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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

3D Printed Ceramic Reinforced Polymer Composites Microstructure and Mechanical Properties

In Fused Filament Fabrication (FFF) 3D printing a part is made by extruding material layer by layer. Benefits of FFF are the ability to print complex shapes quickly and at a lower cost compared to other manufacturing methods. In this work, filaments composed of either silicon carbide (SiC) or zirconium silicate ceramic particulates in a polylactic-acid (PLA) matrix were used to print specimens for microstructural analysis and mechanical testing. Pure PLA samples were also printed and tested as a baseline for comparison. A Design of Experiments approach was used to test the interactions between three different parameters and their effect on ultimate strength, Young’s modulus, and yield strength. For compression test specimens, these parameters were infill percentage, number of shells, and print orientation angle. For tensile test specimens, the parameters were layer height, number of shells, and infill orientation angle. Pre- and post-compression test samples were evaluated by scanning electron microscopy for microstructural analysis. Infill percentage had the greatest effect on mechanical properties while number of shells and print orientation angle had minor effects. When changing the layer lines from perpendicular to parallel, relative to the loading direction, SiC-PLA had higher mechanical properties while pure PLA properties had decreased, and zirconium silicate-PLA had mix results.

Fused filament fabrication↗
NASA NTRS2015

International Space Station (ISS) 3D Printer Performance and Material Characterization Methodology

In order for human exploration of the Solar System to be sustainable, manufacturing of necessary items on-demand in space or on planetary surfaces will be a requirement. As a first step towards this goal, the 3D Printing In Zero-G (3D Print) technology demonstration made the first items fabricated in space on the International Space Station. From those items, and comparable prints made on the ground, information about the microgravity effects on the printing process can be determined. Lessons learned from this technology demonstration will be applicable to other in-space manufacturing technologies, and may affect the terrestrial manufacturing industry as well. The flight samples were received at the George C. Marshall Space Flight Center on 6 April 2015. These samples will undergo a series of tests designed to not only thoroughly characterize the samples, but to identify microgravity effects manifested during printing by comparing their results to those of samples printed on the ground. Samples will be visually inspected, photographed, scanned with structured light, and analyzed with scanning electron microscopy. Selected samples will be analyzed with computed tomography; some will be assessed using ASTM standard tests. These tests will provide the information required to determine the effects of microgravity on 3D printing in microgravity.

Bean, Q. A.↗
DOE OSTI2026

Scalable Upcycling of Spent Lithium-Ion Battery Anodic Graphite to Electronic-Grade Graphene

Recycling processes for lithium-ion batteries (LIBs) are imperative to support the sustainable growth of global energy storage systems. This study introduces a scalable method for the upcycling of spent graphite anodes from LIBs to produce electronic-grade graphene nanoplatelets. In addition to comprehensive materials characterization, the electronic quality of the upcycled graphene is demonstrated by formulating it into a screen printing ink that achieves high-resolution patterning and thin-film electrical conductivity exceeding 104 S m−1. This screen printing ink is also used to print planar micro-supercapacitors with exceptional areal capacitance (1.78 mF cm−2), areal energy density (0.247 µWh cm−2), and cycling stability (> 10 000 cycles). Life cycle assessment (LCA) and techno-economic analysis (TEA) highlight the environmental benefits and cost reductions attainable through upcycling of graphite from LIBs. By capturing economic value from spent LIBs, this work fosters a sustainable battery supply chain and provides an abundant and geographically distributed raw material for electronic-grade graphene.

energy storage↗
NASA NTRS1986

LANDSAT imagery of the Central Andes

The central Andes of South America extend from approximately 14 deg. S to 28 deg. S as an unbroken chain of mountains and volcanoes over 2000 km long. It is here that the Nazca plate dives under the South American plate at angles varying from 10 deg to 30 deg. Very little is known about the volcanoes comprising this classic, subduction-type plate margin. A catalogue of the volcanoes in the central Andes is being prepared by Dr. P.W. Francis and Dr. C.A. Wood at the NASA Lunar and Planetary Institute. At present, more than 800 volcanoes of Cenozoic age have been recognized in the chain, with an estimated 75-80 major, active Quarternary volcanoes. Approximately one hundred 1536 x 1536 pixel color composite Optronics positives were produced from six full LANDSAT Thermatic Mapper scenes and three partial TM scenes. These positives cover a large portion of the central Andes. The positives were produced from LANDSAT data using the VAX imaging package, LIPS. The scenes were first transferred from magnetic tape to disk. The LIPS package was then used to select volcanically interesting areas which were then electronically enhanced. Finally, the selected areas were transferred back to tape and printed on the Optronics equipment. The pictures are color composites using LANDSAT TM bands 7,4, and 2 in the red, green, and blue filters, respectively.

