Search NASA⌕ Search

SEARCH · Search NASA

Results for “Board.”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability

This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability (Reuse Document ID 20205007963)

This HDPUG Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗
NASA NTRSDate not supplied

On-board Limb-based Shape Modeling for Small Body Navigation

Missions to small bodies within our solar system are becoming more frequent. Generally, shape models of the target body are required to perform proximity operations as demonstrated by the OSIRIS-REx, Hayabusa2, and Rosetta missions. However, these missions required image downlinking to create high-resolution models on the ground. In some missions, especially small-sats, there may be data downlink data constraints, resulting in the inability to provide the large number of images needed for high-resolution shape models. A solution to this is the ability to generate shape models on-board during the approach to the target or initial proximity surveying. Current work implements a limb-based shape model routine that is able to be executed on a Raspberry Pi 1, which is similar to the processing capability to the flight computer on OSIRIS-REx, and that does not require low phase angle geometries. Initial shape model results generated from Bennu approach (Nov 2-3, 2018) show that the limb-based shape model agrees well with a 75-cm SPC shape model generated after Preliminary Survey; Results are: min difference -7.047m, max difference 17.347m, mean 1.122m, and RMS 3.219m. Further scenarios are presented herein.

Limb-based↗
NASA NTRS2023

Venus Surface Environmental Chamber Test of SiC JFET-R Multi-Chip Circuit Board

This poster describes a first attempt to demonstrate a multi-chip prototype lander control and sensor signal digitization electronics circuit board comprised of ten NASA Glenn IC Generation 11 SiC JFET-R IC chips in 460 °C, 9.4 MPa harsh Venus surface conditions. The lander circuit ceased electrical operation prematurely at 107 °C as the Venus chamber heated up. Optical and SEM post-test inspections indicate fatal dielectric cracks occurred on only one of the ten SiC chips.

silicon carbide↗
NASA NTRS1966

Process produces accurate registry between circuit board prints

Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

Source record↗
NASA NTRS1967

Study made of anodized aluminum circuit boards

Hard coated aluminum circuit boards demonstrate the feasibility of obtaining an electrical power circuit of high packaging density with very high thermal conductivity and mechanical strengths.

Jacobi, C.↗