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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13

Digital Twin Framework for the Resilient Remote Monitoring and Operation of Nuclear Microreactors

The nuclear industry is developing new advanced reactor technologies, and many companies are conceptualizing designs for microreactors, a class of nuclear reactor with a sub-20 MWth power output designed to be factory fabricated, easily transportable, and simple to control. Microreactors offer promising solutions to several use cases for which large-scale plants would not be suitable, and conventional power generation means, notably diesel electric generators, are expensive and logistically difficult. Many of the potential use cases are in isolated locations such as arctic communities, remote mines, and military installations. Therefore, the cost of microreactor deployment and traditional onsite operations pose a challenge that requires new technical solutions to address. One solution that has the potential to greatly improve economics is to operate and monitor microreactors remotely from a centralized location. Remote monitoring and operation are novel concepts to the nuclear industry and will greatly alter the tasks and responsibilities associated with current commercial nuclear power plant operators. As such, it is important to perform research on potential technological solutions and the impacts those solutions have on operations with end-goal of defining a safe and effective remote concept of operations. This paper proposes a framework for resilient remote operation of microreactors enabled by a novel digital twin implementation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Communications terminal breadboard

A baseline design is presented of a digital communications link between an advanced manned spacecraft (AMS) and an earth terminal via an Intelsat 4 type communications satellite used as a geosynchronous orbiting relay station. The fabrication, integration, and testing of terminal elements at each end of the link are discussed. In the baseline link design, the information carrying capacity of the link was estimated for both the forward direction (earth terminal to AMS) and the return direction, based upon orbital geometry, relay satellite characteristics, terminal characteristics, and the improvement that can be achieved by the use of convolutional coding/Viterbi decoding techniques.

Source record↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Review of in situ process monitoring for metal hybrid directed energy deposition

Hybrid manufacturing, or the combination of additive and subtractive manufacturing within a single build volume is transforming the way products are being fabricated. Additive manufacturing confers unprecedented freedom of design and reduced material usage while enabling serial customization. Subtractive manufacturing provides superior surface finish and improved dimensional accuracies. Interwoven, these two digital manufacturing paradigms are enabling the rapid manufacturing of complex, highly accurate, and customized geometries in a diversity of high-performance alloys. In situ monitoring, heavily relied upon in either additive or subtractive, becomes even more crucial with the interplay of the two processes in a single combined build sequence. Moreover, challenges that do not exist in either process alone can now have a dramatic impact on final part quality: (1) a large amount of heat is generated during additive manufacturing deposition, which is primarily dissipated into the machine tooling and impacts accuracy by deforming the material and causing misaligned machining; (2) microstructure, mechanical properties, and residual stresses are the result of the complex thermal histories generated by additive manufacturing and can impact subsequent cutting performance. This comprehensive review considers previous research in monitoring and providing closed-loop control in both additive and subtractive manufacturing separately and then considers the implications of the effectiveness of these monitoring techniques when additive and subtractive processes are integrated together.

36 MATERIALS SCIENCE↗

Fiber optic and laser sensors X; Proceedings of the Meeting, Boston, MA, Sept. 8-11, 1992

Topics addressed include acoustic and pressure sensors; fiber optic gyros; electric and magnetic field sensors; bend, strain, and temperature sensors; industrial applications of sensors; and processing techniques. Particular attention is given to fiber optic interferometric acoustic sensors for wind tunnel applications, polished coupler and resonator fabrication, second-harmonic detection for rotation sensing in fiber optic gyros, simplified control theory in closed-loop fiber optic gyroscopes, and a Fabry-Perot sensor with digital signal processing for the measurement of magnetostriction. Also discussed are a Bragg fiber laser sensor, commercialization of fiber optic strain gauge systems, thermal ignition in hazardous environments due to stray light from optical fibers, a system for absolute measurements by interferometric sensors, and high-performance interferometric demodulation techniques.