Komer, C. A.↗
NASA NTRS1991

Industrial Applications of Graphite Fluoride Fibers

Based on fluorination technology developed during 1934 to 1959, and the fiber technology developed during the 1970s, a new process was developed to produce graphite fluoride fibers. In the process, pitch based graphitized carbon fibers are at first intercalated and deintercalated several times by bromine and iodine, followed by several cycles of nitrogen heating and fluorination at 350 to 370 C. Electrical, mechanical, and thermal properties of this fiber depend on the fluorination process and the fluorine content of the graphite fluoride product. However, these properties are between those of graphite and those of PTFE (Teflon). Therefore, it is considered to be a semiplastic. The physical properties suggest that this new material may have many new and unexplored applications. For example, it can be a thermally conductive electrical insulator. Its coefficient of thermal expansion (CTE) can be adjusted to match that of silicon, and therefore, it can be a heat sinking printed circuit board which is CTE compatible with silicon. Using these fibers in printed circuit boards may provide improved electrical performance and reliability of the electronics on the board over existing designs. Also, since it releases fluorine at 300 C or higher, it can be used as a material to store fluorine and to conduct fluorination. This application may simplify the fluorination process and reduce the risk of handling fluorine.

Hung, Ching-Cheh↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
DOE OSTI2025

Ionic‐Liquid Free and Flexible Transistors Made of 2D Material Inks

The development of thin-film transistors (TFTs) using 2D materials is crucial for enabling scalable, low-cost, and flexible electronics. Currently, 2D TFTs with the highest performance have been achieved by using ionic-liquid gating (ILG), a technique suited for proof-of-concept studies. However, ILG suffers from slow switching speeds, temperature sensitivity, poor long-term stability, and integration challenges, making it unsuitable for practical use. Moreover, typical fabrication methods for 2D TFTs involve harsh conditions such as strong acids or high temperatures (>300 °C), limiting integration with flexible substrates. This work provides the first demonstration of an ILG-free, all-2D-material TFT fabricated onto a flexible substrate. Water-based graphene and hexagonal boron nitride (h-BN) inks are printed to deposit the electrodes and dielectric layers, respectively. The MoS 2 channel is produced via supramolecular interfacial self-assembly, yielding uniform, monolayer-rich films transferable to rigid and flexible substrates. The resulting TFTs operate below 3 V, exhibit negligible leakage current, and achieve field-effect mobilities up to 0.46 cm 2 V −1 s −1 (rising to 2.47 cm 2 V −1 s −1 with silver electrodes) measured under ambient conditions, while maintaining excellent mechanical flexibility. This work establishes a low-cost and scalable solution-processable platform for flexible electronics based on 2D materials that match requirements for practical applications.

2D materials↗
DOE OSTI2024

Tailoring Piezoelectricity of 3D Printing PVDF-MoS 2 Nanocomposite via In Situ Induced Shear Stress

3D printing of unique structures with tunable properties offers significant advantages in the fabrication of complex and customized electronic devices. Here, this study introduces a process-microstructure–property-guided manufacturing route to fabricate PVDF-2D MoS 2 piezoelectric nanocomposites with tunable piezoelectric properties without having a postprocess. We control PVDF’s microstructure through direct ink writing (DIW) 3D printing while tuning PVDF-MoS 2 interfacial strain by controlling rheology and 3D printing parameters, such as nozzle size and printing speed. Our approach demonstrates tunable piezoelectricity in PVDF-MoS 2 , achieving a 15-fold increase in the piezoelectric coefficient (d 33 ) at a printing-induced shear stress of 6685 Pa. This enhancement arises from the electrostatic interactions between PVDF and MoS 2 and the filler distribution and alignment caused by the in situ shear stress in 3D printing, as confirmed by XPS and Raman mapping analyses. Our findings advance the understanding of piezoelectric mechanisms in PVDF-based nanocomposites, laying the foundation for 3D printing of piezoelectric sensors in wearable device applications with enhanced performance and customization capabilities.

