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DOE OSTI2013

Analysis of the Axial Gap Vs Fiberboard Moisture Content in a 9975 Shipping Package

The fiberboard assembly within a 9975 shipping package contains a modest amount of moisture, which can migrate to the cooler regions of the package when an internal heat load is present. Typically, this leads to increased moisture levels in the bottom fiberboard layers, along with elevated chloride levels which can leach from the fiberboard. Concerns have been raised that this condition could lead to corrosion of the stainless steel drum. It has been postulated that checking the axial gap at the top of the package against the current 1 inch maximum criterion provides a sufficient indication regarding the integrity of the fiberboard and drum. This report estimates the increase in axial gap that might be expected for a given moisture increase in the bottom fiberboard layers, and the likelihood that the increase will create a nonconforming condition that will lead to identification of the moisture increase. Using data relating the fiberboard moisture content with the degree of compaction under load, the present analysis indicates that the axial gap will increase by 0.282 inch as the bottom fiberboard layers approach the saturation point. This increase will cause approximately 58% of packages with otherwise nominal package component dimensions to fail the axial gap criterion, based on a survey of axial gap values recorded in K-Area surveillance activities. As the moisture content increases above saturation, the predicted increase in axial gap jumps to 0.405 inch, which would result in 92% or more of all packages failing the axial gap criterion. The data and analysis described in this report are specific to cane fiberboard. While it is expected that softwood fiberboard will behave similarly, such behavior has not yet been demonstrated.

36 MATERIALS SCIENCE↗

DOE OSTI2015

Temperature Environment for 9975 Packages Stored in KAC

Plutonium materials are stored in the K Area Complex (KAC) in shipping packages, typically the 9975 shipping package. In order to estimate realistic degradation rates for components within the shipping package (i.e. the fiberboard overpack and O-ring seals), it is necessary to understand actual facility temperatures, which can vary daily and seasonally. Relevant facility temperature data available from several periods throughout its operating history have been reviewed. The annual average temperature within the Crane Maintenance Area has ranged from approximately 70 to 74 °F, although there is significant seasonal variation and lesser variation among different locations within the facility. The long-term average degradation rate for 9975 package components is very close to that expected if the component were to remain continually at the annual average temperature. This result remains valid for a wide range of activation energies (which describes the variation in degradation rate as the temperature changes), if the activation energy remains constant over the seasonal range of component temperatures. It is recommended that component degradation analyses and service life estimates incorporate these results. Specifically, it is proposed that future analyses assume an average facility ambient air temperature of 94 °F. This value is bounding for all packages, and includes margin for several factors such as increased temperatures within the storage arrays, the addition of more packages in the future, and future operational changes.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Humidity data for 9975 shipping packages with cane fiberboard

The 9975 surveillance program is developing a technical basis to support extending the storage period of 9975 packages in K-Area Complex beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis. Direct measurements of humidity and fiberboard moisture content have been made on two test packages with cane fiberboard and varying internal heat levels from 0 up to 19W. With an internal heat load, a temperature gradient in the fiberboard assembly leads to varying relative humidity in the air around the fiberboard. However, the absolute humidity tends to remain approximately constant throughout the package. The moisture content of fiberboard varies under the influence of several phenomena. Changes in local fiberboard temperature (from an internal heat load) can cause fiberboard moisture changes through absorption or evaporation. Fiberboard degradation at elevated temperature will produce water as a byproduct. And the moisture level within the package is constantly seeking equilibrium with that of the surrounding room air, which varies on a daily and seasonal basis. One indicator of the moisture condition within a 9975 package might be obtained by measuring the relative humidity in the upper air space, by inserting a humidity probe through a caplug hole. However, the data indicate that for the higher internal heat loads (15 and 19 watts), a large variation in internal moisture conditions produces little or no variation in the air space relative humidity. Therefore, this approach does not appear to be sensitive to fiberboard moisture variations at the higher heat loads which are of most interest to maintaining fiberboard integrity.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

