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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS2021

Systems Engineering and Assurance Modeling (SEAM): A Web-Based Solution for Integrated Mission Assurance

We present an overview of the Systems Engineering and Assurance Modeling (SEAM) platform, a web-browser-based tool which is designed to help engineers evaluate the radiation vulnerabilities and develop an assurance approach for electronic parts in space systems. The SEAM framework consists of three interconnected modeling tools, a SysML compatible system description tool, a Goal Structuring Notation (GSN) visual argument tool, and Bayesian Net and Fault Tree extraction and export tools. The SysML and GSN sections also have a coverage check application that ensures that every radiation fault identified on the SysML side is also addressed in the assurance case in GSN. The SEAM platform works on space systems of any degree of radiation hardness but is especially helpful for assessing radiation performance in systems with commercial-off-the-shelf (COTS) electronic components.

SEAM↗
NASA NTRS2009

Assessment of SOI AND Gate, Type CHT-7408, for Operation in Extreme Temperature Environments

Electronic parts based on silicon-on-insulator (SOI) technology are finding widespread applications due to their ability to operate in harsh environments and the benefits they offer as compared to their silicon counterparts. Due to their construction, they are tailored for high temperature operation and show good tolerance to radiation events. In addition, their inherent design lessens the formation of parasitic junctions, thereby reducing leakage currents, decreasing power consumption, and enhancing speed. These devices are typically rated in temperature capability from -55 C to about +225 C, and their characteristics over this temperature range are documented in data sheets. Since electronics in some of NASA space exploration missions are required to operate under extreme temperature conditions, both cold and hot, their characteristic behavior within the full temperature spectrum must be determined to establish suitability for use in space applications. The effects of extreme temperature exposure on the performance of a new commercial-off-the-shelf (COTS) SOI AND gate device were evaluated in this work. The high temperature, quad 2-inputs AND gate device, which was recently introduced by CISSOID, is fabricated using a CMOS SOI process. Some of the specifications of the CHT-7408 chip are listed in a table. By supplying a constant DC voltage to one gate input and a 10 kHz square wave into the other associated gate input, the chip was evaluated in terms of output response, output rise (t(sub r)) and fall times (tf), and propagation delays (using a 50% level between input and output during low to high (tPLH) and high to low (tPHL) transitions). The supply current of the gate circuit was also obtained. These parameters were recorded at various test temperatures between -195 C and +250 C using a Sun Systems environmental chamber programmed at a temperature rate of change of 10 C/min. In addition, the effects of thermal cycling on this chip were determined by exposing it to a total of 12 cycles between -195 C and +250 C. Following the cycling activity, measurements were performed again at the test temperatures of -195 C, +21 C, and +250 C.

Patterson, Richard↗
NASA NTRS2023

Extended Temperature Operation of Isolated, Precision Gate Driver, ADuM4120

Electronics used in space missions encounter exposure to extreme temperatures and operation under wide thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and very little data exist on their performance outside their specified range of operation. Extending the temperature range at which electronic parts can operate reliably leads to potential benefits resulting in improving reliability, reducing mass/weight, and simplifying thermal design due to elimination of thermal control elements and fewer parts count. In this work, the performance of an isolated, precision gate driver for controlling power-level transistors, including gallium nitride (GaN) and silicon carbide (SiC) devices, was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Wide Bandgap Power Electronics↗
NASA NTRS2015

Single-Event Effects in Silicon Carbide Power Devices

This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.

heavy-ion single-event effects↗
NASA NTRS2018

Guideline for Single-Event Effect (SEE) Testing of System on a Chip (SOC) Devices

The use of complex single and multicore processors with significant cache memory, on-chip peripherals, memory controllers, and high speed input/output (IO) that integrate many of the parts of a traditional computer system is becoming more common in space applications. Such devices are often referred to as system on a chip devices (SOCs), even though the term is used somewhat inaccurately due to the lack of analog and mixed signal subcircuits. These devices are complex combinations of single- or multi-core processors with memory controllers, high-speed input/output (IO), and other peripheral structures that formerly would have been handled by off-chip resources. In the past the processors were tested for single event effects (SEE) separately, and the peripherals were often put into custom application-specific integrated circuits (ASICs) along with other resources required by the user. Performance and cost pressures have pushed commercial devices to incorporate many of the functional blocks into a single chip, an SOC. The NASA Electronic Parts and Packaging Program (NEPP) has been examining ways to perform SEE radiation hardness assurance (RHA) testing of these processor-centric SOCs to achieve reasonable understanding of their performance in space missions.

Guertin, Steven M.↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS1968

Engineering Mechanics Division

Screening methods for metal oxide semiconductor field effect transistors and resistors, impact survival testing of spacecraft electronic parts, and parachute jettisoning from planetary capsules

Source record↗
NASA NTRS1974

Interferometric methods for measurement of ultrasonic wave velocity: Classification, characteristics and basic defects

Interferometric methods may be considered to include all methods in which the time necessary for a signal to pass through a medium is determined on the basis of the period of oscillation of which the signal consists, while the distance is determined by noting the coincidence between (1) interference between the measured signal and its reflection and ultrasonic interference, or between another signal serving as a reference and electrical interference in the electronic part of the device. In general, all interferometric methods are relatively simple and permit a high degree of accuracy. Theoretically 48 different variations may be distinguished, about 30 of which are capable of practical application. For liquids, where transverse waves do not exist, the number of possible variations is limited to 40, assuming that absolute velocity measurement is desired.

