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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12
All sourcesNASA NTRSDOE OSTI
NASA NTRS2020

Comparing Cumulative Flight Thermal Fatigue to Ground Test Results for Memory Components on the Mars Curiosity Rover

This paper explores the methods used to examine Mars Curiosity Rover’s flight temperature data to the Package Qualification and Verification (PQV) accelerated thermal cycle life test data in response to flight anomalies. The redundant Rover Compute Element (RCE-A, B) has experienced an inability to mount the flash memory several times. The leading cause of these anomalies is likely the loss of electrical connectivity, which is theorized to be due to cracks on the memory component solder joints by thermal cycle fatigue. To investigate this theory, the number of thermal cycles accumulated in flight was compared to PQV accelerated thermal cycle life test data. The goal of this study was to inform mission operations of the risk associated with thermal cycling damage on the RCE. However, since the RCE-B does not have continuous temperature data from the Platinum Resistance Thermometer (PRT) closest to the flash memory, a model was made to correlate continuous data from two other nearby sensors on the RCE-B to the noncontiguous sensor. Using the Rainflow Counting Algorithm, the reconstituted data was converted into the number of equivalent thermal cycles. The Coffin-Manson Equation was used to compare flight thermal cycles to the PQV test. The accelerated life test showed cracking on the memory component solder joints after 500 cycles of 80°C temperature excursions. This study found that the RCE-A and RCE-B have undergone an equivalent of 144 and 430 cycles of 80°C temperature excursions during flight, respectively.

Berger, Lindsey N↗
NASA NTRS2021

Comparing Cumulative Flight Thermal Fatigue to Ground Test Results for Memory Components on the Mars Curiosity Rover

This paper explores the methods used to examine Mars Curiosity Rover’s flight temperature data in relation to the Package Qualification and Verification (PQV) accelerated thermal cycle life test data in response to flight anomalies. The redundant Rover Compute Element (RCE-A, B) has experienced an inability to mount the flash memory several times. The leading cause of these anomalies is likely the loss of electrical connectivity, which is theorized to be due to cracks on the memory component solder joints by thermal cycle fatigue. To investigate this theory, the number of thermal cycles accumulated in flight was compared to PQV accelerated thermal cycle life test data. The goal of this study was to inform mission operations of the risk associated with thermal cycling damage on the RCE. However, since the RCE-B does not have continuous temperature data from the Platinum Resistance Thermometer (PRT) closest to the flash memory, a model was made to correlate continuous data from two other nearby sensors on the RCE-B to the noncontiguous sensor. Using the Rainflow Counting Algorithm, the reconstituted data was converted into the number of equivalent thermal cycles. The Coffin-Manson Equation was used to compare flight thermal cycles to the PQV test. The accelerated life test showed cracking on the memory component solder joints after 500 cycles of 80°C temperature excursions. This study found that the RCE-A and RCE-B have undergone an equivalent of 144 and 430 cycles of 80°C temperature excursions during flight, respectively.

