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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 217 records · Page 12

Single-Heater, Three-Zone Furnace

Temperature profile shaped with help of thermal barriers. Proposed furnace for use in experiments on growth of crystals of highly pure material in ampoule provides three temperature zones, yet contains only one heat-pipe liner and one heater and operates with only one controller. Three temperature zones established as thermal resistances of wicks and noncondensible gas reduces flows of heat into channel containing ampoule. Motion of ampoule along channel causes gradients of temperature to move along specimen in ampoule. Variety of three-zone temperature profiles in furnace created by changing thermal resistances of zones and injecting noncondensible gas at appropriate point. Furnace used for variety of experiments.

Gernert, Nelson J.↗

Thermal conductivity and its relation to atomic structure for symmetrical tilt grain boundaries in silicon

We perform a systematic study of thermal resistance and conductance of tilt grain boundaries (GBs) in Si using classical molecular dynamics. The GBs studied are naturally divided into three groups according to the structural units forming the GB core. In this work we find that, within each group, the GB thermal conductivity strongly correlates with the excess GB energy. All three groups predict nearly the same GB conductivity extrapolated to the high-energy limit. This limiting value is close to the thermal conductivity of amorphous Si, suggesting similar heat transport mechanisms. While the lattice thermal conductivity decreases with temperature, the GB conductivity slightly increases. However, at high temperatures it turns over and starts decreasing if the GB structure undergoes a premelting transformation. Analysis of vibrational spectra of GBs resolved along different directions sheds light on the mechanisms of their thermal resistance. The existence of alternating tensile and compressive atomic environments in the GB core gives rise to localized vibrational modes, frequency gaps creating acoustic mismatch with lattice phonons, and anharmonic vibrations of loosely bound atoms residing in open atomic environments.

36 MATERIALS SCIENCE↗

Investigation of fouling mechanisms for diesel engine exhaust heat recovery

The effect of diesel engine exhaust fouling on heat and mass exchangers for waste heat recovery is investigated. Experiments are conducted for a range of operating conditions relevant to the use of the waste heat from a diesel engine for powering a 2.71 kW capacity absorption heat pump. Thermal resistances of fouling layers as well as their effects on pressure drop are determined, and the underlying mechanisms for deposition and removal are investigated. Fouling layer effects are most severe for the lowest coolant temperatures and 100% generator load. At these conditions, the fouling thermal resistance is approximately 70% of the total resistance, and the ratio of the steady-state pressure drop to the baseline pressure drop is 3.25. Flow induced shear is found to be the primary growth inhibiting mechanism at high exhaust velocities. Findings from this study can guide heat exchanger design for a variety of waste heat recovery systems.

04 OIL SHALES AND TAR SANDS↗

Heat pipe heat rejection system

A prototype of a battery heat rejection system was developed which uses heat pipes for more efficient heat removal and for temperature control of the cells. The package consists of five thermal mock-ups of 100 amp-hr prismatic cells. Highly conductive spacers fabricated from honeycomb panels into which heat pipes are embedded transport the heat generated by the cells to the edge of the battery. From there it can be either rejected directly to a cold plate or the heat flow can be controlled by means of two variable conductance heat pipes. The thermal resistance between the interior of the cells and the directly attached cold plate was measured to be 0.08 F/Watt for the 5-cell battery. Compared to a conductive aluminum spacer of equal weight the honeycomb/heat pipe spacer has approximately one-fifth of the thermal resistance. In addition, the honeycomb/heat pipe spacer virtually eliminates temperature gradients along the cells.