Kozlowski, Z.↗
NASA NTRS1982

A discussion of image sharpness

The image sharpness problem is discussed in terms of a scene which is viewed by a sensor. The sensor has some sort of function which is a nonpoint observing function, and it's a function that gathers energy from some region around a point in the scene. That energy is integrated and is contributed to each point or each sample that is taken of the scene. The samples become the pixels, and the pixels are assembled together into the digital image. Each one has some blurr or some of what is called the point's spread function creating the value of information or data that is seen in each pixel. Then the sensor and electronic part of the system acts on that signal out of the sensor and perhaps adds more blurring, more loss of resolution to the system. Finally, sampling and quantization of the data produce their effects. The signal is sampled at some rate and the digital image is created from that. The sampling or digitizing process puts the continuous voltage into a number of discrete binary levels, and another error is introduced there.

Anuta, P.↗
NASA NTRS1982

The sputtering of insulating materials by fast heavy ions

In this paper recent experimental results on sputtering of UF4 and H2O (ice) by fast heavy ions are reviewed. Measurements have been made of the dependence of the sputtering yield on the incident ion type, charge state, and energy. In the case of UF4, the energy spectra of neutral sputtered particles have been obtained as well. There is a clear dependence of the sputtering yield on the electronic part of the stopping power, and the yield is strongly affected by the charge state of the incident ion, which shows that in the near-surface region from which sputtered particles arise, the charge state of the incident ion has not reached equilibrium. The shape of the energy spectra observed for UF4 targets is that expected from a thermal distribution rather than that of the collision cascade form typical of ordinary sputtering. A model of the sputtering-track registration process that has arisen from these data is shown to provide a framework of understanding the close relationship of these observations to the 'plasma desorption' of marcromolecules.

Seiberling, L. E.↗
NASA NTRS1983

Simplified power processing for ion-thruster subsystems

A review of the thruster/power-processor-interface requirements for (mercury and inert gas) ion-thrusters, an evaluation of various approaches to simplifying the power-processor circuitry, and the test results of the recently developed 8-cm mercury-ion-thruster simplified power-processor unit (SPPU) are presented. The SPPU demonstrates the feasibility of stable thruster operation using highly simplified power-processing techniques and achieves an approximately tenfold reduction in the electronic parts count when compared to the existing power-processor unit (PPU) used in the Hughes/NASA Lewis Research Center 8-cm-diameter (mercury) Ion Auxiliary Propulsion Subsystem (IAPS).

Wessel, F. J.↗
NASA NTRS1983

Sputtering of UF4 by high energy heavy ions

The sputtering of UF4 targets by energetic beams of O-16, F-19, and Cl-35 ions has been investigated for beam energies in the range 0.12 to 1.5 MeV/amu. The sputtering yields, which follow the same trend as the electronic part of the projectile energy loss in the material, are observed to have a strong dependence on the charge state of the incident ions. Data have been taken both in transmission and reflection (0 and 180 deg to the incident beam direction, respectively). Energy spectra of the neutral sputtered particles have been obtained for 5 MeV F-19 ions and for 13 MeV Cl-35 ions; in both cases the spectrum has a Maxwellian form. The data obtained are compared with several models of the high energy sputtering process.

Meins, C. K.↗
NASA NTRS1983

The mobile Sousy-Doppler radar: Technical design and first results

A mobile VHF Doppler system was developed. The electronic part is installed in a 20 ft container and tested using a special log periodic aerial to illuminate the 300 m dish. The system was extended by designing a mobile phased antenna array with finally 576 Yagi elements. The grouping of the single Yagis, the system of transmission lines, the phase shifters, the power splitters and the T/R switch are described. Results from the first two campaigns and a survey of future programs demonstrating the flexibility of this mobile system are summarized.

Czechowsky, P.↗
NASA NTRS1984

Forecasting of high voltage insulation performance: Testing of recommended potting materials and of capacitors

Nondestructive high voltage test techniques (mostly electrical methods) are studied to prevent total or catastrophic breakdown of insulation systems under applied high voltage in space. Emphasis is on the phenomenon of partial breakdown or partial discharge (P.D.) as a symptom of insulation quality, notably partial discharge testing under D.C. applied voltage. Many of the electronic parts and high voltage instruments in space experience D.C. applied stress in service, and application of A.C. voltage to any portion thereof would be prohibited. Suggestions include: investigation of the ramp test method for D.C. partial discharge measurements; testing of actual flight-type insulation specimen; perfect plotting resin samples with controlled defects for test; several types of plotting resins and recommendations of the better ones from the electrical characteristics; thermal and elastic properties are also considered; testing of commercial capaciters; and approximate acceptance/rejection/rerating criteria for sample test elements for space use, based on D.C. partial discharge.

Bever, R. S.↗
NASA NTRS1987

An interactive wire-wrap board layout program

An interactive computer-graphics-based tool for specifying the placement of electronic parts on a wire-wrap circuit board is presented. Input is a data file (currently produced by a commercial logic design system) which describes the parts used and their interconnections. Output includes printed reports describing the parts and wire paths, parts counts, placement lists, board drawing, and a tape to send to the wire-wrap vendor. The program should reduce the engineer's layout time by a factor of 3 to 5 as compared to manual methods.

Schlutsmeyer, A.↗
NASA NTRS1988

Photometer Tracks The Sun

Airborne Sun-tracking photometer enables observations of Sun during much greater portion of flights than previously possible, without special maneuvers of airplane. Instrument occupies dome atop airplane. Fiberglass dome protects photometer and rotates to aim photometer in azimuth and elevation to track Sun. Provides controlled environment for instrument, including mechanical and electronic parts. Instrument calibrated without removing it from airplane.

Matsumoto, Tak↗