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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12

Using the System Complexity Metric (SCM) to Compare CO2 Reduction Systems

A fundamental cause of difficulty in large engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, where there is no obvious mental model that correctly predicts its behavior. Higher system complexity is usually associated with higher cost and higher failure rate. Complexity is perceived if a system has many diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and unanticipated failure modes. Identifying and removing these signs of complexity should improve performance and reduce the cost and failure rate. Complexity can be directly measured by the number of components and their interactions. The System Complexity Metric (SCM) is defined as the sum of the number of parts in a system, N, plus the number of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of the system block diagram. SCM can be used to compare systems and to guide their redesign to reduce cost and failure rate. Carbon dioxide reduction systems are analyzed using SCM, cost, and failure rate. As in previous work, cost is directly proportional to SCM and that failure rate increases as a power of SCM for large differences in SCM. The SCM ranking of carbon dioxide reduction systems is the same as their ranking in detailed analysis and practice.

Harry W. Jones↗

An integrated database with system optimization and design features

A customized, mission-specific relational database package was developed to allow researchers working on the Mars oxygen manufacturing plant to enter physical description, engineering, and connectivity data through a uniform, graphical interface and to store the data in formats compatible with other software also developed as part of the project. These latter components include an optimization program to maximize or minimize various criteria as the system evolves into its final design; programs to simulate the behavior of various parts of the plant in Martian conditions; an animation program which, in different modes, provides visual feedback to designers and researchers about the location of and temperature distribution among components as well as heat, mass, and data flow through the plant as it operates in different scenarios; and a control program to investigate the stability and response of the system under different disturbance conditions. All components of the system are interconnected so that changes entered through one component are reflected in the others.

Arabyan, A.↗

Intentional Collaboration & Innovation Spaces at NASA

Collaboration and Innovation (C&I) are extremely popular terms in corporate jargon, and institutions with reputations for creativity often have clever and fun spaces set aside for hatching ideas and developing products or services. In and of themselves, a room full of "collaboration furniture" and electronics can't make C&I happen, any more than oil makes a gas or diesel engine run. As with the engine, though, quality lubrication is a huge factor in the smooth operation, power, and longevity of C&I activity. This paper describes spaces deliberately set up at numerous NASA field centers to support collaborative and creative thinking and processes. (Sometimes support is not so much a matter of doing things to spark discussion as it is removing constraints imposed by traditional settings and making information sharing as easy as possible.) Some spaces are rooms or suites dedicated to C&I, with significant electronic support and/or intentional lack thereof (to emphasize the human element). Others are small, comfortable "roosting places" that invite conversations of opportunity. Descriptions include the sponsoring organization, underlying goals and philosophies, lessons learned, and opportunities to excel. There is discussion about how such areas might interconnect within centers, across NASA, and with external entities using current technology and what tools and approaches may be in our future.

Scott, David W.↗

Applying the System Complexity Metric (SCM)

A fundamental cause of difficulty in larger engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, so that there is no obvious mental model that correctly predicts its behavior. Higher complexity is usually associated with higher cost and higher failure rate. Complexity is indicated by a system having more and diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and often the emergence of unanticipated failure modes. Identifying and removing these signs of complexity should reduce complexity and improve performance. Here we limit complexity measurement to the number of components and their interactions. A System Complexity Metric (SCM) is defined as equal to the sum of the number of parts in a system, N, plus the sum of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of system block diagrams. Previous work found that life support system cost was directly proportional to SCM and that failure rate increased faster than SCM squared. SCM can be used to compare systems or to guide their redesign to reduce cost and failure rate. Carbon dioxide removal systems will be analyzed using SCM, cost, and failure rate.

Harry W Jones↗

Quantitative simulation of extraterrestrial engineering devices

This is a multicomponent, multidisciplinary project whose overall objective is to build an integrated database, simulation, visualization, and optimization system for the proposed oxygen manufacturing plant on Mars. Specifically, the system allows users to enter physical description, engineering, and connectivity data through a uniform, user-friendly interface and stores the data in formats compatible with other software also developed as part of this project. These latter components include: (1) programs to simulate the behavior of various parts of the plant in Martian conditions; (2) an animation program which, in different modes, provides visual feedback to designers and researchers about the location of and temperature distribution among components as well as heat, mass, and data flow through the plant as it operates in different scenarios; (3) a control program to investigate the stability and response of the system under different disturbance conditions; and (4) an optimization program to maximize or minimize various criteria as the system evolves into its final design. All components of the system are interconnected so that changes entered through one component are reflected in the others.