Udd, Eric↗

Building a Plastics Fabrication Laboratory on the ISS: FabLab, MANTIS, Refabricator, CRISSP, ERASMUS, and MAMBA

The objective of NASA's In Space Manufacturing program is to develop manufacturing technologies and processes necessary to provide "on-demand, sustainable operations for exploration missions." Using the ISS as a test bed, in 2014, NASA installed and successfully tested a 3D printer for in-space operations, demonstrating the 3D printing process as well as sending digital files for printing from earth to the printer. The success of this technology demonstration has shown that on-orbit manufacturing technologies can be used to limit the earth reliance for cis-lunar missions. Because of this success, numerous opportunities have been provided by NASA to further in-space manufacturing by focusing on the development of highly autonomous manufacturing systems, recycling technologies, and robotics with the ultimate goal of building a fabrication laboratory now within reach. From technologies developed for ISS activities and demonstration missions, Tethers Unlimited, Inc. (TUI) is building a Plastics Manufacturing Laboratory capable of fabricating parts on-demand and as-needed while recycling waste plastics with minimal human interaction required. Parts will be manufactured through additive manufacturing. Precision machining will ensure manufactured parts are in tolerance with the end-use requirements. Recycling waste plastics will enable both waste from the crew and waste from processing to be re-processed into something new. In addition, these manufacturing and recycling technologies are supported by part verification/validation technique and robotic servicing, minimizing human interaction with the system and eventually enabling unmanned off-world manufacturing.

Muhlbauer, Rachel↗

An Set-Free, All Digital Controlled Point-of-Load Regulator for Next Generation Power Systems: ADC-POL

This paper presents a digitally controlled programmable point-of-load regulator for next-generation power systems. A novel digital control scheme was designed to minimize single-event effect (SEE)-induced transient effects. By effectively programming the loop transmission, the POL can trade off transient response time with SET robustness. The IC works with 1 to 5.5 V input voltage, 1-4.5V regulated output voltage, high efficiency (peak efficiency at 94%) and power of up to 5 W. The design was fabricated in the AMI i2t100 0.7 mu m complimentary, metal-oxide semiconductor (CMOS) process and characterized with the Jet Propulsion Laboratory (JPL) pulsed laser system.

Digital Signal Processing (DP)↗

Advanced helium magnetometer for space applications

The goal of this effort was demonstration of the concepts for an advanced helium magnetometer which meets the demands of future NASA earth orbiting, interplanetary, solar, and interstellar missions. The technical effort focused on optical pumping of helium with tunable solid state lasers. We were able to demonstrate the concept of a laser pumped helium magnetometer with improved accuracy, low power, and sensitivity of the order of 1 pT. A number of technical approaches were investigated for building a solid state laser tunable to the helium absorption line at 1083 nm. The laser selected was an Nd-doped LNA crystal pumped by a diode laser. Two laboratory versions of the lanthanum neodymium hexa-aluminate (LNA) laser were fabricated and used to conduct optical pumping experiments in helium and demonstrate laser pumped magnetometer concepts for both the low field vector mode and the scalar mode of operation. A digital resonance spectrometer was designed and built in order to evaluate the helium resonance signals and observe scalar magnetometer operation. The results indicate that the laser pumped sensor in the VHM mode is 45 times more sensitive than a lamp pumped sensor for identical system noise levels. A study was made of typical laser pumped resonance signals in the conventional magnetic resonance mode. The laser pumped sensor was operated as a scalar magnetometer, and it is concluded that magnetometers with 1 pT sensitivity can be achieved with the use of laser pumping and stable laser pump sources.