Kroliczek, E. J.↗

Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application

Previously, we reported two-phase capillary-based cooling using narrow (200 to 1000 ..mu..m) heater bridge copper inverse opal (CIO) wicks with heat flux level of 1400 Wcm -2 and superheat ~ 10 degrees C. Here, we demonstrate the area scaling of the proposed technology to a large-area micro-cooler for high-heat-flux cooling of microprocessors and power electronics. We developed a hybrid single/two-phase micro-cooler that relies on capillary-wicking in a 25-..mu..m-thick CIO with an open silicon microchannel 3D-manifold for liquid delivery and vapor extraction, achieving a high heat flux ~ 400 Wcm -2 over a heated area of 10 x 10 mm 2 . For a range of inlet water flowrates from 5 to 60 g(min) -1 , we achieved total thermal resistances and vapor qualities of 0.68 cm 2 degrees CW -1 to 0.2 cm 2 degrees CW -1 and 0.55 to 0.12, respectively. The flowrates are 10x smaller than those of conventional single- or two-phase microchannel cooling technology. The corresponding two-phase thermal resistances ranges from 0.05 to 0.02 cm 2 degrees CW -1 with temperature superheat of 8 to 6 degrees C, respectively. While the overall performance of the large-area (10 x 10 mm 2 ) capillary-based micro-cooler degraded compared to the previous demonstration of the technology for a heated area of 5 x 5 mm 2 , however, preliminary CFD modeling indicates that an improved manifold design will be able to achieve comparable performance.

capillary flow↗

Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler Using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application: Preprint

Previously, two-phase capillary-based cooling from narrow (200-1,000 micrometer) heater-bridge copper inverse opal (CIO) wicks with heat flux levels exceeding 1,400 watts per square cm with a low superheat of approximately 10 degrees C was demonstrated. Here, we demonstrate the area scaling of the proposed technology to large-area micro-cooler for the high-heat-flux cooling of microprocessors and power electronics. We developed a hybrid single/two-phase micro-cooler that relies on capillary wicking in 25-micrometer-thick CIOs with an open channel silicon 3D-manifold for liquid delivery and vapor extraction, to achieve a high heat flux of approximately 400 watts per square cm over a heated area of 1 square cm. For the range of inlet water (21 degrees C water temperature) flowrates from 5 to 60 mL per min, we achieved total thermal resistances and vapor qualities of 0.68-0.2 square cm Kelvin per watt and 0.55-0.12, respectively. The high heat flux levels are achieved with flowrates that are 10 times smaller than conventional single- or two-phase microchannel cooling technology. The corresponding two-phase thermal resistances are in the range of 0.05 to 0.02 square cm Kelvin per watt with temperature superheat of 8 to 6 degrees C. While the overall performance of the large-area (10 by 10 square millimeter) capillary-based micro-cooler degraded compared to previous demonstration of the technology for a heated area of 5 by 5 square millimeter, preliminary computational fluid dynamics (CFD) modeling indicates that an improved manifold design will be able to achieve comparable performance.

capillary flow↗

Molecular dynamics simulations of energy accommodation between gases and polymers for ultra-low thermal conductivity insulation

Determining the energy accommodation between gases and solids is essential to developing porous thermal insulation materials with ultra-low effective thermal conductivity that reduce energy use, greenhouse gas emissions, and fossil fuel consumption. The energy accommodation coefficients of most gases, however, have been rarely studied, especially with respect to solids that have relatively high thermal resistivity, e.g., polymers. Here, by using all-atom nonequilibrium molecular dynamics simulations, we reveal the accommodation coefficients of He, Ar, N 2 , and O 2 with polymers, mainly polystyrene. We find that their values are around 0.51, 0.72, 0.79, and 0.90, respectively, suggesting a critical reexamination of the commonly used theoretical maximum value of 1. We have also conducted experiments and validated the value for air, which is about 0.81. Such a change in accommodation coefficients can lead to a reduction of about 70%, 50%, 35%, and 20% in the thermal conductivity of He, Ar, N 2 , and O 2 gases in nano pores (below 100 nm) or at low pressures (below 1 millibar). With these new accommodation coefficients, we find that in a 10 nm pore with ambient pressure at 300 K, the gas thermal conductivity of He, Ar, N 2 , and O 2 in porous polystyrene can be as low as 9.7 × 10 –4 , 3.4 × 10 –4 , 7.3 × 10 –4 , and 8.5 × 10 –4 W·m –1 ·K –1 , respectively, which are two to three orders of magnitude lower than their bulk values, promising higher thermal resistivity of insulation materials. This work reveals the fundamental energy exchange between gases and polymers, providing important guidance for designing high-performance thermal insulation materials for various applications.

