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Several international Venus missions, both orbiter, and in-situ probe are in the works after a prolonged absence. Future missions are expected to be long-duration lander missions and balloon missions to investigate the cloud layer. The entry mass for these in-situ missions will be significantly higher, and the aeroshell will be larger, than previous missions. Two cardinal requirements govern the selection and use of thermal protection systems (TPS), namely, robustness to assure mission safety during entry and mass efficiency so that the useful mass for science is maximized. One cannot trade mission safety for mass when it comes to TPS. The robustness of the TPS is a paramount requirement as it is a single point of system failure. At the same time, TPS mass is carried for the entire mission duration prior to entry, and any excess TPS mass is at the cost of science payload. Future missions will benefit enormously from TPS options with mass and performance benefits far beyond advanced carbon-carbon (ACC) that is currently proposed for the DAVINCI mission. NASA STMD, and SMD jointly invested in the development of 3-D woven thermal protection systems in the last decade, and as a result, the Heat-shield for Extreme Entry Environment Technology (HEEET) TPS has been matured to TRL 6. It is ready for future mission use including Venus. The HEEET project focused on developing a broad technology base, applicable for missions not only to Venus, but also to Saturn, the Ice Giants, and higher speed sample return missions such as Mars Sample Return requiring extreme robustness due to bio-hazards. The dual-layer HEEET (DL-HEEET) is proven to be extremely robust. DL-HEEET performed well in arc jet and laser testing conditions where heritage carbon-phenolic failed. HEEET also proved to be more mass efficient compared to Carbon-Phenolic. Recently, the principal author was invited to present his perspectives to the 2023-2032 Planetary Sciences Decadal Venus subcommittee on the current state of TPS for future Venus missions [1]. In addition to pointing out successful TPS and other developments in the last decade in support of entry systems, the principal author made two findings: 1) importance of and need to sustain TPS capabilities that took nearly a decade to develop and 2) the opportunity to further optimize TPS mass without sacrificing robustness to further enable future in-situ missions. This talk will focus on the above two recommendations and provide the rationale for them. The intent of the talk is to seek advocacy from the VEXAG community for the criticality of TPS sustainment and the benefits of 3D woven TPS optimization. TPS Capability Sustainment: HEEET development was necessitated by the atrophy of heritage carbon-phenolic. Atrophy has impacted other TPS materials as well. Avcoat, the TPS that successfully allowed astronauts to explore the Moon in the 1960s and 70s, took nearly a decade and $10’sM to recover in support of Orion/Artemis. One of the most used TPS materials, SLA 561V, had to be recovered prior to its use on Mars Pathfinder. Phenolic Impregnated Carbon Ablator (PICA), the TPS that replaced SLA 561V on MSL, has undergone multiple replacements and recovery due to constituent rayon changes. Recently, NASA invested in a domestic rayon replacement program and also invested in FMI to consolidate PICA capability for NASA missions, as a result of FMI’s decision to discontinue commercial FiberForm, which is needed for PICA. TPS used for planetary missions are unique and have no other commercial or defense use. In addition, low mission cadence is also a driver for TPS atrophy. Hence, NASA, as the steward, must take steps to ensure and sustain TPS capabilities. In this talk, we outline steps NASA can take to keep abreast of emerging risks and target risk mitigation steps to ensure TPS capability sustainment for Venus and other extreme environment missions. Next Generation of Mass efficient and Robust TPS: NASA invested in an alternate TPS to PICA based on felt-technology called Conformal-PICA which has the potential to save 30% - 50% mass over PICA. The development was discontinued at a Technology Readiness Level (TRL) of ~ 5. 3D Mid-Density Carbon Phenolic (3MDCP) is a single layer variant of HEEET, based on the insulating layer only (SL-HEEET) and currently baselined for the Mars Sample Return Mission Earth Entry System due to its mass efficiency (30% more mass efficient than DL- HEEET). Currently, SL-HEEET is limited to aeroshell diameters of < 1.3m. The SL-HEEET was compared to DL-HEEET in the recent ADVENT flag-ship class mission study in support of the Planetary Science Decadal. SL HEEET was the recommended TPS based on 30% mass savings for both the balloon and lander missions. Given C-PICA and SL-HEEET have superior reliability and mass efficiency, advocacy from VEXAG is sought for completing their further development to TRL 5/6 in this decade so as to enable TPS readiness for future missions.
Thermal Protection Systems↗