DOE OSTI2017

Automated Work Packages: Radio Frequency Identification, Bluetooth Beacons, and Video Applications in the Nuclear Power Industry

The need to move conventional paper-based work packages into an electronic state motivated the development of a large span of electronic work package forms that ranged from simple Portable Document Format (PDF) files to adaptive and intelligent electronic forms. In parallel to this development, the Department of Energy Light Water Reactor Sustainability Program (LWRS) initiated the automated work package as a pilot project to evaluate implementing state of the art automation techniques into the work package process to improve the economic and safety of the work process. Through a multiple year’s effort, the automated work package project have developed a vision of the future work package that relies on automation in all critical and human factor challenging tasks. The vision identified gaps in the work process, the means to automate them, and evaluated the implementation, feasibility and benefits of these means. This was conducted through continues engagement with the nuclear power industry. The aim of this report is to study the potential of three automation technologies, which have been advancing in various industries, in the current work process of nuclear power plants. The study is to determine the feasibility and benefits of incorporating the technologies and determine potential gaps, if any, that need to be addressed to facilitate deployment of the studied technologies. The three automation technologies identified for this effort are ultra-high frequency (UHF) radio frequency identification (RFID), Bluetooth low energy (BLE) beacons, and video monitoring and recording. As part of this effort, the Idaho National Laboratory (INL) collaborated with Xcel Energy Inc. to evaluate these technologies. During the research and development scope of the effort, INL engaged Xcel Energy Inc. periodically and exchanged valuable insight on the means to implement these technologies in a nuclear power plant. Multiple pilot prototypes were developed and tested in a user study conducted at Xcel Energy Inc. in Minneapolis, Minnesota. The outcome of this effort resulted in significant findings that included the detailed means to custom fit the technologies to fit the nuclear power industry need, and identifying and evaluating several applications of high economic or safety potential. The limitations and obstacles that could impact deployment of the technologies were also identified, and the means of how to address these limitations and obstacles were studied.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2016

Thermal Testing Quality Assurance of 24LCC & 3LCC Electronic Packages

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was manufactured with conformal coating along with and without an underfill material below the device. Conformal coating helps protect the board from environments such as electrostatic discharge and humidity. It is commonly used in broad types of engineering disciplines such as commercial, military, research and development, etc. Conformal coating can also pose a risk for the life of the board because of its high thermal expansion coefficient. This can greatly decrease the life of the product if it regularly sees high temperature variations. This leads to a shorter fatigue life of the solder. The fatigue life is a common mechanical problem in the field of electronic devices. Adding underfill can help increase the fatigue life of the solder. However, applying underfill adds time to manufacturing and production. This ultimately increases the cost per unit. The study of conformal coated printed circuit boards with and without underfill was done on two different surface mount electronic packages. The electronic packages studied were 24 and 3 contact Leadless Ceramic Chips packages. When the package was not underfilled, the coating was allowed to flow underneath. The assembly was analyzed and tested to obtain the best available combination of conformal coating, underfill, and potting to design the most robust and reliable circuit board while keeping in mind certain factors such as cost, manufacturing time, and need. Different types of conformal coatings were considered with and without underfill for each device. 29 of each component were manufactured to have a large sample size and for the sake of individual defects and imperfections. Finite Element Analysis (FEA) was performed by an engineer at Sandia National Laboratories for both Leadless Ceramic Chips. From the FEA results, a test acceleration profile was derived and the number of temperature cycles to fail the solder interconnects were found for three different cases. Experimentation was done as a secondary measure to validate this data to show confidence in the theoretical analysis. Accelerated testing functions as a quality check for the product. Accelerated testing is extremely useful in the research and development phase of engineering. It can save money from the potential of early life defects and the costs that come along with warranties. Accelerated testing makes a weaker design more robust and checks the reliability of a strong design in a shorter period of time. It is extremely helpful in a world where deliverables are in high demand and scheduling is tight. Accelerated testing helps the engineer gain an understanding of what needs to be improved and what works well. There are many different types of accelerated tests. Our circuit boards were accelerated inside a closed thermal chamber because of the high number of use cycles. The ultimate goal of this experimentation is to help identify what will prevent any premature cracking or fracturing in the solder alloy. It is important to understand that underfilling each component may or may not be needed. If underfill is not needed, there are several production benefits.