36 MATERIALS SCIENCE↗

Mesoscale modeling of microstructure-dependent thermal conductivity in U-Zr fuels

In uranium-zirconium (U-Zr) based metallic fuels, different phases can form at different compositions and temperatures. Typically, lamellar δ-UZr 2 and α-U phases are the dominant microstructures in U-rich U-Zr alloys at temperatures below 880 K. In this work, a finite element method based mesoscale modeling technique is used to calculate the effective thermal conductivities of such heterogeneous microstructures, using the thermal conductivities of two individual phases and their interphase thermal resistance (Kapitza resistance) as input parameters. The Kapitza resistance between δ-UZr 2 and α-U is determined at different temperatures, which shows an approximately T 3 dependence in the temperature range between 300 and 800 K. In addition, the Kapitza resistance exhibits a strong dependence on the aspect ratio of the δ-UZr 2 phase. Further, an analytical model is therefore developed to quantify the effects of both temperature and δ-UZr 2 aspect ratio on the Kapitza resistance. Using this newly developed Kapitza resistance model, the effective thermal conductivities of a number of δ-UZr 2 + α-U heterogeneous microstructures in U-Zr alloys, including non-lamellar microstructures, can be estimated accurately.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Vapor-modulated heat pipe report. Flight data analysis and further development of variable-conductance heat pipes

The design and testing of a heat pipe for spacecraft application is presented. The application in mind calls for heat loads up to 20 watts, a set-point temperature of 294K, and a sink that varies from -220K to nearly as high as the set-point. The overall heat pipe length is 137 cm. Two basically different mechanisms of achieving variable conductance in the pipe by vapor-flow throttling were studied. In one, the thermal resistance between the heat source and sink is due to a saturation-temperature drop corresponding to the vapor-pressure drop developed across the valve. In the other, the pressure difference across the valve induces capillary groove and wick dry out in an evaporation region, and thus results in an increased thermal resistance. This mechanism was selected for fabrication and testing. The pipe is a stainless-steel/methanol two-heat-pipe system. Results are presented and discussed. Engineering drawings and specifications of the pipe are shown.

Eninger, J. E.↗

Thermal analysis of prismatic Li-SOCl2 primary cells

A thermally efficient design for prismatic Li-SOCl2 primary cells is proposed, for application to NASA missions requiring overall power capacities of 20-22 Ah. Thermal resistances of 20 Ah capacity cells were calculated along paths parallel to and normal to the electrodes. Stacking six cells in series to achieve the required 17-28 V potential, it is found that safe operation at C/5 rates (4 A discharge) is possible, maintaining the internal cell temperature below 80 C. Higher discharge rates than C/5 are possible by decreasing the total thermal resistance via providing free spaces between cells.

Cho, Young I.↗

Impact of Janssen effect on thermal transport in granular flow

Using a modulated photothermal radiometry (MPR) technique capable of measuring thermal transport in particle beds, we find asymptotically increasing effective thermal conductivity and decreasing near-wall thermal resistance along gravity-driven downward granular flows through a 1-meter-long narrow vertical channel owing to the Janssen effect. The Janssen effect is confirmed by similar asymptotic trends from particle bed apparent mass measurements as well as separate MPR heat transfer measurements on stationary particle beds under compression at different heights of the channel with and without pressure screening. Furthermore, local heat transfer coefficient along the 1-meter-long channel was modeled based on measured spatially resolved thermal conductivity and near-wall thermal resistance due to the Janssen effect. This work reveals for the first time the impact of the over century-old Janssen effect on heat transfer in granular media. Furthermore, the results from this work can lead to a better understanding of heat transfer in granular flow.

14 SOLAR ENERGY↗

Capillary-Enhanced Two-Phase Micro-Cooler Using Copper-Inverse-Opal Wick with Silicon Microchannel Manifold for High-Heat-Flux Cooling Application

