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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

PARAGRAPH: A graphics tool for performance and reliability analysis

PARAGRAPH is an animated graphics display package. It consists of two parts: an interface to CSIM (a process based simulation language) and a graphic display system. When a simulation model is executed on CSIM the interface collects pertinent performance analysis data and writes them to a file. This file is then fed to the graphic display system which depicts the execution of the simulation model visually. This report focuses on the graphical display system. Specifically it describes the user interface and features of the display system. It also explains how Interviews (which is based on X-windows) is used as the basis for the design of PARAGRAPH. The last section contains an example in which a basic load balancing simulation model is used to demonstrate the features and the capability of PARAGRAPH.

Lee, Kevin Douglas↗
NASA NTRS1999

Human Reliability Analysis: An Overview

Human/process error is potentially a large contributor to failures of aerospace systems. For some systems, such as the space shuttle main engine, large amounts of data are available, and accurate failure rates can be determined empirically. For such systems, the human error is implicit in the empirical failure rate and does not need to be quantified separately. However, for other systems, such as the solid rocket boosters, large amounts of data are not available and the failure rates must be determined by more theoretical means. When empirical data is lacking, structural models and engineering judgment must be employed. In this case, the human/process error must be modeled explicitly. An extensive literature review was performed to determine what methods already exist for modeling human error for aerospace systems. No methods that apply directly were found, although there are a number of methods that have been developed specifically for the nuclear power industry that could probably be modified for space applications. The results of the literature review are presented, as well as recommendations for future research.

Navard, Sharon E.↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
NASA NTRS2019

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗
DOE OSTI2020

GPU Lifetimes on Titan Supercomputer: Survival Analysis and Reliability

The Cray XK7 Titan was the top supercomputer system in the world for a long time and remained critically important throughout its nearly seven year life. It was an interesting machine from a reliability viewpoint as most of its power came from 18,688 GPUs whose operation was forced to execute three rework cycles, two on the GPU mechanical assembly and one on the GPU circuitboards. We write about the last rework cycle and a reliability analysis of over 100,000 years of GPU lifetimes during Titan’s 6-year-long productive period. Using time between failures analysis and statistical survival analysis techniques, we find that GPU reliability is dependent on heat dissipation to an extent that strongly correlates with detailed nuances of the cooling architecture and job scheduling. We describe the history, data collection, cleaning, and analysis and give recommendations for future supercomputing systems. We make the data and our analysis codes publicly available.

Ostrouchov, George↗
NASA NTRS2009

Bayes Analysis and Reliability Implications of Stress-Rupture Testing a Kevlar/Epoxy COPV Using Temperature and Pressure Acceleration

Composite Overwrapped Pressure Vessels (COPVs) that have survived a long service time under pressure generally must be recertified before service is extended. Flight certification is dependent on the reliability analysis to quantify the risk of stress rupture failure in existing flight vessels. Full certification of this reliability model would require a statistically significant number of lifetime tests to be performed and is impractical given the cost and limited flight hardware for certification testing purposes. One approach to confirm the reliability model is to perform a stress rupture test on a flight COPV. Currently, testing of such a Kevlar49 (Dupont)/epoxy COPV is nearing completion. The present paper focuses on a Bayesian statistical approach to analyze the possible failure time results of this test and to assess the implications in choosing between possible model parameter values that in the past have had significant uncertainty. The key uncertain parameters in this case are the actual fiber stress ratio at operating pressure, and the Weibull shape parameter for lifetime; the former has been uncertain due to ambiguities in interpreting the original and a duplicate burst test. The latter has been uncertain due to major differences between COPVs in the database and the actual COPVs in service. Any information obtained that clarifies and eliminates uncertainty in these parameters will have a major effect on the predicted reliability of the service COPVs going forward. The key result is that the longer the vessel survives, the more likely the more optimistic stress ratio model is correct. At the time of writing, the resulting effect on predicted future reliability is dramatic, increasing it by about one "nine," that is, reducing the predicted probability of failure by an order of magnitude. However, testing one vessel does not change the uncertainty on the Weibull shape parameter for lifetime since testing several vessels would be necessary.

Phoenix, S. Leigh↗
NASA NTRS1992

Advanced Rotorcraft Transmission program summary

The current status of the Advanced Rotorcraft Transmission (ART) program is reviewed. The discussion includes a general configuration and face gear description, weight analysis, stress analysis, reliability analysis, acoustic analysis, face gear testing, and planned torque split testing. Design descriptions include the face gear webs sized for equal stiffness, a positive engagement clutch, the lubrication system, and a high contact ratio planetary. Test results for five gear materials and three housing materials are presented.

Bossler, Robert B., Jr.↗
NASA NTRS1990

Generation and analysis of large reliability models

An effort has been underway for several years at NASA's Langley Research Center to extend the capability of Markov modeling techniques for reliability analysis to the designers of highly reliable avionic systems. This effort has been focused in the areas of increased model abstraction and increased computational capability. The reliability model generator (RMG), a software tool which uses as input a graphical, object-oriented block diagram of the system, is discussed. RMG uses an automated failure modes-effects analysis algorithm to produce the reliability model from the graphical description. Also considered is the ASSURE software tool, a parallel processing program which uses the ASSIST modeling language and SURE semi-Markov solution technique. An executable failure modes-effects analysis is used by ASSURE. The successful combination of the power of graphical representation, automated model generation, and parallel computation leads to the conclusion that large system architectures can now be analyzed.

Aerospace electronics↗