42 ENGINEERING↗

DOE OSTI2020

Evaluation of Hydrogen Gas Generation and Permeation in the 9979 Type AF Shipping Package

The 9979 Type AF Shipping Packaging is a cost-effective radioactive material package designed by Savannah River National Laboratory (SRNL) that consists of two primary components: a foamed outer drum for structural protection and an inner containment drum. The packaging was designed to transport Highly Enriched Uranium (HEU), Low Enriched Uranium (LEU), and other isotopes not exceeding a Type A quantity. These contents have the potential to generate flammable hydrogen gas during transport due to the degradation of hydrogenous materials (e.g. water vapor, plastics, etc) by high-energy alpha radiation. Since 10 CFR 71.43(h) prohibits the incorporation of packaging features explicitly designed for continuous venting, alternative justification was required to demonstrate that the requirements of 10 CFR 71.43(d) for negligible reactions between packaging components and contents were satisfied. An analysis was performed to demonstrate that the potential for hydrogen gas generation over a one-year period was limited by the effects of permeation through the packaging materials. The rate of hydrogen collection was evaluated for both the inner containment drum and the outer structural drum under 10 CFR 71.71 Normal Conditions of Transport (NCT). The analysis concludes that the Lower Flammability Limit (LFL) for hydrogen gas will not be reached in a one-year shipping period assuming a minimum void volume is maintained within the drum.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

DOE OSTI2023

Learning to Predict and Improve Build Successes in Package Ecosystems

Software has become increasingly complex, with a typical application depending on tens or hundreds of packages. Finding compatible versions and build configurations of these packages is challenging. This paper presents a method to learn the likelihood of software build success, and techniques for leveraging this information to guide dependency solvers to better software configurations. We leverage the heavily parameterized package recipes from the Spack package manager to produce a training data set of builds, and we use Graph Neural Networks to learn whether a given package configuration will build successfully or not. We apply our tool to the U.S. Exascale Computing Project’s software stack. We demonstrate its effectiveness in predicting whether a given package will build successfully. We show that our technique can be used to improve the solutions generated by dependency solvers, reducing the need for developers to find working builds by trial and error.

97 MATHEMATICS AND COMPUTING↗

NASA NTRS1972

On the stability and pointing of an attached double-gimbal experiment package

The pointing capability of a double gimbal experiment isolation and control system of the Apollo telescope mount (ATM) type was investigated. Three composite structural models of an experiment package connected through frictionless gimbals to a carrier vehicle (including a rigid package-rigid carrier model, a rigid package-flexible carrier model, and a flexible package-flexible carrier model) were used, and a linear model of the nominal ATM gimbal control system is considered. A linear stability analysis was performed to verify stability of the control system with nominal gains. Transform techniques were used to compute pointing errors onboard the experiment package due to random crew motions input into the carrier vehicle. Results of the investigation indicate that there is no stability problem due to flexible coupling of the experiment package and the carrier, and that the ATM-type system is capable of pointing accuracies better than 0.1 arc second.

Groom, N. J.↗

NASA NTRS1973

Apparatus and method for skin packaging articles

A system for skin packaging articles including a loading zone for positioning articles to be packaged upon a substrate, a thermoplastic film heating and vacuum operated skin packaging zone for covering the articles with film laminated to the substrate and a slitting zone for separating and trimming the individual skin packaged articles. The articles are passed to the successive zones. The loading zone may be adapted for conveyorized instead of hand loading. In some cases, where only transverse cutting of the film web is necessary, it may be desirable to eliminate the slitting zone and remove the skin packaged article or articles directly from the packaging zone. A conveniently located operating panel contains controls for effecting automatic, semiautomatic or manual operation of the entire system of any portions in any manner desired.