In this work, we demonstrate a two-phase capillary-fed boiling micro-cooler that consists of a ~ 25-..mu..m-thick copper inverse opal (CIO) porous wicking structure for high-heat-flux boiling and a silicon 3D-manifold for distributed liquid delivery and vapor extraction across a 0.5 cm x 0.5 cm heated area. At low inlet water mass flow rates of 1.5 to 1.9 g(min)-1, the micro-cooler displays nearly two-phase boiling with exit vapor quality ~ 1 and a high critical heat flux (CHF) of 253 to 320 W cm-2 with low superheat of ~ 10 degrees C resulting in a thermal resistance of boiling ~ 0.025 cm2 degrees C W-1 or heat transfer coefficient of 0.4 MW m-2 degrees C-1. For higher flow rates of 5, 10, and 15 g(min)-1, the micro-cooler exhibits a hybrid single-phase and two-phase cooling regime where the contribution of the sensible heat (single-phase) cooling is linearly added to that of the two-phase cooling. For the highest flow rate of 15 g(min)-1, the CHF is increased to ~ 500 W cm-2 resulting in an overall thermal resistance of ~ 0.18 cm2 degrees C W-1. However, the two-phase heat transfer effectiveness, which estimates the utilization level of the inlet mass flow rate for two-phase boiling, is reduced to ~ 0.11. To achieve the best cooling system performances, the micro-cooler must operate entirely within the two-phase boiling regime (exit vapor quality or two-phase heat transfer effectiveness ~ 1). Ideally, the "coolant" should be delivered near its saturation temperature (~ 100 degrees C for water), which provides significant advantages for the energy-efficient operation of data centers and power electronics. We present detailed analysis with Infrared and high speed camera images at various inlet flow rates and heat fluxes to understand complex heat transfer in the micro-cooler. Furthermore, a conjugate thermofluidic simulation model, which incorporates the physics of capillary-fed boiling in a porous copper layer, agrees well with the experimental data.

capillary-enhanced boiling↗

Some properties of low-vapor-pressure braze alloys for thermionic converters

Density, dc electrical resistivity, thermal conductivity, and linear thermal expansion are measured for arc-melted rod-shaped samples of binary eutectics of Zr, Hf, Ru, Nb, Ir, Mo, Ta, Os, Re, and W selected as very-low-pressure braze fillers for thermionic converters. The first two properties are measured at 296 K for Zr-21.7 at% Ru, Zr-13 wt% W, Zr-19 wt% W, Zr-22.3 at% Nb, Nb-66.9 at% Ru, Hf-25.3 wt% Re, Zr-25.7 at% Ta, Hf-22.5 at% W, and Nb-35 wt% Mo. The last property is measured from 293 K to 2/3 melting point for specified alloys of different compositions. Resistivities of 0.000055 to 0.000181 ohm-cm are observed with the alloys having resistivities about ten times that of the less resistive constituent metal and about three times that of the more resistive constituent metal, except for Zr-19 wt% W and Nb-35 wt% Mo (greater resistivities). Thermal expansion coefficients vary from 0.000006 to 0.0000105/K. All brazes exhibit linear thermal expansion near that of their constituent metals.

Bair, V. L.↗

Fracture‐Resistant and Thermally Insulating Ultrahigh‐Temperature Carbide Foams

Dense ultrahigh‐temperature ceramics (UHTCs) carbides are recognized as potential materials for thermal protection systems (TPS) owing to properties beyond existing structural materials’ capabilities. Recent advances in UHTCs have enabled the development of multiscale porous microstructures. Herein, it is highlighted that the porosity in UHTCs are no longer treated as a defect but as a functional property specifically tailored for thermal insulation. It is a promising solution to design and fabricate bulk UHTC foams via a freeze‐drying (FD) approach followed by calibrated pressureless spark plasma sintering. Herein, monolithic TaC and HfC UHTC foams and their composite show the partial solid–solution formation of (Ta, Hf)C with porosity ≥50%. TaC–HfC foam (≈80–92 N) shows an intermediate load‐bearing capability compared to monolithic TaC (≈120–135 N) and HfC (≈28–35 N) foams, with no evident cracking on the sample surface. The thermal conductivity of partial solid‐solution TaC–HfC foam increases up to fivefold compared to parent UHTC foams. In the results, solid solutions’ efficacy and pores’ unidirectionality in providing thermal insulation to TaC–HfC while maintaining its high‐load bearing capability are illustrated. In conclusion, the developed technique establishes a new paradigm shift in UHTCs, expanding their potential for TPS in extreme environments.