Arabyan, A.↗

Eleven Countries, an Integrated Spacecraft: the Story of International Collaboration that Built the Orion Spacecraft and Powered the Success of the Artemis I Mission

The quest to return humans to the Moon in the next step towards humanity's exploration of space is more alive than ever. After a great deal of achievements, failures, and lessons learned, the Artemis I mission set o to the Moon on November 16, 2022, with the goal of testing a new rocket, the Space Launch System, and a new spacecraft, Orion: designed, assembled, and tested across two continents, and 11 countries. Behind this mission, decades of experience with the International Space Station, Autonomous Transfer Vehicle operations, and many other program collaborations built the know-how on how to succeed together in the toughest environment | deep space. The Artemis I mission proved to be an incredible success, meeting 161 total mission objectives, including 21 developed during the flight based on outperforming spacecraft. It was also a case-study in international collaboration, given that ESA, NASA, and industry partners Airbus and Lockheed Martin for the first time had to design, build, test, and fly a fully integrated human-rated spacecraft, with most critical functions dependent and interconnected across U.S. and European systems. The U.S.-built Orion Crew Module and Crew Module Adapter and European-built European Service Module (ESM) shared critical interfaces and commodities, from propulsion, avionics, active/passive thermal, electrical power generation, storage and distribution to the software that managed it all. In this paper, we will describe relevant aspects of the integrated spacecraft design, providing context for the challenges that the team faced in all phases required to get Orion ready to fly, and provide a direct account of how the joint team formed, trained, and supported the operations of the successful Artemis I mission. We will also explore the evolution of the partnerships, given that these allow a multi-national e ort to sustain the program production, share costs, leverage a broader base of engineering expertise, and build more diverse capabilities over the long haul to support the Artemis goals and objectives. Lastly, we will cover critical lessons learned and how the Orion Program has implemented these in preparation of the next Artemis missions to repeat the success of Artemis I. The purpose of this paper is to document knowledge we gained and lessons we learned through the development of an integrated Orion spacecraft, since it is imperative we build on this now, at the dawn of the Artemis Program, an international endeavor to push human space exploration.

Deep Space Exploration↗

Drag reduction strategies

previously a description was given of an active control scheme using wall transpiration that leads to a 15% reduction in surface skin friction beneath a turbulent boundary layer, according to direct numerical simulation. In this research brief further details of that scheme and its variants are given together with some suggestions as to how sensor/actuator arrays could be configured to reduce surface drag. The research which is summarized here was performed during the first half of 1994. This research is motivated by the need to understand better how the dynamics of near-wall turbulent flow can be modified so that skin friction is reduced. The reduction of turbulent skin friction is highly desirable in many engineering applications. Experiments and direct numerical simulations have led to an increased understanding of the cycle of turbulence production and transport in the boundary layer and raised awareness of the possibility of disrupting the process with a subsequent reduction in turbulent skin friction. The implementation of active feedback control in a computational setting is a viable approach for the investigation of the modifications to the flow physics that can be achieved. Bewley et al. and Hill describe how ideas from optimal control theory are employed to give 'sub-optimal' drag reduction schemes. The objectives of the work reported here is to investigate in greater detail the assumptions implicit within such schemes and their limitations. It is also our objective to describe how an array of sensors and actuators could be arranged and interconnected to form a 'smart' surface which has low skin friction.

Hill, D. Christopher↗

Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

Gorlick, Michael M.↗

N -Terminal Octylated Peptoid Hydrogels as 3D-Printable Cell Scaffolds and Proteolytically Robust Cargo Depots