Bell, Charles↗
NASA NTRS1998

Residual Stresses Modeled in Thermal Barrier Coatings

Thermal barrier coating (TBC) applications continue to increase as the need for greater engine efficiency in aircraft and land-based gas turbines increases. However, durability and reliability issues limit the benefits that can be derived from TBC's. A thorough understanding of the mechanisms that cause TBC failure is a key to increasing, as well as predicting, TBC durability. Oxidation of the bond coat has been repeatedly identified as one of the major factors affecting the durability of the ceramic top coat during service. However, the mechanisms by which oxidation facilitates TBC failure are poorly understood and require further characterization. In addition, researchers have suspected that other bond coat and top coat factors might influence TBC thermal fatigue life, both separately and through interactions with the mechanism of oxidation. These other factors include the bond coat coefficient of thermal expansion, the bond coat roughness, and the creep behavior of both the ceramic and bond coat layers. Although it is difficult to design an experiment to examine these factors unambiguously, it is possible to design a computer modeling "experiment" to examine the action and interaction of these factors, as well as to determine failure drivers for TBC's. Previous computer models have examined some of these factors separately to determine their effect on coating residual stresses, but none have examined all the factors concurrently. The purpose of this research, which was performed at DCT, Inc., in contract with the NASA Lewis Research Center, was to develop an inclusive finite element model to characterize the effects of oxidation on the residual stresses within the TBC system during thermal cycling as well as to examine the interaction of oxidation with the other factors affecting TBC life. The plasma sprayed, two-layer thermal barrier coating that was modeled incorporated a superalloy substrate, a NiCrAlY bond coat, and a ZrO2-8 wt % Y2O3 ceramic top coat. We examined the effect on stress during burner rig thermal cycling of the following independent variables: creep in the bond coat and top coat, oxidation, bond coat coefficient of thermal expansion, number of thermal cycles, and interfacial roughness. All these factors were suspected of influencing TBC failure. The model showed that all the material properties studied had a significant effect on the coating's residual stresses if the interface of the bond coat was rough. Bond coat expansion, bond coat oxidation, and bond coat creep had the highest effect on coating stresses, and these were highly interactive. The model also showed that the mechanism of stress generation during thermal cycling changed with the number of thermal cycles. Bond coat and top coat creep dominated stress generation during early thermal cycles, greatly increasing delamination stresses at the peaks of the bond coat. Therefore, creep is the prime driver for delamination cracking early in life, but cracking is limited to the bond coat peak region. Oxidation of the bond coat, on the other hand, tended to dominate stress generation during later cycles by greatly increasing delamination stresses over bond coat valleys. These results indicate that oxidation is the driver for the continued cracking necessary to cause ceramic layer spallation.

Freborg, A. M.↗
NASA NTRS1984

Space exposure of composite materials for large space structures (A0134)

The objective of this experiment is to evaluate the effects of the near-Earth orbital environment on the physical and chemical properties of laminated continuous-filament composites and composites resin films for use in large space structures and advanced spacecraft. The experiment is passive and occupies about one-half of a 6-in.-deep peripheral tray. Specimens of composite materials and polymeric and resin films are arranged above and below the experiment mounting plate to enable both exposure and nonexposure to sunlight. This provides a comparison of the effects of ultraviolet plus vacuum plus thermal cycling and those of vacuum plus thermal cycling on these materials. The experiment tray is thermally isolated from the Long Duration Exposure Facility structure to allow the material specimens to experience a wide range of thermal cycles. Tensile and compression specimens will be used to evaluate the laminated composite materials. A number of the specimens are precut and ready for testing after space exposure, whereas other specimens will be prepared from larger samples.

Wayne S Slemp↗
NASA NTRS2015

On the Recovery Stress of a Ni50.3Ti29.7Hf20 High Temperature Shape Memory Alloy

Recovery stress in shape memory alloys (SMAs), also known as blocking stress, is an important property generally obtained during heating under a dimensional constraint as the material undergoes the martensitic phase transformation. This property has been instinctively utilized in most SMA shape-setting procedures, and has been used in numerous applications such as fastening and joining, rock splitting, safety release mechanisms, reinforced composites, medical devices, and many other applications. The stress generation is also relevant to actuator applications where jamming loads (e.g., in case the actuator gets stuck and is impeded from moving) need to be determined for proper hardware sizing. Recovery stresses in many SMA systems have been shown to reach stresses in the order of 800 MPa, achieved via thermo-mechanical training such as pre-straining, heat treatments or other factors. With the advent of high strength, high temperature SMAs, recovery stress data has been rarely probed, and there is no information pertinent to the magnitudes of these stresses. Thus, the purpose of this work is to investigate the recovery stress capability of a precipitation strengthened, Ni50.3Ti29.7Hf20 (at.) high temperature SMA in uniaxial tension and compression. This material has been shown to exhibit outstanding strength and stability during constant-stress, thermal cycling, but no data exists on constant-strain thermal cycling. Several training routines were implemented as part of this work including isothermal pre-straining, isobaric thermal cycling, and isothermal cyclic training routines. Regardless of the training method used, the recovery stress was characterized using constant-strain (strain-controlled condition) thermal cycling between the upper and lower cycle temperatures. Preliminary results indicate recovery stresses in excess of 1.5 GPa were obtained after a specific training routine. This stress magnitude is significantly higher than conventional NiTi stress generation capability.