2D MoS2↗
NASA NTRS2023

Additive Manufacturing of Oxide Dispersion Strengthened Multi Principle Element Alloys for Future Aerospace Applications

Oxide Dispersion Strengthened (ODS) materials have long been of interest for their high temperature applications, and additive manufacturing enables their manufacturing viability. The ODS multi-principle element alloy NiCoCr was prepared using powder metallurgy techniques, additively manufactured, and evaluated for its processingmicrostructure-property relationships. The high temperature foundations of nickel-base superalloys and ODS materials were combined with the manufacturing advantages of 3D printing and the chemical simplicity of NiCoCr to inspire this work, which was divided into powder and printed material assessments. The project was achieved through multiple iterative project loops to assess the processing parameters’ impact on the microstructure and mechanical properties of the feedstock powder and printed material. The powder investigations (Chapter 3) focused on understanding the oxide coating that formed on the metal powder following acoustic mixing. Time of Flight Secondary Ion Mass Spectrometry was used to semi-quantitatively assess the amount of yttrium on the surface of the mixed powders, and indicated that a combination of higher mixing condition energy and moderate mixing time resulted in the most oxide coating on the NiCoCr powder. The results were supported by a qualitative assessment of scanning electron images of coated powder particles. Following mixing, the ODS NiCoCr was consolidated by Laser Powder Bed Fusion. The evaluations of the printed material (Chapter 4) frst considered screening experiments including Archimedes’ density, porosity, and grain size and number metrics from electron backscatter diffraction data. After the ideal additive manufacturing parameters were identifed, both the oxide homogeneity and yield strength were discussed for the idealized printed material. Overall, the project suggests that the combined use of qualitative or semi-quantitative powder surface analysis with Archimedes’ density analyses can be a valid high-throughput technique which can lead to process optimization of Laser Powder Bed Fusion additively manufactured ODS material.

Laura G Wilson↗
NASA NTRS2006

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗
NASA NTRS1977

Connector with cable-to-chassis strain relief

Electronic connector adapted from readily available components simplifies electronic packaging and interconnection wiring in assemblies that consist of several identical printed-wiring boards.

Tuskind, K. W.↗
NASA NTRS1997

Structural Design and Analysis of a Light-Weight Laminated Composite Heat Sink for Spaceflight PWBs

In order to reduce the overall weight in spaceborne electronic systems, a conventional metallic heat sink typically used for double-sided printed wiring boards was suggested to be replaced by light-weight and high-strength laminated composite materials. Through technology validation assurance (TVA) approach, it has been successfully demonstrated that using laminated composite heat sink can not only reduce the weight of the heat sink by nearly 50%, but also significantly lower the internal thermally-induced stresses that are largely responsible for potential delamination under cyclic temperature variations. With composite heat sink, both thermal and dynamic performance of the double-sided printed wiring board (PWB) exceeds that of its counterpart with metallic heat sink. Also included in this work is the original contribution to the understanding of creep behavior of the worst-case leadless chip carrier (LCC) surface mount solder joint. This was identified as the interconnection most susceptible to thermal fatigue damage in the PWB assembly.

Fan, Mark S.↗
DOE OSTI2026

Space Cooling: Recovery, Reuse, Recycling and Supply Chain Impacts

The global cooling sector has undergone tremendous growth in recent years, and cooling demand is projected to double or triple by 2050. Surging air conditioning demand will continue to be driven by increased populations, incomes and occurrences of extreme heat and humidity events. Cooling equipment growth has important pollution and material implications as they are made up of critical metals and precious raw materials - including ferrous metals, copper, aluminum and printed circuit boards composed of copper, silver, gold and palladium - that generate significant electronic waste at end-of-life. Air conditioning equipment also contains fluorinated gas (F-gas) refrigerants, which are potent gases that are thousands of times more heat-trapping than carbon dioxide (CO2). While recovery, reuse, and recycling strategies have been assessed for cold chain and refrigeration, there is currently limited analysis on how these strategies could be adopted for the global space cooling industry and potential supply chain implications. This paper aims to address this research gap by qualitatively evaluating product and material recovery, reuse and recycling frameworks from both demand and supply-side perspectives and with the support of cooling-specific case studies. It also focuses on quantitatively assessing potential energy, emissions and resource benefits of such strategies for space cooling equipment. This paper first analyzes how existing recovery, reuse and recycling frameworks can be applied to space cooling, with emphasis on the demand-side enablers (e.g., innovative business models, supporting policies and regulations) and changes in supply-side production network throughout the supply chain (e.g., design, production and distribution, end-of-life recovery) needed to overcome existing barriers. It will present case studies of innovative business models for space cooling technologies, including reuse and recycling, and how effective refrigerant reclamation and recovery programs have been operationalized. Lastly, the paper will highlight global modeling results of energy, emissions and material recovery from scenario analysis of selected strategies for air conditioners. The findings of this paper are intended to inform the development of product and material recovery, reuse and recycling strategies for a rapidly growing stock of space conditioning equipment by addressing existing organizational, economic and regulatory barriers and potential supply-chain bottlenecks.