Supramolecular hydrogels that mimic the extracellular matrix (ECM) represent promising materials for tissue engineering and drug delivery. However, conventional hydrogels formed via the self-assembly of natural or synthetic building blocks often face a trade-off between biological functionality and biochemical stability, limiting their utility in long-term or protease-rich environments. Peptoids, a class of peptide-inspired, sequence-defined polymers, offer a compelling alternative due to their exceptional proteolytic resistance and bioactivity. Despite this potential, the development of supramolecular peptoid hydrogels has been hindered by the absence of backbone hydrogen bond donors, which limits long-range ordering necessary for efficient hydrogel formation. This work describes a short peptoid functionalized at the N-terminus with an octyl chain that readily self-assembles into hydrogels. Hydrophobic interactions among pendant octyl groups promote directional peptoid packing into highly ordered nanosheets, which interconnect to form a porous hydrogel network. These hydrogels exhibit tunable viscoelasticity, shear-thinning, and self-healing properties, enabling their use as inks for extrusion-based 3D printing. They support NIH-3T3 fibroblast adhesion, spreading, and proliferation, maintaining greater than 95% cell viability over 4 days. Moreover, the hydrogels retain their macroscopic integrity under protease-rich conditions, enabling sustained cargo release and uniform cellular uptake. Together, this study demonstrates a class of supramolecular peptoid hydrogelators that integrate biocompatibility, 3D printability, and proteolytic stability, providing a versatile platform for ECMmimetic scaffolds in regenerative medicine and long-term therapeutic delivery.

cargo delivery↗

Innovative Comparison of Transient Ignition Temperature at the Booster Interface, New Stainless Steel Pyrovalve Primer Chamber Assembly "V" (PCA) Design Versus the Current Aluminum "Y" PCA Design

An assessment of four spacecraft pyrovalve anomalies that occurred during ground testing was conducted by the NASA Engineering & Safety Center (NESC) in 2008. In all four cases, a common aluminum (Al) primer chamber assembly (PCA) was used with dual NASA Standard Initiators (NSIs) and the nearly simultaneous (separated by less than 80 microseconds) firing of both initiators failed to ignite the booster charge. The results of the assessment and associated test program were reported in AIAA Paper AIAA-2008-4798, NESC Independent Assessment of Pyrovalve Ground Test Anomalies. As a result of the four Al PCA anomalies, and the test results and findings of the NESC assessment, the Mars Science Laboratory (MSL) project team decided to make changes to the PCA. The material for the PCA body was changed from aluminum (Al) to stainless steel (SS) to avoid melting, distortion, and potential leakage of the NSI flow passages when the device functioned. The flow passages, which were interconnected in a Y-shaped configuration (Y-PCA) in the original design, were changed to a V-shaped configuration (V-PCA). The V-shape was used to more efficiently transfer energy from the NSIs to the booster. Development and qualification testing of the new design clearly demonstrated faster booster ignition times compared to the legacy AL Y-PCA design. However, the final NESC assessment report recommended that the SS V-PCA be experimentally characterized and quantitatively compared to the Al Y-PCA design. This data was deemed important for properly evaluating the design options for future NASA projects. This test program has successfully quantified the improvement of the SS V-PCA over the Al Y-PCA. A phase B of the project was also conducted and evaluated the effect of firing command skew and enlargement of flame channels to further assist spacecraft applications.