Slocum, Robert E.↗

6H-SiC Transistor Integrated Circuits Demonstrating Prolonged Operation at 500 C

The NASA Glenn Research Center is developing very high temperature semiconductor integrated circuits (ICs) for use in the hot sections of aircraft engines and for Venus exploration where ambient temperatures are well above the approximately 300 degrees Centigrade effective limit of silicon-on-insulator IC technology. In order for beneficial technology insertion to occur, such transistor ICs must be capable of prolonged operation in such harsh environments. This paper reports on the fabrication and long-term 500 degrees Centigrade operation of 6H-SiC integrated circuits based on epitaxial 6H-SiC junction field effect transistors (JFETs). Simple analog amplifier and digital logic gate ICs have now demonstrated thousands of hours of continuous 500 degrees Centigrade operation in oxidizing air atmosphere with minimal changes in relevant electrical parameters. Electrical characterization and modeling of transistors and circuits at temperatures from 24 degrees Centigrade to 500 degrees Centigrade is also described. Desired analog and digital IC functionality spanning this temperature range was demonstrated without changing the input signals or power supply voltages.

Neudeck, Philip G.↗

Microelectronic fabrication of superconducting devices and circuits

It is expected that thin-film superconductors can be used as detectors or sources of infrared and microwave radiation, as magnetometers, as voltage standards, and for voltage and current measurements, for electronic signal processing, and in digital circuitry.

Kirschman, R. K.↗

Development of a high-resolution automatic digital (urine/electrolytes) flow volume and rate measurement system of miniature size

To aid in the quantitative analysis of man's physiological rhythms, a flowmeter to measure circadian patterns of electrolyte excretion during various environmental stresses was developed. One initial flowmeter was designed and fabricated, the sensor of which is the approximate size of a wristwatch. The detector section includes a special type of dielectric integrating type sensor which automatically controls, activates, and deactivates the flow sensor data output by determining the presence or absence of fluid flow in the system, including operation under zero-G conditions. The detector also provides qualitative data on the composition of the fluid. A compact electronic system was developed to indicate flow rate as well as total volume per release or the cumulative volume of several releases in digital/analog forms suitable for readout or telemetry. A suitable data readout instrument is also provided. Calibration and statistical analyses of the performance functions required of the flowmeter were also conducted.

Liu, F. F.↗

Spacesuit Fit and Mobility Assessments by Digital Human Modeling

Spacesuit Fit and Mobility Assessments by Digital Human Modeling K. Han Kim (Leidos, Inc.) Elizabeth A. Benson (KBR, Inc.) Sudhakar L. Rajulu (NASA Johnson Space Center) Spacesuits are required to accommodate safe operations for astronauts across gender and a wide variety of body shapes and sizes. This goal has been of particular importance given the increasing diversity of NASA crewmembers for upcoming Missions. While testing with design prototypes is a critical step for spacesuit development, iterative mockup design, fabrication, and human subject tests can be extremely costly and time consuming. Moreover, testing with a limited subject pool has often raised questions for validity, as test subjects need to represent the entire astronaut population, not only of the past or current, but also the future. This study is aimed at demonstrating how digital human modeling (DHM) tools have been built and directly supported NASA spacesuit developments. With DHM, the computer aided design (CAD) model of a spacesuit was integrated with human body models. Two use scenarios are presented in this paper, namely fit and mobility. For fit assessments, the suit-to-body contact and compression patterns were estimated using 3D human body scan models virtually wearing a spacesuit model. A statistical fit classifier was made from the contact patterns and applied against a large database of body scans (N=2,500). With this technique, the NASA reference design spacesuit Exploration EVA Mobility Unit (xEMU)was verified to accommodate 90% of the astronaut-like population, with the critical dimensions covering 1stto 99thpercentiles of the target body measurements. A similar technique assessed XEMU mobility. The maximum reach envelopes were considered, within which the work objects and critical hardware interfaces should be located for safe and ergonomic operations. While the reach envelope geometry varies significantly with the suit wearer’s body size and strength, the existing test data did not include the subjects critically required to define suit mobility requirements, such as very small females or large males. Using the xEMU virtual model kinematically simulated and permuted for a hypothetical wearer, however, the existing data were statistically transformed and scaled. This method enabled for a parametric estimation of the reach envelopes from the 1stpercentile female or 99thpercentile male. The outcome was successfully incorporated for requirement developments. With the new DHM tools, human integration of the spacesuit was structurally simulated and predictively assessed, which would have been otherwise impossible. Also, the needs for iterative mockup and subject tests were significantly reduced, which resulted in time and cost saving. Additional work is in progress to integrate additional vehicles, tools, and hardware with DHM framework.