Madsen, B.↗

NASA NTRS1977

Reliability evaluation of hermetic dual in-line flat microcircuit packages

The relative strengths and weaknesses of 35 commonly used hermetic flat and dual in-line packages were determined and used to rank each of the packages according to a numerical weighting scheme for package attributes. The list of attributes included desirable features in five major areas: lead and lead seal, body construction, body materials, lid and lid seal, and marking. The metal flat pack and multilayer integral ceramic flat pack and DIP received the highest rankings, and the soft glass Cerdip and Cerpak types received the lowest rankings. Loss of package hermeticity due to lead and lid seal problems was found to be the predominant failure mode from the literature/data search. However, environmental test results showed that lead and lid seal failures due to thermal stressing was only a problem with the hard glass (Ceramic) body DIP utilizing a metal lid and/or bottom. Insufficient failure data were generated for the other package types tested to correlate test results with the package ranking.

Johnson, G. M.↗

NASA NTRS1985

Packaging for Food Service

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Stilwell, E. J.↗

NASA NTRS1987

Space station power semiconductor package

A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

Balodis, Vilnis↗

NASA NTRS1992

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

Shalkhauser, K. A.↗

NASA NTRS1993

Review and analysis of dense linear system solver package for distributed memory machines

A dense linear system solver package recently developed at the University of Texas at Austin for distributed memory machine (e.g. Intel Paragon) has been reviewed and analyzed. The package contains about 45 software routines, some written in FORTRAN, and some in C-language, and forms the basis for parallel/distributed solutions of systems of linear equations encountered in many problems of scientific and engineering nature. The package, being studied by the Computer Applications Branch of the Analysis and Computation Division, may provide a significant computational resource for NASA scientists and engineers in parallel/distributed computing. Since the package is new and not well tested or documented, many of its underlying concepts and implementations were unclear; our task was to review, analyze, and critique the package as a step in the process that will enable scientists and engineers to apply it to the solution of their problems. All routines in the package were reviewed and analyzed. Underlying theory or concepts which exist in the form of published papers or technical reports, or memos, were either obtained from the author, or from the scientific literature; and general algorithms, explanations, examples, and critiques have been provided to explain the workings of these programs. Wherever the things were still unclear, communications were made with the developer (author), either by telephone or by electronic mail, to understand the workings of the routines. Whenever possible, tests were made to verify the concepts and logic employed in their implementations. A detailed report is being separately documented to explain the workings of these routines.

Narang, H. N.↗

NASA NTRS2003

Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were installed in water-cooled jackets, as shown. This was a severe test because the pressure-sensing chips were exposed to the hot combustion gases. Prior to the installation of the SiC pressure sensors, two high-temperature silicon sensors, installed in the same locations, did not survive a single engine run. The durability of the leadless SiC pressure sensor was demonstrated when both SiC sensors operated properly throughout the two runs that were conducted.

Beheim, Glenn M.↗

NASA NTRS2006

Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

Kolacz, John S.↗

NASA NTRS2009

Comparative Packaging Study

Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

Perchonok, Michele H.↗

NASA NTRS2018

Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment

This paper presents experimental results of a prototype high temperature co-fired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with 60-day demonstration in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar pressure. The prototype package is based on previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor integrated circuits (ICs) at NASA Glenn Research Center in 500 degC Earth air ambient for over ten thousands hours, and short-term tested at temperatures above 800 degC. The three-phase harsh environment test started with 48 hours in 465 degC Earth air, followed by 48 hours in 465 degC nitrogen at 90 bar pressure and 1400 hours in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar. Initial analytical results of the package materials and surfaces after exposure to Venus environment are discussed to assess the stability of the packaging materials in the tested environments. The test in simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig (GEER). The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help to improve electrical performance of a HTCC alumina packaging system in Venus environment.

Chen, Liangyu↗