Saulsberry, Regor L.↗

SpaceCube v2.0 Space Flight Hybrid Reconfigurable Data Processing System

This paper details the design architecture, design methodology, and the advantages of the SpaceCube v2.0 high performance data processing system for space applications. The purpose in building the SpaceCube v2.0 system is to create a superior high performance, reconfigurable, hybrid data processing system that can be used in a multitude of applications including those that require a radiation hardened and reliable solution. The SpaceCube v2.0 system leverages seven years of board design, avionics systems design, and space flight application experiences. This paper shows how SpaceCube v2.0 solves the increasing computing demands of space data processing applications that cannot be attained with a standalone processor approach.The main objective during the design stage is to find a good system balance between power, size, reliability, cost, and data processing capability. These design variables directly impact each other, and it is important to understand how to achieve a suitable balance. This paper will detail how these critical design factors were managed including the construction of an Engineering Model for an experiment on the International Space Station to test out design concepts. We will describe the designs for the processor card, power card, backplane, and a mission unique interface card. The mechanical design for the box will also be detailed since it is critical in meeting the stringent thermal and structural requirements imposed by the processing system. In addition, the mechanical design uses advanced thermal conduction techniques to solve the internal thermal challenges.The SpaceCube v2.0 processing system is based on an extended version of the 3U cPCI standard form factor where each card is 190mm x 100mm in size The typical power draw of the processor card is 8 to 10W and scales with application complexity. The SpaceCube v2.0 data processing card features two Xilinx Virtex-5 QV Field Programmable Gate Arrays (FPGA), eight memory modules, a monitor FPGA with analog monitoring, Ethernet, configurable interconnect to the Xilinx FPGAs including gigabit transceivers, and the necessary voltage regulation. The processor board uses a back-to-back design methodology for common parts that maximizes the board real estate available. This paper will show how to meet the IPC 6012B Class 3A standard with a 22-layer board that has two column grid array devices with 1.0mm pitch. All layout trades such as stack-up options, via selection, and FPGA signal breakout will be discussed with feature size results. The overall board design process will be discussed including parts selection, circuit design, proper signal termination, layout placement and route planning, signal integrity design and verification, and power integrity results. The radiation mitigation techniques will also be detailed including configuration scrubbing options, Xilinx circuit mitigation and FPGA functional monitoring, and memory protection.Finally, this paper will describe how this system is being used to solve the extreme challenges of a robotic satellite servicing mission where typical space-rated processors are not sufficient enough to meet the intensive data processing requirements. The SpaceCube v2.0 is the main payload control computer and is required to control critical subsystems such as autonomous rendezvous and docking using a suite of vision sensors and object avoidance when controlling two robotic arms.

Xilinx FPGA↗

Evaluation of Open Cell Foam Heat Transfer Enhancement for Liquid Rocket Engine

As NASA pursues the exploration mission, advanced propulsion for the next generation of spacecraft will be needed. These new propulsion systems will require higher performance and increased durability, despite current limitations on materials. A break-through technology is needed in the thrust chamber. In this paper the idea of using a porous metallic foam is examined for its potential cooling enhancement capabilities. The goal is to increase the chamber wall cooling without creating an additional pressure drop penalty. A feasibility study based on experiments at laboratory-scale conditions was performed and analysis at rocket conditions is underway. In the experiment, heat transfer and pressure drop data were collected using air as the coolant in a copper or nickel foam filled annular channel. The foam-channel performance was evaluated based on comparison with conventional microchannel cooling passages under equal pressure drop conditions. The heat transfer enhancement of the foam channel over the microchannel ranges from 130% to 172%. The enhancement is relatively independent of the pressure drop and increases with decreasing pore size. A direct numerical simulation model of the foam heat exchange has been built. The model is based on the actual metal foam microstructure of thin ligaments (0.2- 0.3 mm in diameter) that form a network of interconnected open-cells. The cell dimension is around 2 mm. The numerical model was built using the FLUENT CFD code. Comparison of the pressure drop results predicted by the current model with those experimental data of Leong and Jin [8] shows favorable comparisons. Pressure drop predictions have been made using hydrogen as a coolant at typical rocket conditions. Conjugate heat transfer analysis using the foam filled channel is planned for the future.

Chung, J. N.↗

The Design and Evaluation of Zero Trust Architecture for Electric Vehicle Charging Infrastructure: EVs @ Scale Series on EV Charging Station Cybersecurity

Implementing a zero trust architecture can significantly bolster the security of electric vehicle (EV) charging infrastructure. EV charging infrastructure includes numerous networked interfaces, each of which can present potential vulnerabilities. When these vulnerabilities are exploited, they can compromise the entire system, leading to severe operational and security risks. Zero trust is a security model that operates on the principle of "never trust, always verify," which helps manage the attack surface and limit the scope of any potential compromises. Fundamentally, this model ensures that no entity, whether inside or outside the network, is trusted by default. The design principles of zero trust include continuous verification, strict deny-by-default access controls, and micro-segmentation. Continuous verification ensures that every request is thoroughly checked, regardless of its origin. Strict access controls enforce the principle of least privilege, allowing users and devices only the minimum necessary access to perform their functions. Micro-segmentation involves dividing the network into smaller, isolated segments to prevent lateral movement in case of a breach. In the context of EV charging infrastructure, zero trust can be implemented through various strategies. For example, multi-factor authentication (MFA) can be required for engineers to access the management interfaces and control systems of charging stations. Real-time monitoring and analysis of network traffic can help detect and respond to anomalies. Systems that do not need to communicate with each other can be micro-segmented to enhance security. All communications should adhere to predefined policies to be permitted. Additionally, encrypting communications can protect sensitive information exchanged between chargers and management systems. This paper presents a zero trust architecture specifically designed for EV charging infrastructure. Implementing zero trust not only mitigates risks but also builds a resilient infrastructure capable of withstanding and quickly recovering from cyber threats. The architecture addresses six defined security objectives. A comprehensive test plan is developed to assess the architecture against these objectives, and the results of the evaluation are reported. This approach is essential for maintaining the reliability and integrity of EV charging services in an increasingly interconnected and vulnerable digital landscape. This is the first in a planned series of papers exploring the implementation of zero trust in EV charging infrastructure. Each paper will delve into different aspects and applications of zero trust, highlighting how various work processes and requirements can lead to distinct architectural designs. These architectures will be tailored to address specific security challenges and operational needs within the EV charging ecosystem, ensuring a robust and adaptable security framework.

