcoat surface with and without the sputtered YSZ primer provides a basis for understanding the function of the primer.

Bill, R. C.↗

Hydrogenated amorphous silicon deposited by ion-beam sputtering

Hydrogenated amorphous silicon films 1/2 to 1 micron thick were deposited on metal and glass substrates using ion-beam sputtering techniques. The 800 eV, 2 mA/sq cm beam was a mixture of argon and hydrogen ions. The argon sputtered silicon from a pure (7.6 cm) single crystal wafer, while the hydrogen combined with the sputtered material during the deposition. Hydrogen to argon pressure ratios and substrate temperatures were varied to minimize the defect state density in the amorphous silicon. Characterization was done by electrical resistivity, index of refraction and optical absorption of the films.

Lowe, V. E.↗

Electron reflection and secondary emission characteristics of sputter-textured pyrolytic graphite surfaces

Measurements are presented of secondary electron emission and reflected primary electron characteristics of sputter-textured pyrolitic graphite surfaces with microstructures of various sizes and densities, made with an Auger cylindrical mirror analyzer in a high-vacuum chamber at pressures below 1.33 x 10 to the -7th N/sq m (10 to the -9th torr). A dense, tall, thin, spire-like microstructure, obtained at ion energies of 1000 eV and ion current densities of 5 mA/sq cm, is the most effective. The secondary electron emission from such a surface is lower than that of soot, whose secondary emission is among the lowest of any material. At a primary electron energy of 1000 eV, the secondary electron emission yield of smooth CU is about 350% greater than the lowest value obtained for sputter-textured pyrolitic graphite. The reflected primary electron index of smooth Cu is a factor of 80 greater. If the secondary electron emission yield is reduced to 0.3, which is possible with sputter-textured pyrolitic graphite, the traveling wave tube collector efficiency could be improved by as much as 4% over that for smooth copper.

Wintucky, E. G.↗

Solar wind sputtering effects in the atmospheres of Mars and Venus

It is found through an investigation, combining Monte Carlo simulations and analytical techniques, of the direct collisional interaction of an energetic particle flux with the neutral components of a planetary atmosphere, that solar wind sputtering could provide an important exospheric mass sink on both Mars and Venus under appropriate conditions. The computed rates of helium loss in the Venusian atmosphere and of carbon, nitrogen and oxygen in the Martian atmosphere imply that sputtering would have a significant effect on the noble gas budget of Venus and dominate the chemical and photochemical loss processes of Mars. Because of diffusive separation of lighter elements and isotopes, and because the gravitational binding energy is proportional to the mass, the erosion process preferentially removes the lighter components of the atmosphere. Solar wind sputtering could therefore compete with other erosion mechanisms in generating substantial fractionation effects.

Watson, C. C.↗

Effect of Ion Sputtering on Interface Chemistry and Electrical Properties of an Gaas (100) Schottky Contacts

Auger and electron photoelectron spectroscopy were used to measure the extent of As depletion during 1 keV to 5 keV argon sputtering of GaAs surfaces. This depletion was correlated with a general decrease in the barrier height of the rectifying Au contact deposited in situ. However, nondestructive angle resolved XPS measurements showed As was depleted at the outer surface more by 1 keV than 3 keV argon. These effects are explained based on a combined work effective work function model and creation of a donor like surface damage layer. The donor layer was correlated with As depletion by sputtering. Deep level trap formation and annealing of sputtering effects were studied.

Wang, Y. X.↗

Sputtering as a Technique for Applying Tribological Coatings

Friction and wear induced mechanical failures may be controlled to extend the life of tribological components through the interposition of selected solid materials between contacting surfaces. Thin solid films of soft and hard materials are appropriate to lower friction and enhance the wear resistance of precision tribo-elements. Thin film coating technologies that have been developed may be used to interpose thin solid layers between contacting surfaces to reduce friction or to extend wear life. Film deposition technologies developed include chemical vapor deposition (CVD) and physical vapor deposition (PVD). Sputter coating is a PVD process for thin film deposition. It allows close control of coating thickness and composition and is well-suited for the deposition of tribological coatings. In this paper, the utility of magnetron sputtering for the deposition of tribological coatings is examined. Experimental results obtained when coated bodies are tested under a number of tribological operating conditions are presented. It is shown that when film adhesion problems are resolved, sputtering can be an effective means of depositing tribological coatings.

S Ramalingam↗

Sputtering of the gallium-indium eutectic alloy in the liquid phase

Watson and Haff (1980) have discussed a theory which is designed to explain quantitatively isotopic fractionation effects observed during sputtering of simple or complex targets. This theory is based on the assumption that most of the atoms sputtered from a surface originate in the top monolayer. The present investigation is mainly concerned with a direct experimental test of that assumption. The sputtering of both solid and liquid phases of gallium, indium, and the gallium-indium eutectic alloy is studied. Results obtained with the aid of ion scattering and Auger spectroscopy show that, in agreement with rough theoretical expectations, the surface monolayer of a gallium-indium alloy with 16.5 percent indium in bulk contains more than 94 percent indium, while the next layer can be only slightly enriched.