Recovery Stress↗
NASA NTRS1979

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

The results of accelerated stress testing of four different types of silicon terrestrial solar cells are discussed. The accelerated stress tests used included bias-temperature tests, bias-temperature-humidity tests, thermal cycle and thermal shock tests, and power cycle tests. Characterization of the cells was performed before stress testing and at periodic down-times, using electrical measurement, visual inspection, and metal adherence pull tests. Electrical parameters measured included short-circuit current, open circuit voltage, and output power, voltage, and current at the maximum power point. Incorporated in the report are the distributions of the prestress electrical data for all cell types. Data were also obtained on cell series and shunt resistance.

Prince, J. L.↗
NASA NTRS1981

Testing of solar cell covers and encapsulants conducted in a simulated space environment

The materials included in the evaluation were 0211 micro-sheet, FEP-A used as a cover and as an adhesive, DC 93-500 adhesive, PFA "hard coat" used as a cover, GE 615/UV-24 used as a cover, GR 650 used as a cover, and electrostatically bonded 7070 glass. The test environments were 1 MeV electron irradiation interspersed with thermal cycling, 0.5 MeV proton irradiation interspersed with thermal cycling and UV exposure interspersed with thermal cycling. Summary data is given describing the response of the test materials both visually and electrically to the three different environments.

Russell, D. A.↗
NASA NTRS1993

Effects of thermal and mechanical fatigue on the flexural strength of G40-600/PMR-15 cross-ply laminates

The effects of thermal and mechanical fatigue on the flexural strength of G40-600/PMR-15 cross-ply laminates with ply orientation of (0(2),90(2))2S and (90(2),0(2))2S are examined. The relative importance of shear and tensile stresses is examined by varying the span-to-depth ratios of flexural test specimens from 8 to 45. Acoustic emission signals are measured during the flexural tests in order to monitor the initiation and growth of damage. Optical microscopy is used to examine specimens for resin cracking, delamination, and fiber breaks after testing. Transverse matrix cracks and delaminations occur in all specimens, regardless of ply orientation, span-to-depth ratio, or previous exposure of specimens to thermal and mechanical fatigue. A small amount of fiber tensile fracture occurs in the outer 0 deg ply of specimens with high span-to-depth ratios. Because of the complex failure modes, the flexural test results represent the 'apparent' strengths rather than the true flexural or shear strengths for these cross-ply laminates. Thermal cycling of specimens prior to flexural testing does not reduce the apparent flexural strength or change the mode of failure. However, fewer acoustic events are recorded at all strains during flexural testing of specimens exposed to prior thermal cycling. High temperature thermal cycling (32 to 260 C, 100 cycles) causes a greater reduction in acoustic events than low temperature thermal cycling (-85 to +85 C, 500 cycles). Mechanical cycling (0 to 50 percent of the flexural strength, 100 cycles) has a similar effect, except that acoustic events are reduced only at strains less than the maximum strain applied during flexural fatigue.

Roberts, Gary D.↗
NASA NTRS1992

Solder creep-fatigue interactions with flexible leaded parts

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

Ross, R. G., Jr.↗
NASA NTRS2013

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗
NASA NTRS2013

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗
NASA NTRS2012

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗
NASA NTRS2021

Microstructural Observations on Advanced Multilayer Protective Coatings for Nuclear Thermal Propulsion

The present research discusses the microstructures of a new multilayered coating concept proposed to solve the “midrange corrosion” problem observed in NbC and ZrC-coated graphite (Gr) nuclear fuels during the NERVA/Rover programs. The concept envisions designing a compliant multilayered coatings architecture to accommodate the thermal expansion mismatch strains between the ZrC outer coating and the Gr/(U,Zr)C fuel matrix along with using a diffusion barrier to minimize carbon and hydrogen diffusion, respectively. Multilayered coatings were deposited on Gr substrates by chemical vapor deposition (CVD). Graphite disks, as well as the inner channels of a 19-hole hexagonal rod 152.4 mm long, were coated by CVD in proof-of concept process demonstration studies. Coated disk specimens were thermally-cycled between ambient and 1900 K for as long as 20 cycles with a 1h hold time at the temperature using both stepped and non-interrupted thermal cycling methods. Detailed cross-sectional microstructural analyses were conducted on the thermally-cycled coated disks. These results showed that the coatings were intact after 20 thermal cycles at 1900 K although the bonding of the overlay Mo coating appeared to be influenced by the oxygen content in the layer. Seven transverse sections were cut along the length from the coated hexagonal rod for microstructural studies. All the nineteen channels were observed to have been coated in all the sections. This paper reports the results of detailed microstructural analyses, compositional line scans and x-ray dot maps conducted on three coated channels from a mid-section of the rod. The measured values of carbon (C) were observed to be exceptionally high in all the specimens, which were attributed to hydrocarbon contamination of the specimen surfaces. It was observed that the oxygen (O) levels were high in all the coating layers even after approximately correcting for the observed high values of C. The source of O contamination of the CVD reactor system was attributed to either the presence of oxychloride impurities in the precursor salts or a pin hole leak in the coating system. It is concluded that high values of O result in poor bonding of the Mo overlay to the ZrC layer. These trials have established that it is possible to deposit multilayered coatings by CVD in 19-hole hexagonal rods 152.4 mm long similar to the NERVA fuel rod design although the quality of the coatings and the uniformity of their thicknesses require further improvement.