36 MATERIALS SCIENCE↗

Ferroelectric Domain Wall Engineering Enables Thermal Modulation in PMN–PT Single Crystals

Acting like thermal resistances, ferroelectric domain walls can be manipulated to realize dynamic modulation of thermal conductivity ( k ), which is essential for developing novel phononic circuits. Despite the interest, little attention has been paid to achieving room-temperature thermal modulation in bulk materials due to challenges in obtaining a high thermal conductivity switching ratio ( k high / k low ), particularly in commercially viable materials. Here, room-temperature thermal modulation in 2.5 mm-thick Pb(Mg 1/3 Nb 2/3 )O 3 – x PbTiO 3 (PMN– x PT) single crystals is demonstrated. With the use of advanced poling conditions, assisted by the systematic study on composition and orientation dependence of PMN– x PT, a range of thermal conductivity switching ratios with a maximum of ≈1.27 is observed. Further, simultaneous measurements of piezoelectric coefficient (d 33 ) to characterize the poling state, domain wall density using polarized light microscopy (PLM), and birefringence change using quantitative PLM reveal that compared to the unpoled state, the domain wall density at intermediate poling states (0< d 33 33,max ) is lower due to the enlargement in domain size. At optimized poling conditions (d 33,max ), the domain sizes show increased inhomogeneity that leads to enhancement in the domain wall density. This work highlights the potential of commercially available PMN– x PT single crystals among other relaxor-ferroelectrics for achieving temperature control in solid-state devices.

36 MATERIALS SCIENCE↗

Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces

Purpose AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of processing (energy density, laser power, laser scanning speed, support structure) and build orientation, are not well explored in the literature. This study aims to elucidate the relationship between processing, microstructure, and thermal conductivity. Design/methodology/approach The thermal conductivity of laser powder bed fusion (L-PBF) AlSi10Mg samples are investigated by the flash diffusivity and frequency domain thermoreflectance (FDTR) techniques. Thermal conductivities are linked to the microstructure of L-PBF AlSi10Mg, which changes with processing conditions. The through-plane exceeded the in-plane thermal conductivity for all energy densities. A co-located thermal conductivity map by frequency domain thermoreflectance (FDTR) and crystallographic grain orientation map by electron backscattered diffraction (EBSD) was used to investigate the effect of microstructure on thermal conductivity. Findings The highest through-plane thermal conductivity (136 ± 2 W/m-K) was achieved at 59 J/mm 3 and exceeded the values reported previously. The in-plane thermal conductivity peaked at 117 ± 2 W/m-K at 50 J/mm 3 . The trend of thermal conductivity reducing with energy density at similar porosity was primarily due to the reduced grain size producing more Al-Si interfaces that pose thermal resistance. At these interfaces, thermal energy must convert from electrons in the aluminum to phonons in the silicon. The co-located thermal conductivity and crystallographic grain orientation maps confirmed that larger colonies of columnar grains have higher thermal conductivity compared to smaller columnar grains. Practical implications The thermal properties of AlSi10Mg are crucial to heat transfer applications including additively manufactured heatsinks, cold plates, vapor chambers, heat pipes, enclosures and heat exchangers. Additionally, thermal-based nondestructive testing methods require these properties for applications such as defect detection and simulation of L-PBF processes. Industrial standards for L-PBF processes and components can use the data for thermal applications. Originality/value To the best of the authors’ knowledge, this paper is the first to make coupled thermal conductivity maps that were matched to microstructure for L-PBF AlSi10Mg aluminum alloy. This was achieved by a unique in-house thermal conductivity mapping setup and relating the data to local SEM EBSD maps. This provides the first conclusive proof that larger grain sizes can achieve higher thermal conductivity for this processing method and material system. This study also shows that control of the solidification can result in higher thermal conductivity. It was also the first to find that the build substrate (with or without support) has a large effect on thermal conductivity.

Engineering↗

Thermal contact resistance in a non-ideal joint

The contact of two rough, wavy surfaces; the contact of two rough but nominally flat plates pressed together over a concentrated area; and the contact of two rough but nominally flat plates bolted together are considered. In each case the pressure distribution is calculated as a function of the surface properties. In the case of wavy surfaces it is found that all necessary information for any combination of parameters can be reduced to one master graph. In the other two cases one such graph is needed for each geometry used. The resulting pressure distributions are used in a specific heat transfer example and the total joint resistance versus roughness is presented. A method for decreasing the resistance by increasing the roughness is shown.

Roca, R. T.↗