Chirped-Pulse Laser Absorption Imaging of Ablation Products Formed in Hypersonic Shock Tunnel Experiments
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Final Report
Abstract not provided.
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This is my paper for the 2025 AIAA SciTech conference. The submission is due 12/09.
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A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.
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