Nuclear thermal propulsion, multilayer coatings, m↗
NASA NTRS1991

Investigation of the effect of thermal exposure on the mechanical properties of titanium/SiC composites

The objective was to evaluate the influence of thermal exposure, both isothermal and cyclic, on the reaction kinetics, mechanical properties and fracture behavior of Ti-1100 alloy/SiC fiber composites. Previously, it was determined that composites made with TiB2 coated SiC fiber (sigma) reacted at the same rate as SCS-6 fibers. As a result, the thinner surface coating on the Sigma fiber was completely consumed at shorter times than that on the SCS-6. Thermal cycling experiments were conducted on longitudinal and transverse Ti-1100/SCS-6 composites over a temperature range of 150 to 800 C for 500 cycles. The thermal exposures were carried out in air and argon. No appreciable tensile strength degradation was observed for samples cycled in argon, although a strength loss was noted for the samples cycled in air. Fracture surfaces characterization showed brittle matrix failure in regions near the surface and in regions where there was a path for O2 ingress.

Gundel, Douglas B.↗
NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗
NASA NTRS2008

Extreme Temperature Operation of a 10 MHz Silicon Oscillator Type STCL1100

The performance of STMicroelectronics 10 MHz silicon oscillator was evaluated under exposure to extreme temperatures. The oscillator was characterized in terms of its output frequency stability, output signal rise and fall times, duty cycle, and supply current. The effects of thermal cycling and re-start capability at extreme low and high temperatures were also investigated. The silicon oscillator chip operated well with good stability in its output frequency over the temperature region of -50 C to +130 C, a range that by far exceeded its recommended specified boundaries of -20 C to +85 C. In addition, this chip, which is a low-cost oscillator designed for use in applications where great accuracy is not required, continued to function at cryogenic temperatures as low as - 195 C but at the expense of drop in its output frequency. The STCL1100 silicon oscillator was also able to re-start at both -195 C and +130 C, and it exhibited no change in performance due to the thermal cycling. In addition, no physical damage was observed in the packaging material due to extreme temperature exposure and thermal cycling. Therefore, it can be concluded that this device could potentially be used in space exploration missions under extreme temperature conditions in microprocessor and other applications where tight clock accuracy is not critical. In addition to the aforementioned screening evaluation, additional testing, however, is required to fully establish the reliability of these devices and to determine their suitability for long-term use.

Patterson, Richard L.↗
NASA NTRS1971

Space shuttle main engine definition (phase B). Volume 5: Valves and interconnects

The steady state thermodynamic cycle balance of the single preburner staged combustion engine, coupled with dynamic transient analyses, dictated in detail the location and requirements for each valve defined in this volume. Valve configuration selections were influenced by overall engine and vehicle system weight and failure mode determinations. Modulating valve actuators are external to the valve and are line replaceable. Development and satisfactory demonstration of a high pressure dynamic shaft seal has made this configuration practical. Pneumatic motor driven actuators that use engine pumped hydrogen gas as the working fluid are used. The helium control system is proposed as a module containing a cluster of solenoid actuated valves. The separable couplings and flanges are designed to assure minimum leakage with minimum coupling weight. The deflection of the seal surface in the flange is defined by finite element analysis that has been confirmed with test data. The seal design proposed has passed preliminary pressure cycling and thermal cycling tests.

Schultz, D. F.↗