Dumke, M. F.↗

Sputtering processes - Erosion and chemical change

Laboratory data and models of sputter-induced erosion and chemical alterations in ice films are reviewed and the results are applied to icy grains and satellites exposed to magnetospheric ion bombardment. It is shown that the source of the plasma in the inner magnetosphere of Saturn is likely to be the sputter erosion of the icy objects in this region and the sputter erosion and possible stabilization of the E-ring are considered. Ion-induced polymerization is discussed as a source of the darkened rings of Uranus.

Johnson, R. E.↗

Sputtered cadmium oxide as a surface pretreatment for graphite solid lubricant films

Sputtered films of cadmium oxide were applied to sand blasted AISI 440C HT stainless steel disks as a surface pretreatment for the application of rubbed graphite films. Mixtures of cadmium oxide and graphite were applied to the nonpretreated sandblasted metal and evaluated. The results were compared to graphite films applied to other commercially available surface pretreatments. It is found that sputtered CdO pretreated surfaces increase the endurance lives of the graphite films and decrease the counterface steady state wear rate of the pins almost an order of magnitude compared to commercially available pretreatments. The CdO additions in general improved the tribological properties of graphite. The greatest benefit occurred when it was applied to the substrate rather than mixing it with the graphite and that sputtered films of CdO perform much better than rubbed CdO films.

Fusaro, R. L.↗

Substrate heating rates for planar and cylindrical-post magnetron sputtering sources

Results are presented for the substrate heating energy/atom required in the planar magnetron sputtering of Al, Cr, Ni, Cu, Mo, In, Ta, W, and Pt in Ar, as well as Al and Cr in O2. Data are also obtained for cylindrical magnetron sputtering of Nb, Ag, Ta, W, and Pb-Sn in Ar, and Mo sputtered in Ne, Ar, Kr, and Xe. Planar and cylindrical magnetron heating rates were comparable. Special experiments were conducted to examine the contributions to substrate heating of plasma species and ion neutralization and reflection at the cathode; the results obtained indicate that charged plasma species do not significantly contribute to the heating, but that neutralized and reflected ions play a significant role in the planar as well as cylindrical cases despite the differences in cathode geometry.

Thornton, J. A.↗

Highly conducting ZnSe films by reactive magnetron sputtering

This paper presents the results of an effort to deposit high-conductivity ZnSe on glass and conducting SnO2-coated glass substrates by reactive magnetron sputter deposition, using pure metal sputter targets of Zn and dopants such as In, Ga, and Al. Clear yellow ZnSe films were successfully obtained. By using substrate temperatures as low as 150 C, cosputtered dopants, and sputter parameters and H2Se injection rates which maximize the Zn-to-Se ratio in the films, ZnSe bulk resistivities have been lowered by up to seven orders of magnitude, reaching values as low as 20 ohm cm. The most effective dopant to data has been In, cosputtered with Zn in amounts leading to In atomic concentrations as high as 1.4 percent. Atomic-absorption measurements show an average 49.9/48.9 ratio of Zn to Se.

Nouhi, A.↗

ITO/InP solar cells: A comparison of devices fabricated by ion beam and RF sputtering of the ITO

This work was performed with the view of elucidating the behavior of indium tin oxide/indium phosphide (ITO/InP) solar cells prepared by RF and ion beam sputtering. It was found that using RF sputter deposition of the ITO always leads to more efficient devices than ion beam sputter deposition. An important aspect of the former technique is the exposure of the single crystal p-InP substrates to a very low plasma power prior to deposition. Substrates treated in this manner have also been used for ion beam deposition of ITO. In this case the cells behave very similarly to the RF deposited cells, thus suggesting that the lower power plasma exposure (LPPE) is the crucial process step.

Coutts, T. J.↗

Magnetospheric plasma sputtering of Io's atmosphere

Neutral coronae due to magnetospheric ion sputtering from the exobase are generated, and ion and neutral injection into the plasma torus are calculated, on the assumption of the existence of an atmosphere on Io and a consideration of that atmosphere's various possible characteristics. Through the inclusion of the sputtered atmospheric corona that emerges from an assumed unattenuated incident ion flux, it becomes possible to satisfy the supply rate to the torus with an exobase that is close to the surface; such an exobase would imply that the Io atmosphere is insufficiently robust to support a fully dissociated corona, and that a significant fraction of the incident plasma ions can penetrate to the surface to furnish a sputter source of atmospheric gas.

Mcgrath, M. A.↗