33 ADVANCED PROPULSION SYSTEMS↗

Integrated Hydrogen Energy System Testing/Validation: Cooperative Research and Development Final Report, CRADA Number CRD-21-18272

Through the ARIES platform, this proposed project aims to bridge a gap and utilize the power hardware-in-the-loop (PHIL) and controller hardware-in-the-loop (CHIL) experiments and create open-source interconnection and interoperability information that can aid in faster and cheaper installation and operation of grid forming fuel cell inverters.

08 HYDROGEN↗

Edge ML for CAN bus intrusion detection in AVs

Autonomous Vehicles (AVs) are revolutionizing transportation, but their reliance on interconnected cyber-physical systems exposes them to unprecedented cybersecurity risks. This study addresses the critical challenge of detecting real-time cyber intrusions in self-driving vehicles by leveraging a dataset from the Udacity self-driving car project. We simulate four high-impact attack vectors, Denial of Service (DoS), spoofing, replay, and fuzzy attacks, by injecting noise into spatial features (e.g., bounding box coordinates) to replicate adversarial scenarios. We develop and evaluate two lightweight neural network architectures (NN-1 and NN-2) alongside a logistic regression baseline (LG-1) for intrusion detection. The models achieve exceptional performance, with NN-2 attaining an AUC score of 93.15% and 93.15% accuracy, demonstrating their suitability for edge deployment in AV environments. Through explainable AI techniques, we uncover unique forensic fingerprints of each attack type, such as spatial corruption in fuzzy attacks and temporal anomalies in replay attacks, offering actionable insights for feature engineering and proactive defense. Visual analytics, including confusion matrices, ROC curves, and feature importance plots, validate the models' robustness and interpretability. This research sets a new benchmark for AV cybersecurity, delivering a scalable, field-ready toolkit for Original Equipment Manufacturers (OEMs) and policymakers. By aligning intrusion fingerprints with SAE J3061 automotive security standards, we provide a pathway for integrating machine learning into safety-critical AV systems. Our findings underscore the urgent need for security-by-design AI, ensuring that AVs not only drive autonomously but also defend autonomously. This work bridges the gap between theoretical cybersecurity and life-preserving engineering, offering a leap toward safer, more secure autonomous transportation.

97 MATHEMATICS AND COMPUTING↗

The Heterogeneous Integration of Electronic Components

Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry.

42 ENGINEERING↗

Impact of hydrogenation on the stability and mechanical properties of amorphous boron nitride

Abstract Interconnect materials with ultralow dielectric constant, and good thermal and mechanical properties are crucial for the further miniaturization of electronic devices. Recently, it has been demonstrated that ultrathin amorphous boron nitride (aBN) films have a very low dielectric constant, high density (above 2.1 g cm −3 ), high thermal stability, and mechanical properties. The excellent properties of aBN derive from the nature and degree of disorder, which can be controlled at fabrication, allowing tuning of the physical properties for desired applications. Here, we report an improvement in the stability and mechanical properties of aBN upon hydrogen doping. With the introduction of a Gaussian approximation potential for atomistic simulations, we investigate the changing morphology of aBN with varying H doping concentrations. We found that for 8 at% of H doping, the concentration ofsp 3 -hybridized atoms reaches to a maximum which leads to an improvement of thermal stability and mechanical properties by 20%. These results will be a guideline for experimentalists and process engineers to tune the growth conditions of aBN films for numerous applications.

Materials Science↗

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