K Han Kim↗

The future of computing beyond Moore’s Law

Moore’s Law is a techno-economic model that has enabled the information technology industry to double the performance and functionality of digital electronics roughly every 2 years within a fixed cost, power and area. Advances in silicon lithography have enabled this exponential miniaturization of electronics, but, as transistors reach atomic scale and fabrication costs continue to rise, the classical technological driver that has underpinned Moore’s Law for 50 years is failing and is anticipated to flatten by 2025. Here, this article provides an updated view of what a post-exascale system will look like and the challenges ahead, based on our most recent understanding of technology roadmaps. It also discusses the tapering of historical improvements, and how it affects options available to continue scaling of successors to the first exascale machine. Lastly, this article covers the many different opportunities and strategies available to continue computing performance improvements in the absence of historical technology drivers. This article is part of a discussion meeting issue ‘Numerical algorithms for high-performance computational science’.

97 MATHEMATICS AND COMPUTING↗

A CMOS Imager with Focal Plane Compression using Predictive Coding

This paper presents a CMOS image sensor with focal-plane compression. The design has a column-level architecture and it is based on predictive coding techniques for image decorrelation. The prediction operations are performed in the analog domain to avoid quantization noise and to decrease the area complexity of the circuit, The prediction residuals are quantized and encoded by a joint quantizer/coder circuit. To save area resources, the joint quantizerlcoder circuit exploits common circuitry between a single-slope analog-to-digital converter (ADC) and a Golomb-Rice entropy coder. This combination of ADC and encoder allows the integration of the entropy coder at the column level. A prototype chip was fabricated in a 0.35 pm CMOS process. The output of the chip is a compressed bit stream. The test chip occupies a silicon area of 2.60 mm x 5.96 mm which includes an 80 X 44 APS array. Tests of the fabricated chip demonstrate the validity of the design.

Leon-Salas, Walter D.↗

Making Complex Electrically Conductive Patterns on Cloth

A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.

Chu, Andrew↗

Summary of Methodology for Mitigating Risks Associated with Licensing and Qualifying AM Nuclear Materials

The US Department of Energy’s Advanced Materials and Manufacturing Technologies (AMMT) program focuses on accelerating the development, qualification, demonstration, and deployment of advanced materials and manufacturing technologies to enable reliable and economical nuclear energy. Laser powder bed fusion (LPBF) is one of the most popular additive manufacturing (AM) processes for fabricating components with intrinsically complex geometries. LPBF was extensively explored for nuclear applications under the previous Transformational Challenge Reactor program. Additionally, Oak Ridge National Laboratory developed and licensed the Peregrine software and larger digital platform that couples machine learning and in situ data collection during AM to detect anomalies and any evolved defects. The digital platform will be critical to (1) the qualification of AM components for nuclear applications that link location-specific data to macroscopic properties and (2) predict final component performance. Current in situ process monitoring tools are valuable for observing the formation of stochastic flaws, but additional data are needed to predict the resulting microstructures and associated material performance. Rapid cooling rates and large thermal gradients have caused large heterogeneities in the microstructure, which cause anisotropy in mechanical performance. The AMMT program is evaluating the best approaches for addressing these heterogeneities and their effect on component performance using a combination of multiscale modeling, enhanced in situ process monitoring, and high throughput experimental testing. This report summarizes strategies for mitigating the risks associated with qualifying AM components, including developing new sensing capabilities for in situ process monitoring and characterizing melt pool solidification and residual stresses to inform multiscale modeling efforts.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