Khanna, Nina↗
NASA NTRS2014

Deducing Electronic Unit Internal Response During a Vibration Test Using a Lumped Parameter Modeling Approach

During random vibration testing of electronic boxes there is often a desire to know the dynamic response of certain internal printed wiring boards (PWBs) for the purpose of monitoring the response of sensitive hardware or for post-test forensic analysis in support of anomaly investigation. Due to restrictions on internally mounted accelerometers for most flight hardware there is usually no means to empirically observe the internal dynamics of the unit, so one must resort to crude and highly uncertain approximations. One common practice is to apply Miles Equation, which does not account for the coupled response of the board in the chassis, resulting in significant over- or under-prediction. This paper explores the application of simple multiple-degree-of-freedom lumped parameter modeling to predict the coupled random vibration response of the PWBs in their fundamental modes of vibration. A simple tool using this approach could be used during or following a random vibration test to interpret vibration test data from a single external chassis measurement to deduce internal board dynamics by means of a rapid correlation analysis. Such a tool might also be useful in early design stages as a supplemental analysis to a more detailed finite element analysis to quickly prototype and analyze the dynamics of various design iterations. After developing the theoretical basis, a lumped parameter modeling approach is applied to an electronic unit for which both external and internal test vibration response measurements are available for direct comparison. Reasonable correlation of the results demonstrates the potential viability of such an approach. Further development of the preliminary approach presented in this paper will involve correlation with detailed finite element models and additional relevant test data.

random vibration response↗
DOE OSTI2024

Integrated Traction Drive Thermal Management: Keystone Project 3

The presentation represents a report of accomplishments during FY 2024 and is prepared for 2024 DOE VTO Annual Merit Review. The project goal is identifying pathways enabling high-performance, compact, and reliable integrated electric drives and facilitation of achieving DOE 2025 target of 33 kW/L system power density for an electric traction drive through support of other EDT consortium members in design and development of thermal management systems for their respective integrated drive concepts. Specific objectives are: 1) research and evaluation of motor-integrated power electronics packaging technologies and thermal management approaches; 2) explore novel materials and manufacturing options (3D printing with thermally enhanced polymers or ceramic materials) for key thermal management system components; 3) develop thermal management system and its sub-components to enable integrated electric drive DOE power density targets in collaboration with project partners; 4) support activities of DOE's Electric Drive Technologies (EDT) consortium members, Oak Ridge National Laboratory (ORNL), University of Wisconsin and Georgia Tech research teams in thermal management component design and thermal modeling of their integrated traction drives.

ADVANCED PROPULSION SYSTEMS↗
NASA NTRSDate not supplied

On-Demand Manufacturing of Electronics

The On-Demand Manufacturing of Electronics (ODME) project develops materials, processes, and device designs to enable electronics, sensors, and semiconductors to be produced in microgravity environments. The demonstration of these technologies provides a pathway for space-based manufacturing of circuits, wearables, energy storage devices, and other electronics. This has facilitated the terrestrial production of devices including a wide range of sensors, printed batteries, and circuits that are additively manufactured using techniques available on the Advanced Toolplate System (ATS). Recent parabolic flight campaigns conducted with the ATS suggest that direct ink write (DIW) technology is suitable for depositing functional material inks in reduced gravity environments. The development of the Advanced Toolplate system also includes several other new tools, including miniaturized versions of the direct write head, fused filament fabrication head, micro-mill, component pick & place head, and two newly developed deposition technologies, the Electrohydrodynamic (EHD) inkjet head (for semiconductors), and the Electrodeposition head (for high performance circuits). These experiments are designed to compare processing and material behavior in zero gravity versus ground-based data for validation of microgravity advantages and de-risking of future orbital demonstrations of these technologies. The ability to conduct experiments in microgravity is a pivotal step in enabling electronic manufacturing technology in space for both terrestrial and deep space applications.

Cadre Francis↗