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Printed-circuit process produces ordnance-initiated start/stop switches. Method is faster and less costly than fabriction by hand, and produces switches of uniform quality.
Components and techniques which may be useful in the electronics industry are described. Topics discussed include transducer technology, printed-circuit technology, solid state devices, MOS transistors, Gunn device, microwave antennas, and position indicators.
Segmented insulated test bar speeds up patch distributor paddle-pin test. Device eliminates need to disconnect cables or remove distributor. Printed circuit cable and connector reduces weight on bar, adding to tester portability.
Various applications of interactive computer graphics to the following areas of science and engineering were described: design and analysis of structures, configuration geometry, animation, flutter analysis, design and manufacturing, aircraft design and integration, wind tunnel data analysis, architecture and construction, flight simulation, hydrodynamics, curve and surface fitting, gas turbine engine design, analysis, and manufacturing, packaging of printed circuit boards, spacecraft design.
A sample module was assembled to model a portion of a flexible extendable solar array, a type that promises to become the next generation of solar array design. The resulting study of this module is intended to provide technical support to the array designer for lightweight component selection, specifications, and tests. Selected from available lightweight components were 127-micron-thick wrap-around contacted solar cells, 34- micron-thick sputtered glass covers, and as a substrate a 13-micron-thick polyimide film clad with a copper printed circuit. Each component displayed weaknesses. The thin solar cells had excessive breakage losses. Sputtered glass cover adhesion was poor, and the covered cell was weaker than the cell uncovered. Thermal stresses caused some cell delamination from the model solar array substrate.
A prototype Space Shuttle Main Engine (SSME) Thrust Vector Control (TVC) Actuator analog model was successfully completed. The prototype, mounted on five printed circuit (PC) boards, was delivered to NASA, checked out and tested using a modular replacement technique on an analog computer. In all cases, the prototype model performed within the recording techniques of the analog computer which is well within the tolerances of the specifications.
The design requirements for a Programmable Data Communications Controller (PDCC) that reduces the difficulties in attaching data terminal equipment to a computer are presented. The PDCC is an interface between the computer I/O channel and the bit serial communication lines. Each communication line is supported by a communication port that handles all line control functions and performs most terminal control functions. The port is fabricated on a printed circuit board that plugs into a card chassis, mating with a connector that is joined to all other card stations by a data bus. Ports are individually programmable; each includes a microprocessor, a programmable read-only memory for instruction storage, and a random access memory for data storage.
Standard nylon screws act as coil form copper wire laid down in spiral thread. Completed coil may be bonded to printed-circuit board. However, it is impossible to tune coil by adjusting spacing between windings, technique sometimes used with air-core coils.
Guide helps design engineers determine total cost of fabricating electronic equipment. It contains tables of "factors" for determining costs associated with fabrication. "Standards" section includes estimations of time required for procedures ranging from machining, to wiring, to printed-circuit board fabrication.
Vented enclosure is made from lightweight metal. Printed-circuit boards are attached to bottom and end bulkheads and to top cover. Airflow cools components indirectly through walls of inner compartment. Flammability and smoke tests demonstrate safety of enclosure.
Continuous-feeding machine automatically bonds solar cells to printed-circuit substrate. In completed machine, cells move to test station where electrical characteristics could be checked. If performance of cell is below specifications, that cell is marked and removed. All machine functions are synchronized by electronics located within unit. It may help to lower costs in future solar-cell production.
Gage monitors riveting forces applied when components are mounted on printed-circuit boards. Correct swaging pressures have been established for specific substrate materials such as phenolics and ceramics.
The use of computer generated, reflection holograms in conjunction with high power lasers for precision machining of metals and ceramics was investigated. The Reflection holograms which were developed and made to work at both optical wavelength (He-Ne, 6328 A) and infrared (CO2, 10.6) meet the primary practical requirement of ruggedness and are relatively economical and simple to fabricate. The technology is sufficiently advanced now so that reflection holography could indeed be used as a practical manufacturing device in certain applications requiring low power densities. However, the present holograms are energy inefficient and much of the laser power is lost in the zero order spot and higher diffraction orders. Improvements of laser machining over conventional methods are discussed and addition applications are listed. Possible uses in the electronics industry include drilling holes in printed circuit boards making soldered connections, and resistor trimming.
In the present work, which consists of adapting a magnetic suspension densimeter for use at pressures up to 350 bars, a differential capacitance sensor is developed for use in the servosystem of a magnetic suspension densimeter for detecting the position of a magnetic buoy. This type of sensor has not been used previously in magnetic suspension densimeters. Its design, performance, and advantages are outlined. A cutaway drawing and a schematic diagram of the capacitance sensor and magnetic buoy are presented and described. The concentric-disk design of the sensor capacitor plates and the high degree of symmetry which results from the printed circuit fabrication approach minimize the sensor sensitivity to lateral displacement of the buoy and to the dielectric constant of the surrounding medium. A high-power microscope is necessary to monitor the position of the buoy relative to the support coil.
IC printed-circuit board tester measures resistance as low as 0.1 ohm but uses little power. Two 4.7 kilohm resistors and connected transistors prevent current flow through operational amplifier until probe circuit is complete, eliminating need for on/off switch. Zener diode in series with amplifier output prevents audio oscillator operation until output has sufficient amplitude. Circuit utilizes 741 operational amplifier on 11.2 volt battery or lower voltage amplifiers.
The feasibility of using charge transfer devices in the classification of multispectral imagery was investigated by evaluating particular devices to determine their suitability in matrix multiplication subsystem of a pattern classifier and by designing a protype of such a system. Particular attention was given to analog-analog correlator devices which consist of two tapped delay lines, chip multipliers, and a summed output. The design for the classifier and a printed circuit layout for the analog boards were completed and the boards were fabricated. A test j:g for the board was built and checkout was begun.
Conventional pressure switch, fabricated by printed-circuit manufacturing techniques, can indicate when charge on battery departs from preset level. Membrane on switch is exposed to internal pressure of battery, which varies according to stored charge. When pressure varies from preset level, switch can turn on a light-emitting diode or similar indicator to warn user that battery is low.
CADAT printed-wiring-board system (PWB) designs printed-circuit and hybrid-circuit boards. It is comprised of four programs: preprocessor, placement program, organizer program, and the router. Component placement and interconnection paths are optimized.